IL136344A0 - Curable epoxy-based compositions - Google Patents

Curable epoxy-based compositions

Info

Publication number
IL136344A0
IL136344A0 IL13634499A IL13634499A IL136344A0 IL 136344 A0 IL136344 A0 IL 136344A0 IL 13634499 A IL13634499 A IL 13634499A IL 13634499 A IL13634499 A IL 13634499A IL 136344 A0 IL136344 A0 IL 136344A0
Authority
IL
Israel
Prior art keywords
curable epoxy
based compositions
compositions
curable
epoxy
Prior art date
Application number
IL13634499A
Other languages
English (en)
Original Assignee
Loctite R & D Ltd
Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Loctite R & D Ltd, Loctite Corp filed Critical Loctite R & D Ltd
Publication of IL136344A0 publication Critical patent/IL136344A0/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
IL13634499A 1998-01-16 1999-01-14 Curable epoxy-based compositions IL136344A0 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IE980028 1998-01-16
US9545898P 1998-08-06 1998-08-06
PCT/IE1999/000001 WO1999036484A1 (en) 1998-01-16 1999-01-14 Curable epoxy-based compositions

Publications (1)

Publication Number Publication Date
IL136344A0 true IL136344A0 (en) 2001-05-20

Family

ID=26320151

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13634499A IL136344A0 (en) 1998-01-16 1999-01-14 Curable epoxy-based compositions

Country Status (12)

Country Link
EP (1) EP1047744B1 (OSRAM)
JP (1) JP4394281B2 (OSRAM)
KR (1) KR100573326B1 (OSRAM)
CN (1) CN1165592C (OSRAM)
AU (1) AU740553B2 (OSRAM)
BR (1) BR9906962A (OSRAM)
CA (1) CA2318167A1 (OSRAM)
DE (1) DE69903256T2 (OSRAM)
IL (1) IL136344A0 (OSRAM)
MY (1) MY132966A (OSRAM)
TW (1) TWI239968B (OSRAM)
WO (1) WO1999036484A1 (OSRAM)

