IL159199A0 - Multi-beam micro-machining system and method - Google Patents

Multi-beam micro-machining system and method

Info

Publication number
IL159199A0
IL159199A0 IL15919902A IL15919902A IL159199A0 IL 159199 A0 IL159199 A0 IL 159199A0 IL 15919902 A IL15919902 A IL 15919902A IL 15919902 A IL15919902 A IL 15919902A IL 159199 A0 IL159199 A0 IL 159199A0
Authority
IL
Israel
Prior art keywords
machining system
beam micro
micro
machining
Prior art date
Application number
IL15919902A
Other languages
English (en)
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of IL159199A0 publication Critical patent/IL159199A0/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/106—Beam splitting or combining systems for splitting or combining a plurality of identical beams or images, e.g. image replication
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/143—Beam splitting or combining systems operating by reflection only using macroscopically faceted or segmented reflective surfaces
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
IL15919902A 2001-06-13 2002-06-13 Multi-beam micro-machining system and method IL159199A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29745301P 2001-06-13 2001-06-13
PCT/IL2002/000461 WO2002101888A2 (en) 2001-06-13 2002-06-13 Multi-beam micro-machining system and method

Publications (1)

Publication Number Publication Date
IL159199A0 true IL159199A0 (en) 2004-06-01

Family

ID=23146371

Family Applications (1)

Application Number Title Priority Date Filing Date
IL15919902A IL159199A0 (en) 2001-06-13 2002-06-13 Multi-beam micro-machining system and method

Country Status (9)

Country Link
US (7) US7642484B2 (zh)
EP (1) EP1451907A4 (zh)
JP (2) JP4113495B2 (zh)
KR (4) KR100990300B1 (zh)
CN (1) CN1538893B (zh)
AU (1) AU2002311597A1 (zh)
IL (1) IL159199A0 (zh)
TW (1) TW574082B (zh)
WO (1) WO2002101888A2 (zh)

