IL110813A - Method and system for depositing copper on a substrate - Google Patents
Method and system for depositing copper on a substrateInfo
- Publication number
- IL110813A IL110813A IL110813A IL11081394A IL110813A IL 110813 A IL110813 A IL 110813A IL 110813 A IL110813 A IL 110813A IL 11081394 A IL11081394 A IL 11081394A IL 110813 A IL110813 A IL 110813A
- Authority
- IL
- Israel
- Prior art keywords
- hydroxide
- acid
- salt
- solution
- activator
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Chemical Vapour Deposition (AREA)
- Medicinal Preparation (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/153,548 US5419926A (en) | 1993-11-22 | 1993-11-22 | Ammonia-free deposition of copper by disproportionation |
Publications (2)
Publication Number | Publication Date |
---|---|
IL110813A0 IL110813A0 (en) | 1994-11-11 |
IL110813A true IL110813A (en) | 1998-06-15 |
Family
ID=22547667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL110813A IL110813A (en) | 1993-11-22 | 1994-08-29 | Method and system for depositing copper on a substrate |
Country Status (32)
Country | Link |
---|---|
US (1) | US5419926A (fi) |
EP (1) | EP0730500B1 (fi) |
JP (1) | JP3372256B2 (fi) |
KR (1) | KR100330632B1 (fi) |
CN (1) | CN1082842C (fi) |
AT (1) | ATE201337T1 (fi) |
AU (1) | AU676949B2 (fi) |
BG (1) | BG100606A (fi) |
BR (1) | BR9408092A (fi) |
CA (1) | CA2175909C (fi) |
CZ (1) | CZ289089B6 (fi) |
DE (1) | DE69427307T2 (fi) |
DK (1) | DK0730500T3 (fi) |
ES (1) | ES2158904T3 (fi) |
FI (1) | FI104270B (fi) |
GR (1) | GR3036329T3 (fi) |
HU (1) | HU216336B (fi) |
IL (1) | IL110813A (fi) |
MY (1) | MY114660A (fi) |
NO (1) | NO962085D0 (fi) |
NZ (1) | NZ274723A (fi) |
PH (1) | PH31318A (fi) |
PL (1) | PL314589A1 (fi) |
PT (1) | PT730500E (fi) |
RO (1) | RO113871B1 (fi) |
RU (1) | RU2118568C1 (fi) |
SA (1) | SA94150179A (fi) |
SK (1) | SK283024B6 (fi) |
TW (1) | TW342415B (fi) |
UA (1) | UA44259C2 (fi) |
WO (1) | WO1995014538A1 (fi) |
ZA (1) | ZA946707B (fi) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3208410B2 (ja) | 1997-04-07 | 2001-09-10 | 奥野製薬工業株式会社 | 非導電性プラスチック成形品への電気めっき方法 |
US6017580A (en) | 1998-08-28 | 2000-01-25 | Lilly Industries, (Usa), Inc. | Silver film incorporating protective insoluble metallic salt precipitate |
MY128333A (en) | 1998-09-14 | 2007-01-31 | Ibiden Co Ltd | Printed wiring board and its manufacturing method |
EP1020543A1 (en) * | 1999-01-15 | 2000-07-19 | Interuniversitair Micro-Elektronica Centrum Vzw | Deposition of copper on an activated surface of a substrate |
JP3444276B2 (ja) * | 2000-06-19 | 2003-09-08 | 株式会社村田製作所 | 無電解銅めっき浴、無電解銅めっき方法および電子部品 |
US6979478B1 (en) | 2002-08-01 | 2005-12-27 | Hilemn, Llc | Paint for silver film protection and method |
EP1876262A1 (en) * | 2006-07-07 | 2008-01-09 | Rohm and Haas Electronic Materials, L.L.C. | Environmentally friendly electroless copper compositions |
TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
TWI347373B (en) * | 2006-07-07 | 2011-08-21 | Rohm & Haas Elect Mat | Formaldehyde free electroless copper compositions |
TWI347982B (en) * | 2006-07-07 | 2011-09-01 | Rohm & Haas Elect Mat | Improved electroless copper compositions |