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JP3868179B2 (ja) * 1999-08-02 2007-01-17 住友ベークライト株式会社 液状封止樹脂組成物、半導体装置の製造方法及び半導体装置
US20030082385A1 (en) * 2001-07-13 2003-05-01 Toray Composites (America), Inc. Quick cure carbon fiber reinforced epoxy resin
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US6818680B2 (en) * 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
DE102004049717A1 (de) * 2004-10-11 2006-04-13 Henkel Kgaa Alterungsbeständige Beschichtungen und Klebeverbunde
KR100613870B1 (ko) * 2005-05-04 2006-08-17 주식회사 덕수엔지니어링 흡입공기를 이용한 옥내 수도관 보수용 에폭시 수지 조성물
KR101148051B1 (ko) * 2005-12-26 2012-05-25 에스케이케미칼주식회사 에폭시 수지 조성물
JP4938539B2 (ja) * 2007-04-24 2012-05-23 凸版印刷株式会社 アルカリ現像型樹脂、フォトスペーサ用感光性樹脂組成物、及びこれを用いた液晶表示装置用基板
CN101418206B (zh) * 2007-10-22 2012-06-20 财团法人工业技术研究院 发光二极管的封装材料组成物
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US20110031000A1 (en) * 2008-03-31 2011-02-10 Sumitomo Bakelite Co., Ltd. Resin composition, carrier material with resin, multi-layered printed circuit board, and semiconductor device
CN103189412A (zh) * 2010-11-05 2013-07-03 汉高爱尔兰有限公司 具有改善的稳定性的环氧-硫醇组合物
US20120219777A1 (en) * 2011-02-24 2012-08-30 Isola Usa Corp. Ultrathin Laminates
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CN104024364B (zh) * 2011-10-11 2017-07-25 汉高股份有限及两合公司 可控制凝胶时间的双组份环氧粘合剂
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MY170660A (en) * 2011-12-14 2019-08-26 Mitsui Chemicals Tohcello Inc Adhesive resin composition, laminate, and self-stripping method
EP2791144B1 (en) 2011-12-16 2016-02-24 3M Innovative Properties Company of 3M Center Mercapto-containing bisanhydrohexitol derivatives and uses thereof
KR101328297B1 (ko) * 2011-12-22 2013-11-14 삼성전기주식회사 Ｈｄｄ 모터용 접착수지 조성물 및 이를 이용한 ｈｄｄ용 모터
CN103305132B (zh) * 2012-03-06 2015-03-25 上海佑威新材料科技有限公司 一种快速固化结构胶粘剂及其制备方法
EP2671716A1 (en) 2012-06-08 2013-12-11 Hexcel Composites SASU Low density composite materials, their production and use
PL2870190T3 (pl) 2012-07-03 2019-07-31 3M Innovative Properties Company Sposób wytwarzania hybrydowych wyrobów przylepnych o zróżnicowanej strukturze
JP6246366B2 (ja) * 2013-08-12 2017-12-13 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ 力学応答性組成物
KR101509483B1 (ko) * 2013-09-26 2015-04-08 주식회사 신광화학산업 금속과 수지의 이종 재질간 고접착력이 유지되는 이중 경화형 에폭시 접착제 조성물을 이용한 금속과 수지의 접착 방법
US10221282B2 (en) 2015-03-12 2019-03-05 Namics Corporation Resin composition, adhesive agent, and sealing agent
EP3337842A4 (en) * 2015-08-19 2019-06-26 Henkel IP & Holding GmbH FLUXES OF SUPPLEMENTARY COMPOSITIONS
WO2017077928A1 (ja) * 2015-11-04 2017-05-11 三菱レイヨン株式会社 硬化性組成物、接着剤、コーティング層を有する物品、繊維強化複合材料、ポッティング剤および硬化性組成物キット
US11416046B2 (en) * 2015-11-05 2022-08-16 Henkel Ag & Co. Kgaa Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
JP6370327B2 (ja) * 2016-03-30 2018-08-08 株式会社タムラ製作所 ジェットディスペンサー用はんだ組成物
JP7019715B2 (ja) * 2016-12-13 2022-02-15 スリーエム イノベイティブ プロパティズ カンパニー 置換バルビツール酸を使用するエポキシ安定化
US11053348B2 (en) * 2017-02-15 2021-07-06 3M Innovative Properties Company Epoxy stabilization using metal nanoparticles and nitrogen-containing catalysts, and methods
US20200165490A1 (en) * 2017-06-12 2020-05-28 3M Innovative Properties Company Epoxy/thiol resin compositions, methods, and tapes
KR102344683B1 (ko) 2017-09-04 2021-12-30 삼성디스플레이 주식회사 표시 장치용 차폐 잉크층 및 그 제조 방법
US11884850B2 (en) 2017-09-15 2024-01-30 3M Innovative Properties Company Adhesive film including a (meth)acrylate matrix including a curable epoxy/thiol resin composition, tape, and method
CN107936477B (zh) * 2017-12-02 2020-05-22 常州宝利美石墨烯有限公司 一种石墨烯/环氧树脂复合高分子材料
CN107955134B (zh) * 2017-12-02 2020-05-19 常州宝利美石墨烯有限公司 一种石墨烯在环氧树脂复合材料中的应用
CN107974043B (zh) * 2017-12-02 2020-01-14 常州宝利美石墨烯有限公司 一种石墨烯/环氧树脂复合高分子材料的制备方法
PH12020500618B1 (en) 2018-01-30 2024-02-21 Namics Corp Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
US11197246B2 (en) 2018-08-02 2021-12-07 At&T Intellectual Property I, L.P. Power control enhancements for multi-hop integrated access and backhaul
US12559587B2 (en) 2018-11-19 2026-02-24 3M Innovative Properties Company Polymer comprising hydroxy groups and tertiary amine groups suitable for use as a catalyst
EP3883999A1 (en) 2018-11-19 2021-09-29 3M Innovative Properties Company Composition including a polythiol, a polyepoxide, a polymeric catalyst, and a conductive filler and methods relating to the composition
KR102188113B1 (ko) * 2019-06-04 2020-12-07 전남대학교산학협력단 나린제닌을 포함하는 열경화성 고분자 소재 및 이의 제조방법
DE102019121195A1 (de) * 2019-08-06 2021-02-11 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung
CN112752783B (zh) * 2019-08-21 2022-08-02 纳美仕有限公司 环氧树脂组合物
KR102242440B1 (ko) * 2019-11-25 2021-04-20 주식회사 케이씨씨 접착제 조성물
CN112409972A (zh) * 2020-12-02 2021-02-26 苏州瑞力博新材科技有限公司 一种以苯醌为稳定剂的低温快速固化单组分环氧电子胶
FR3117493B1 (fr) * 2020-12-11 2024-02-02 Commissariat Energie Atomique Résines phtalonitriles spécifiques pour applications à hautes températures et procédés de préparation de celles-ci
CN113088224B (zh) * 2021-02-26 2022-11-29 广东美的白色家电技术创新中心有限公司 应用于封装产品的保护组合物、功率模块及其制备方法
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JPS61159417A (ja) * 1984-12-29 1986-07-19 Semedain Kk 硬化性エポキシ樹脂組成物
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Also Published As

Publication number Publication date
AU740553B2 (en) 2001-11-08
KR20010034183A (ko) 2001-04-25
JP4394281B2 (ja) 2010-01-06
WO1999036484A1 (en) 1999-07-22
CN1288481A (zh) 2001-03-21
AU1981199A (en) 1999-08-02
CA2318167A1 (en) 1999-07-22
KR100573326B1 (ko) 2006-04-24
JP2002509178A (ja) 2002-03-26
CN1165592C (zh) 2004-09-08
BR9906962A (pt) 2000-10-10
DE69903256D1 (de) 2002-11-07
EP1047744A1 (en) 2000-11-02
TWI239968B (en) 2005-09-21
EP1047744B1 (en) 2002-10-02
MY132966A (en) 2007-10-31
DE69903256T2 (de) 2003-08-07

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