Families Citing this family (92)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7723642B2 (en) 1999-12-28 2010-05-25 Gsi Group Corporation Laser-based system for memory link processing with picosecond lasers
US7838794B2 (en) * 1999-12-28 2010-11-23 Gsi Group Corporation Laser-based method and system for removing one or more target link structures
US20030222324A1 (en) * 2000-01-10 2003-12-04 Yunlong Sun Laser systems for passivation or link processing with a set of laser pulses
US7671295B2 (en) * 2000-01-10 2010-03-02 Electro Scientific Industries, Inc. Processing a memory link with a set of at least two laser pulses
US20060141681A1 (en) * 2000-01-10 2006-06-29 Yunlong Sun Processing a memory link with a set of at least two laser pulses
US20070173075A1 (en) * 2001-03-29 2007-07-26 Joohan Lee Laser-based method and system for processing a multi-material device having conductive link structures
US6777645B2 (en) * 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
JP4113495B2 (ja) * 2001-06-13 2008-07-09 オーボテック リミテッド マルチビーム微細機械加工システム及び方法
EP1280007B1 (en) * 2001-07-24 2008-06-18 ASML Netherlands B.V. Imaging apparatus
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
DE60335611D1 (de) * 2002-03-19 2011-02-17 Lightwave Electronics Mountain View Phasenregelkreissteuerung passiv gütegeschalteter laser
US6951995B2 (en) 2002-03-27 2005-10-04 Gsi Lumonics Corp. Method and system for high-speed, precise micromachining an array of devices
US7563695B2 (en) 2002-03-27 2009-07-21 Gsi Group Corporation Method and system for high-speed precise laser trimming and scan lens for use therein
KR20030095313A (ko) * 2002-06-07 2003-12-18 후지 샤신 필름 가부시기가이샤 레이저 어닐링장치 및 레이저 박막형성장치
AU2003274671A1 (en) * 2002-10-28 2004-05-13 Orbotech Ltd. Selectable area laser assisted processing of substrates
JP2004259153A (ja) * 2003-02-27 2004-09-16 Canon Inc 情報処理装置とその制御方法及び制御プログラム
US6784400B1 (en) * 2003-03-03 2004-08-31 Paul S. Banks Method of short pulse hole drilling without a resultant pilot hole and backwall damage
DE10317363B3 (de) * 2003-04-15 2004-08-26 Siemens Ag Verfahren und Vorrichtung zum Bohren von Löchern in einem elektrischen Schaltungssubstrat
US6873398B2 (en) * 2003-05-21 2005-03-29 Esko-Graphics A/S Method and apparatus for multi-track imaging using single-mode beams and diffraction-limited optics
DE10339472A1 (de) * 2003-08-27 2005-03-24 Ralph Schmid Verfahren und Vorrichtung zur Laserbeschriftung
US7521651B2 (en) * 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
WO2005037478A2 (en) * 2003-10-17 2005-04-28 Gsi Lumonics Corporation Flexible scan field
JP2005144487A (ja) * 2003-11-13 2005-06-09 Seiko Epson Corp レーザ加工装置及びレーザ加工方法
DE10360640B4 (de) * 2003-12-23 2016-02-18 Jochen Strenkert Vorrichtung mit einer Einheit zum Betätigen einer verstellbaren Antriebseinheit eines Kraftfahrzeugs
US7885311B2 (en) * 2007-03-27 2011-02-08 Imra America, Inc. Beam stabilized fiber laser
US20060000811A1 (en) * 2004-06-30 2006-01-05 Matsushita Electric Industrial Co., Ltd. Diffractive optical element changer for versatile use in laser manufacturing
US7525654B2 (en) * 2004-10-20 2009-04-28 Duquesne University Of The Holy Spirit Tunable laser-based chemical imaging system
US20060191884A1 (en) * 2005-01-21 2006-08-31 Johnson Shepard D High-speed, precise, laser-based material processing method and system
US7391794B2 (en) * 2005-05-25 2008-06-24 Jds Uniphase Corporation Injection seeding of frequency-converted Q-switched laser
JP5030512B2 (ja) * 2005-09-30 2012-09-19 日立ビアメカニクス株式会社 レーザ加工方法