JP4687599B2 (ja) * | 2006-07-26 | 2011-05-25 | 住友金属鉱山株式会社 | 銅微粉とその製造方法及び導電性ペースト |
ES2402317B1 (es) * | 2011-09-26 | 2013-12-26 | Abengoa Solar New Technologies S.A. | Procedimiento de trabajo de un sistema de espejado parcial de tubos de vidrio y dicho sistema. |
WO2014098064A1 (ja) | 2012-12-21 | 2014-06-26 | 奥野製薬工業株式会社 | 導電性皮膜形成浴 |
US9951433B2 (en) | 2014-01-27 | 2018-04-24 | Okuno Chemical Industries Co., Ltd. | Conductive film-forming bath |
CN109797387B (zh) * | 2019-01-24 | 2020-11-06 | 山东科技大学 | 金属表面纳米铜\微合金层自润滑耐磨蚀复合改性方法 |
CN110102778B (zh) * | 2019-06-14 | 2021-11-02 | 珠海银波科技发展有限公司 | 一种低温烧结高结晶度银粉的制备方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2977244A (en) * | 1958-02-01 | 1961-03-28 | Pilkington Brothers Ltd | Method of depositing metallic copper |
US2967112A (en) * | 1958-03-11 | 1961-01-03 | Pilkington Brothers Ltd | Method and apparatus for applying metal-depositing solutions |
US3033703A (en) * | 1958-12-08 | 1962-05-08 | Photocircuits Corp | Electroless plating of copper |
US3093509A (en) * | 1959-09-28 | 1963-06-11 | Wein Samuel | Process for making copper films |
US3257215A (en) * | 1963-06-18 | 1966-06-21 | Day Company | Electroless copper plating |
US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
BE795373A (fr) * | 1972-07-13 | 1973-08-13 | London Laboratories | Procede et produit pour deposer de l'argent metallique sans apport de courant electrique exterieur |
US3963842A (en) * | 1974-06-20 | 1976-06-15 | London Laboratories Limited Co. | Deposition of copper |
US3983266A (en) * | 1974-10-09 | 1976-09-28 | Peacock Laboratories, Inc. | Method for applying metallic silver to a substrate |
US4315055A (en) * | 1976-12-29 | 1982-02-09 | Ppg Industries, Inc. | Direct electroless deposition of cuprous oxide films |
US4192686A (en) * | 1977-10-11 | 1980-03-11 | London Laboratories Limited Co. | Compositions and method for inhibiting formation of explosive compounds and conditions in silvering concentrates for electroless deposition of silver |
US4220678A (en) * | 1978-08-17 | 1980-09-02 | Nathan Feldstein | Dispersions for activating non-conductors for electroless plating |
US4301196A (en) * | 1978-09-13 | 1981-11-17 | Kollmorgen Technologies Corp. | Electroless copper deposition process having faster plating rates |
US4450191A (en) * | 1982-09-02 | 1984-05-22 | Omi International Corporation | Ammonium ions used as electroless copper plating rate controller |
DE3473890D1 (en) * | 1983-07-25 | 1988-10-13 | Hitachi Ltd | Electroless copper plating solution |
JPS60104246A (ja) * | 1983-11-11 | 1985-06-08 | C Uyemura & Co Ltd | 化学銅めつき浴中のホルムアルデヒドの分析方法 |
US4552787A (en) * | 1984-02-29 | 1985-11-12 | International Business Machines Corporation | Deposition of a metal from an electroless plating composition |
US4525390A (en) * | 1984-03-09 | 1985-06-25 | International Business Machines Corporation | Deposition of copper from electroless plating compositions |
US4581256A (en) * | 1984-11-19 | 1986-04-08 | Chemline Industries | Electroless plating composition and method of use |