US7385768B2 (en) * 2005-11-22 2008-06-10 D + S Consulting, Inc. System, method and device for rapid, high precision, large angle beam steering
US7945087B2 (en) * 2006-06-26 2011-05-17 Orbotech Ltd. Alignment of printed circuit board targets
US8084706B2 (en) * 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
KR100791005B1 (ko) * 2006-12-01 2008-01-04 삼성전자주식회사 사입사 조건에서의 포토마스크의 투과율 측정장치 및 그를이용한 측정방법
JP2008212999A (ja) * 2007-03-06 2008-09-18 Disco Abrasive Syst Ltd レーザー加工装置
US7897924B2 (en) * 2007-04-12 2011-03-01 Imra America, Inc. Beam scanning imaging method and apparatus
DE102007024700A1 (de) * 2007-05-25 2008-12-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Materialbearbeitung mit Laserstrahlung sowie Vorrichtung zur Durchführung des Verfahrens
JP4880561B2 (ja) * 2007-10-03 2012-02-22 新光電気工業株式会社 フリップチップ実装装置
JP5259154B2 (ja) * 2007-10-24 2013-08-07 オリンパス株式会社 走査型レーザ顕微鏡
US9123114B2 (en) * 2007-12-06 2015-09-01 The United States Of America As Represented By The Secretary Of The Army System and processor implemented method for improved image quality and enhancement based on quantum properties
WO2009087638A2 (en) * 2008-01-10 2009-07-16 Orbotech Ltd. Multiple mirror calibration system
JP5274085B2 (ja) * 2008-04-09 2013-08-28 株式会社アルバック レーザー加工装置、レーザービームのピッチ可変方法、及びレーザー加工方法
DE102008022014B3 (de) * 2008-05-02 2009-11-26 Trumpf Laser- Und Systemtechnik Gmbh Dynamische Strahlumlenkung eines Laserstrahls
WO2009153792A2 (en) * 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
WO2010042858A1 (en) * 2008-10-10 2010-04-15 J.P. Sercel Associates Inc. Laser machining systems and methods with debris extraction
WO2010041262A2 (en) * 2008-10-12 2010-04-15 Utilight Ltd. Solar cells and method of manufacturing thereof
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
EP2463051A4 (en) * 2009-08-03 2017-06-14 Toshiba Kikai Kabushiki Kaisha Pulse laser machining apparatus and pulse laser machining method
KR100958745B1 (ko) * 2009-11-30 2010-05-19 방형배 레이저를 이용한 스크라이빙 장치, 방법 및 스크라이빙 헤드
WO2011100041A1 (en) * 2009-12-30 2011-08-18 Resonetics Llc Laser machining system and method for machining three-dimensional objects from a plurality of directions
US9035673B2 (en) * 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
US20120102907A1 (en) 2010-10-28 2012-05-03 Dole Fresh Vegetables, Inc. Mechanical Produce Harvester
JP5727518B2 (ja) * 2011-01-05 2015-06-03 清之 近藤 ビーム加工装置
US8312701B1 (en) 2011-06-10 2012-11-20 Dole Fresh Vegetables, Inc. Decoring mechanism with mechanized harvester
US20130020291A1 (en) * 2011-07-19 2013-01-24 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
US9434025B2 (en) 2011-07-19 2016-09-06 Pratt & Whitney Canada Corp. Laser drilling methods of shallow-angled holes
ES2544034T3 (es) 2011-09-05 2015-08-27 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con al menos un láser de gas y un termodisipador
EP2564975B1 (en) * 2011-09-05 2014-12-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of lasers and individually adjustable sets of deflection means
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
ES2530069T3 (es) * 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y un dispositivo de desviación de combinación
ES2544269T3 (es) * 2011-09-05 2015-08-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente
ES2444504T3 (es) 2011-09-05 2014-02-25 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo láser con una unidad láser, y un recipiente de fluido para medios de refrigeración de dicha unidad láser
EP2564972B1 (en) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam
EP2565673B1 (en) 2011-09-05 2013-11-13 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Device and method for marking of an object by means of a laser beam
EP2795392B1 (en) * 2011-12-22 2018-07-04 Intel Corporation Configuration of acousto-optic deflectors for laser beam scanning
CN103379681B (zh) * 2012-04-28 2016-03-30 清华大学 加热垫
US9279722B2 (en) 2012-04-30 2016-03-08 Agilent Technologies, Inc. Optical emission system including dichroic beam combiner
DE102013206363A1 (de) * 2013-04-11 2014-10-16 Tesa Scribos Gmbh Scanvorrichtung
JP2015025901A (ja) * 2013-07-25 2015-02-05 船井電機株式会社 レーザ走査装置
US11536956B2 (en) 2013-11-25 2022-12-27 Preco, Llc High density galvo housing for use with multiple laser beams
US10239155B1 (en) * 2014-04-30 2019-03-26 The Boeing Company Multiple laser beam processing
US9269149B2 (en) 2014-05-08 2016-02-23 Orbotech Ltd. Calibration of a direct-imaging system
CN106537899B (zh) 2014-05-15 2022-01-18 Mtt创新公司 优化用于多投影仪系统的驱动方案
US20150343560A1 (en) * 2014-06-02 2015-12-03 Fracturelab, Llc Apparatus and method for controlled laser heating
JP6791840B2 (ja) * 2014-08-14 2020-11-25 エムティティ イノベーション インコーポレイテッドＭｔｔ Ｉｎｎｏｖａｔｉｏｎ Ｉｎｃｏｒｐｏｒａｔｅｄ 光源
EP3207417B1 (en) * 2014-10-15 2019-05-01 Institut National De La Sante Et De La Recherche Medicale Method for determining the characteristics of a system for generating a spatial light modulation in phase and amplitude at high refresh rate
US9855626B2 (en) * 2015-01-29 2018-01-02 Rohr, Inc. Forming a pattern of apertures in an object with a plurality of laser beams
KR101586219B1 (ko) * 2015-07-02 2016-01-19 대륭포장산업 주식회사 Uv 레이저를 이용한 통기성 필름 제조 장치
HUE064074T2 (hu) * 2016-11-18 2024-02-28 Ipg Photonics Corp Összeállítás és eljárás anyagok lézeres feldolgozására
KR102618163B1 (ko) * 2016-12-05 2023-12-27 삼성디스플레이 주식회사 레이저 가공 장치
WO2019197341A1 (en) * 2018-04-10 2019-10-17 Talens Systems, S.L.U. Apparatus and method for processing cardboard
WO2020159666A1 (en) * 2019-01-31 2020-08-06 Electro Scientific Industries, Inc. Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same
US20220121082A1 (en) * 2019-03-06 2022-04-21 Orbotech Ltd. High-Speed Dynamic Beam Shaping
WO2020200530A1 (en) 2019-03-29 2020-10-08 Mycronic AB Long sweep length duv microlithographic beam scanning acousto-optical deflector and optics design
DE102019115554A1 (de) * 2019-06-07 2020-12-10 Bystronic Laser Ag Bearbeitungsvorrichtung zur Laserbearbeitung eines Werkstücks und Verfahren zur Laserbearbeitung eines Werkstücks
DE102020102077B4 (de) 2020-01-29 2022-03-31 Pulsar Photonics Gmbh Laserbearbeitungsvorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks
BE1027700B1 (fr) * 2020-04-24 2021-05-18 Laser Eng Applications Dispositif pour un système optique d’usinage laser
DE102020134422A1 (de) * 2020-12-21 2022-06-23 Trumpf Laser Gmbh Vorrichtung zur Strahlbeeinflussung eines Laserstrahls
FR3121760B1 (fr) * 2021-04-12 2023-12-29 Commissariat Energie Atomique Dispositif reflecteur destine a emettre une pluralite de faisceaux reflechis a partir d’un unique faisceau lumineux principal
TW202319163A (zh) * 2021-09-15 2023-05-16 南韓商Ｅｏ科技股份有限公司 溝槽形成裝置
FR3128140A1 (fr) 2021-10-19 2023-04-21 SteeLEMAT S.à r.l Dispositif de test non destructif à ultrasons hybride Transducteurs électromagnétiques acoustiques/Laser à assemblage optique rotatif monolithique de transmetteurs laser agiles matriciels pour le contrôle d'objets métallurgiques