US4617205A (en) * | 1984-12-21 | 1986-10-14 | Omi International Corporation | Formaldehyde-free autocatalytic electroless copper plating |
US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
JPS63134639A (ja) * | 1986-11-22 | 1988-06-07 | Haikawa Kk | 金属銅の無電解析出用廃液の処理方法 |
US4737188A (en) * | 1987-05-18 | 1988-04-12 | London Laboratories Limited | Reducing agent and method for the electroless deposition of silver |
JPH0379100A (ja) * | 1989-08-22 | 1991-04-04 | Matsushita Electric Ind Co Ltd | 光透過ペーストおよびそれを用いた金属銅析出方法 |
US5094881A (en) * | 1990-01-11 | 1992-03-10 | Lilly Industrial Coatings, Inc. | Mirrorback coating |
US5075134A (en) * | 1990-01-11 | 1991-12-24 | Lilly Industrial Coatings, Inc. | Mirrorback coating |
-
1993
- 1993-11-22 US US08/153,548 patent/US5419926A/en not_active Expired - Lifetime
- 1993-11-30 TW TW082110112A patent/TW342415B/zh active
-
1994
- 1994-03-10 UA UA96051851A patent/UA44259C2/uk unknown
- 1994-08-29 IL IL110813A patent/IL110813A/en not_active IP Right Cessation
- 1994-09-01 ZA ZA946707A patent/ZA946707B/xx unknown
- 1994-09-07 SA SA94150179A patent/SA94150179A/ar unknown
- 1994-10-03 RO RO96-01037A patent/RO113871B1/ro unknown
- 1994-10-03 SK SK643-96A patent/SK283024B6/sk unknown
- 1994-10-03 DE DE69427307T patent/DE69427307T2/de not_active Expired - Fee Related
- 1994-10-03 WO PCT/US1994/011200 patent/WO1995014538A1/en active IP Right Grant
- 1994-10-03 CZ CZ19961482A patent/CZ289089B6/cs not_active IP Right Cessation
- 1994-10-03 PT PT94930011T patent/PT730500E/pt unknown
- 1994-10-03 ES ES94930011T patent/ES2158904T3/es not_active Expired - Lifetime
- 1994-10-03 NZ NZ274723A patent/NZ274723A/xx unknown
- 1994-10-03 AT AT94930011T patent/ATE201337T1/de not_active IP Right Cessation
- 1994-10-03 PL PL94314589A patent/PL314589A1/xx unknown
- 1994-10-03 AU AU79269/94A patent/AU676949B2/en not_active Ceased
- 1994-10-03 CA CA002175909A patent/CA2175909C/en not_active Expired - Lifetime
- 1994-10-03 KR KR1019960702780A patent/KR100330632B1/ko not_active IP Right Cessation
- 1994-10-03 HU HU9601385A patent/HU216336B/hu not_active IP Right Cessation
- 1994-10-03 BR BR9408092A patent/BR9408092A/pt unknown
- 1994-10-03 EP EP94930011A patent/EP0730500B1/en not_active Expired - Lifetime
- 1994-10-03 DK DK94930011T patent/DK0730500T3/da active
- 1994-10-03 CN CN94194866A patent/CN1082842C/zh not_active Expired - Fee Related
- 1994-10-03 JP JP51468695A patent/JP3372256B2/ja not_active Expired - Fee Related
- 1994-10-24 PH PH49227A patent/PH31318A/en unknown
- 1994-11-18 MY MYPI94003079A patent/MY114660A/en unknown
-
1995
- 1995-06-01 RU RU96113210A patent/RU2118568C1/ru active
-
1996
- 1996-05-20 BG BG100606A patent/BG100606A/bg unknown
- 1996-05-21 FI FI962133A patent/FI104270B/fi active
- 1996-05-22 NO NO962085A patent/NO962085D0/no not_active Application Discontinuation
-
2001
- 2001-08-06 GR GR20010401180T patent/GR3036329T3/el not_active IP Right Cessation
Also Published As
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
KB | Patent renewed | ||
HP | Change in proprietorship | ||
MM9K | Patent not in force due to non-payment of renewal fees |