Family Cites Families (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10A (en) * 1836-08-10 Gtttlslto andi
US3594081A (en) 1968-11-04 1971-07-20 Werner Tschink Adjustable illuminating device
US4060322A (en) * 1974-07-10 1977-11-29 Canon Kabushiki Kaisha Image information handling device
US4038108A (en) * 1976-05-10 1977-07-26 Union Carbide Corporation Method and apparatus for making an instantaneous thermochemical start
US4279472A (en) * 1977-12-05 1981-07-21 Street Graham S B Laser scanning apparatus with beam position correction
JPS5581095A (en) * 1978-12-12 1980-06-18 Ricoh Co Ltd Ultra-fine hole processing method
US4258468A (en) 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
DE3138745A1 (de) 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München Akustooptischer lichtablenker mit hoher aufloesung
GB2138584B (en) 1983-04-23 1986-09-17 Standard Telephones Cables Ltd Acousto-optic deflector systems
US4447291A (en) 1983-08-31 1984-05-08 Texas Instruments Incorporated Method for via formation in HgCdTe
US4950962A (en) * 1985-05-20 1990-08-21 Quantum Diagnostics, Ltd. High voltage switch tube
GB2187592B (en) 1985-12-26 1989-10-18 Yokogawa Electric Corp Semiconductor laser wavelength stabilizer
US4838631A (en) 1986-12-22 1989-06-13 General Electric Company Laser beam directing system
JPH01316415A (ja) * 1988-06-17 1989-12-21 Nippon Steel Corp ポリゴンミラーを用いたレーザ熱処理装置及び方法
JP2663560B2 (ja) 1988-10-12 1997-10-15 日本電気株式会社 レーザ加工装置
JPH082511B2 (ja) 1989-05-08 1996-01-17 松下電器産業株式会社 レーザ加工装置
JPH03142092A (ja) 1989-10-25 1991-06-17 Matsushita Electric Ind Co Ltd レーザ光学系及びこれを用いたレーザ加工方法
US5302798A (en) 1991-04-01 1994-04-12 Canon Kabushiki Kaisha Method of forming a hole with a laser and an apparatus for forming a hole with a laser
US5309178A (en) * 1992-05-12 1994-05-03 Optrotech Ltd. Laser marking apparatus including an acoustic modulator
US5475416A (en) * 1992-06-03 1995-12-12 Eastman Kodak Company Printing system for printing an image with lasers emitting diverging laser beams
US5408553A (en) 1992-08-26 1995-04-18 The United States Of America As Represented By The United States Department Of Energy Optical power splitter for splitting high power light
JP3293136B2 (ja) 1993-06-04 2002-06-17 セイコーエプソン株式会社 レーザ加工装置及びレーザ加工方法
US5404247A (en) 1993-08-02 1995-04-04 International Business Machines Corporation Telecentric and achromatic f-theta scan lens system and method of use
US5460921A (en) 1993-09-08 1995-10-24 International Business Machines Corporation High density pattern template: materials and processes for the application of conductive pastes
US6037968A (en) * 1993-11-09 2000-03-14 Markem Corporation Scanned marking of workpieces
US6480334B1 (en) * 1994-01-18 2002-11-12 Massachusetts Institute Of Technology Agile beam steering using phased-array-like elements
DE19513354A1 (de) 1994-04-14 1995-12-14 Zeiss Carl Materialbearbeitungseinrichtung
EP0683007B1 (de) 1994-04-14 1998-05-20 Carl Zeiss Materialbearbeitungseinrichtung
US5593606A (en) 1994-07-18 1997-01-14 Electro Scientific Industries, Inc. Ultraviolet laser system and method for forming vias in multi-layered targets
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US5614114A (en) 1994-07-18 1997-03-25 Electro Scientific Industries, Inc. Laser system and method for plating vias
JPH08108289A (ja) 1994-10-07 1996-04-30 Sumitomo Electric Ind Ltd レーザ加工用光学装置
US5674414A (en) * 1994-11-11 1997-10-07 Carl-Zeiss Stiftung Method and apparatus of irradiating a surface of a workpiece with a plurality of beams
JPH08243765A (ja) 1995-03-07 1996-09-24 Komatsu Ltd レーザ刻印装置
US5585019A (en) 1995-03-10 1996-12-17 Lumonics Inc. Laser machining of a workpiece through adjacent mask by optical elements creating parallel beams
US6373026B1 (en) 1996-07-31 2002-04-16 Mitsubishi Denki Kabushiki Kaisha Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
KR100198832B1 (ko) * 1995-12-28 1999-06-15 김덕중 레이저 빔을 이용한 용접장치
DE19707834A1 (de) 1996-04-09 1997-10-16 Zeiss Carl Fa Materialbestrahlungsgerät und Verfahren zum Betrieb von Materialbestrahlungsgeräten
US5948288A (en) 1996-05-28 1999-09-07 Komag, Incorporated Laser disk texturing apparatus
US5837962A (en) 1996-07-15 1998-11-17 Overbeck; James W. Faster laser marker employing acousto-optic deflection
DE19734983A1 (de) * 1996-09-04 1998-03-05 Zeiss Carl Fa Optische Anordnung
AT407312B (de) * 1996-11-20 2001-02-26 Sez Semiconduct Equip Zubehoer Rotierbarer träger für kreisrunde, scheibenförmige gegenstände, insbesondere halbleiterwafer oder -substrate
US6233044B1 (en) 1997-01-21 2001-05-15 Steven R. J. Brueck Methods and apparatus for integrating optical and interferometric lithography to produce complex patterns
US6040552A (en) 1997-01-30 2000-03-21 Jain; Kanti High-speed drilling system for micro-via pattern formation, and resulting structure
US5973290A (en) 1997-02-26 1999-10-26 W. L. Gore & Associates, Inc. Laser apparatus having improved via processing rate
US5948291A (en) 1997-04-29 1999-09-07 General Scanning, Inc. Laser beam distributor and computer program for controlling the same
KR100446052B1 (ko) 1997-05-15 2004-10-14 스미도모쥬기가이고교 가부시키가이샤 다수의갈바노스캐너를사용한레이저빔가공장치
US6172331B1 (en) * 1997-09-17 2001-01-09 General Electric Company Method and apparatus for laser drilling
US5933216A (en) 1997-10-16 1999-08-03 Anvik Corporation Double-sided patterning system using dual-wavelength output of an excimer laser
US5969877A (en) 1997-11-26 1999-10-19 Xerox Corporation Dual wavelength F-theta scan lens
DE19801364A1 (de) 1998-01-16 1999-07-22 Zeiss Carl Fa Werkstückbestrahlungsanlage
JP3324982B2 (ja) 1998-03-26 2002-09-17 松下電工株式会社 回路板の製造方法
US6037564A (en) * 1998-03-31 2000-03-14 Matsushita Electric Industrial Co., Ltd. Method for scanning a beam and an apparatus therefor
IL141487A (en) 1998-08-20 2004-07-25 Orbotech Ltd Laser repetition rate multiplier
US6313918B1 (en) 1998-09-18 2001-11-06 Zygo Corporation Single-pass and multi-pass interferometery systems having a dynamic beam-steering assembly for measuring distance, angle, and dispersion
US6252667B1 (en) 1998-09-18 2001-06-26 Zygo Corporation Interferometer having a dynamic beam steering assembly
JP3945951B2 (ja) * 1999-01-14 2007-07-18 日立ビアメカニクス株式会社 レーザ加工方法およびレーザ加工機
DE60038400T2 (de) * 1999-04-02 2009-04-23 Murata Mfg. Co., Ltd., Nagaokakyo-shi Laserverfahren zur Bearbeitung von Löchern nur in einer keramischen Grünfolie mit einem Trägerfilm
EP1173303A1 (en) 1999-04-27 2002-01-23 GSI Lumonics Inc. A system and method for material processing using multiple laser beams
JP3346374B2 (ja) 1999-06-23 2002-11-18 住友電気工業株式会社 レーザ穴開け加工装置
US6295171B1 (en) 1999-07-09 2001-09-25 Advanced Optical Technologies, Inc. Piezoelectric light beam deflector
EP1072350A1 (de) 1999-07-12 2001-01-31 MDC Max Dätwyler AG Bleienbach Verfahren zur Erzeugung einer Intensitätsverteilung über einen Arbeitslaserstrahl sowie Vorrichtung hierzu
CN1376100A (zh) 1999-09-28 2002-10-23 住友重机械工业株式会社 激光钻孔的加工方法及其加工装置
JP2001102886A (ja) * 1999-09-30 2001-04-13 Seiko Epson Corp 圧電振動素子の電極形成方法及び圧電振動素子の電極形成装置
US6310701B1 (en) 1999-10-08 2001-10-30 Nanovia Lp Method and apparatus for ablating high-density array of vias or indentation in surface of object
US6420675B1 (en) 1999-10-08 2002-07-16 Nanovia, Lp Control system for ablating high-density array of vias or indentation in surface of object
JP2003516625A (ja) 1999-12-07 2003-05-13 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 波長切り換え可能なレーザーにもとづいてエッチングした回路ボードの処理システム
US6423935B1 (en) 2000-02-18 2002-07-23 The Regents Of The University Of California Identification marking by means of laser peening
US6386992B1 (en) * 2000-05-04 2002-05-14 Acushnet Company Golf ball compositions including microcellular materials and methods for making same
US6696008B2 (en) 2000-05-25 2004-02-24 Westar Photonics Inc. Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation
US6605796B2 (en) 2000-05-25 2003-08-12 Westar Photonics Laser beam shaping device and apparatus for material machining
JP4228552B2 (ja) * 2000-07-04 2009-02-25 宇部興産株式会社 １，５，９−シクロドデカトリエンのエポキシ化反応混合液の精製処理方法
US6329634B1 (en) 2000-07-17 2001-12-11 Carl-Zeiss-Stiftung Workpiece irradiation system
US6566627B2 (en) * 2000-08-11 2003-05-20 Westar Photonics, Inc. Laser method for shaping of optical lenses
US6491361B1 (en) * 2000-11-09 2002-12-10 Encad, Inc. Digital media cutter
US6515257B1 (en) * 2001-03-26 2003-02-04 Anvik Corporation High-speed maskless via generation system
US6777645B2 (en) 2001-03-29 2004-08-17 Gsi Lumonics Corporation High-speed, precision, laser-based method and system for processing material of one or more targets within a field
JP4113495B2 (ja) * 2001-06-13 2008-07-09 オーボテック リミテッド マルチビーム微細機械加工システム及び方法
US6674564B2 (en) 2001-06-15 2004-01-06 Maniabarco, Inc. System, method and article of manufacture for a beam splitting acousto-optical modulator
JP4777826B2 (ja) * 2006-05-25 2011-09-21 日本碍子株式会社 シート加工機

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JP2008207247A (ja) 2008-09-11
KR100992262B1 (ko) 2010-11-05
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EP1451907A4 (en) 2007-05-09
CN1538893A (zh) 2004-10-20
KR20040060853A (ko) 2004-07-06
US20030042230A1 (en) 2003-03-06
KR20090108653A (ko) 2009-10-15
US20030024912A1 (en) 2003-02-06
AU2002311597A1 (en) 2002-12-23
US7633036B2 (en) 2009-12-15
US6809290B2 (en) 2004-10-26
US20030019854A1 (en) 2003-01-30
KR100938325B1 (ko) 2010-01-22
TW574082B (en) 2004-02-01
KR20090108651A (ko) 2009-10-15
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WO2002101888A3 (en) 2004-05-13
US7642484B2 (en) 2010-01-05
US20030047546A1 (en) 2003-03-13
EP1451907A2 (en) 2004-09-01
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US7629555B2 (en) 2009-12-08
CN1538893B (zh) 2012-01-04
US20040056009A1 (en) 2004-03-25
KR20090108652A (ko) 2009-10-15
US7176409B2 (en) 2007-02-13
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WO2002101888A2 (en) 2002-12-19
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US20060146395A1 (en) 2006-07-06
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