IL108503A - Self leveling membrane test probe - Google Patents
Self leveling membrane test probeInfo
- Publication number
- IL108503A IL108503A IL108503A IL10850394A IL108503A IL 108503 A IL108503 A IL 108503A IL 108503 A IL108503 A IL 108503A IL 10850394 A IL10850394 A IL 10850394A IL 108503 A IL108503 A IL 108503A
- Authority
- IL
- Israel
- Prior art keywords
- membrane
- intermediate area
- test probe
- contacts
- support frame
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/023,189 US5461326A (en) | 1993-02-25 | 1993-02-25 | Self leveling and self tensioning membrane test probe |
Publications (2)
Publication Number | Publication Date |
---|---|
IL108503A0 IL108503A0 (en) | 1994-05-30 |
IL108503A true IL108503A (en) | 1997-03-18 |
Family
ID=21813605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL108503A IL108503A (en) | 1993-02-25 | 1994-01-31 | Self leveling membrane test probe |
Country Status (5)
Country | Link |
---|---|
US (1) | US5461326A (de) |
EP (1) | EP0613013A1 (de) |
JP (1) | JP2591904B2 (de) |
KR (1) | KR940019577A (de) |
IL (1) | IL108503A (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
KR0140034B1 (ko) | 1993-12-16 | 1998-07-15 | 모리시다 요이치 | 반도체 웨이퍼 수납기, 반도체 웨이퍼의 검사용 집적회로 단자와 프로브 단자와의 접속방법 및 그 장치, 반도체 집적회로의 검사방법, 프로브카드 및 그 제조방법 |
EP0779989A4 (de) * | 1994-09-09 | 1998-01-07 | Micromodule Systems Inc | Abtasten von schaltkreisen mit einem membranfühler |
JP2978720B2 (ja) * | 1994-09-09 | 1999-11-15 | 東京エレクトロン株式会社 | プローブ装置 |
JPH0883825A (ja) * | 1994-09-09 | 1996-03-26 | Tokyo Electron Ltd | プローブ装置 |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
JP3414593B2 (ja) * | 1996-06-28 | 2003-06-09 | 日本発条株式会社 | 導電性接触子 |
US6798224B1 (en) * | 1997-02-11 | 2004-09-28 | Micron Technology, Inc. | Method for testing semiconductor wafers |
US6060891A (en) * | 1997-02-11 | 2000-05-09 | Micron Technology, Inc. | Probe card for semiconductor wafers and method and system for testing wafers |
TW369601B (en) * | 1997-06-17 | 1999-09-11 | Advantest Corp | Probe card |
US5990695A (en) * | 1998-01-16 | 1999-11-23 | Packard Hughes Interconnect Co. | Membrane test probe |
US6252414B1 (en) | 1998-08-26 | 2001-06-26 | International Business Machines Corporation | Method and apparatus for testing circuits having different configurations with a single test fixture |
JP2000182701A (ja) * | 1998-12-18 | 2000-06-30 | Honda Tsushin Kogyo Co Ltd | プローブピンとその製造方法及びコネクタ |
US6466044B1 (en) | 1999-10-21 | 2002-10-15 | Dell Products L.P. | Through connector circuit test apparatus |
US6255834B1 (en) * | 1999-10-21 | 2001-07-03 | Dell Usa, L.P. | Test fixture having a floating self-centering connector |
US7262611B2 (en) | 2000-03-17 | 2007-08-28 | Formfactor, Inc. | Apparatuses and methods for planarizing a semiconductor contactor |
US6734690B1 (en) * | 2000-04-29 | 2004-05-11 | Hewlett-Packard Development Company, L.P. | Back pressure test fixture to allow probing of integrated circuit package signals |
US6496001B1 (en) | 2000-11-14 | 2002-12-17 | International Business Machines Corporation | System and method for probe mechanism planarization |
US7394265B2 (en) | 2002-01-25 | 2008-07-01 | Advantest Corp. | Flat portions of a probe card flattened to have same vertical level with one another by compensating the unevenness of a substrate and each identical height needle being mounted on the corresponding flat portion through an adhesive |
US6682229B2 (en) * | 2002-03-01 | 2004-01-27 | Hon Hai Precision Ind. Co., Ltd. | Optical fiber array |
JP3899075B2 (ja) | 2002-03-05 | 2007-03-28 | リカ デンシ アメリカ, インコーポレイテッド | 電子パッケージと試験機器をインターフェースするための装置 |
KR20040022647A (ko) * | 2002-09-09 | 2004-03-16 | 삼성전자주식회사 | 집적 회로 칩 테스트를 위한 캔티레버형 푸르브 카드 |
US6765397B2 (en) * | 2002-11-21 | 2004-07-20 | International Business Machines Corporation | Apparatus and method for testing land grid array modules |
JP4465995B2 (ja) | 2003-07-02 | 2010-05-26 | 株式会社日立製作所 | プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法 |
US7071715B2 (en) * | 2004-01-16 | 2006-07-04 | Formfactor, Inc. | Probe card configuration for low mechanical flexural strength electrical routing substrates |
GB0412728D0 (en) * | 2004-06-08 | 2004-07-07 | Cooke Michael | Novel electroplated IC probe card designs |
US7315176B2 (en) * | 2004-06-16 | 2008-01-01 | Rika Denshi America, Inc. | Electrical test probes, methods of making, and methods of using |
WO2006116767A1 (en) | 2005-04-27 | 2006-11-02 | Aehr Test Systems | Apparatus for testing electronic devices |
US7365553B2 (en) * | 2005-12-22 | 2008-04-29 | Touchdown Technologies, Inc. | Probe card assembly |
JP4785190B2 (ja) * | 2006-03-15 | 2011-10-05 | 大西電子株式会社 | 半導体デバイス用検査ソケット |
JP4902248B2 (ja) * | 2006-04-07 | 2012-03-21 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP4841298B2 (ja) * | 2006-04-14 | 2011-12-21 | 株式会社日本マイクロニクス | プローブシートの製造方法 |
JP2008082912A (ja) * | 2006-09-28 | 2008-04-10 | Micronics Japan Co Ltd | 電気的接続装置 |
JP5002007B2 (ja) * | 2006-11-16 | 2012-08-15 | シーメンス アクチエンゲゼルシヤフト | 導体路構造体を検査するセンサ素子、導体路構造体の検査装置、導体路構造体の検査方法、および、センサ素子の製造方法 |
US7800382B2 (en) * | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
JP5209460B2 (ja) * | 2008-12-22 | 2013-06-12 | モレックス インコーポレイテド | 同軸コネクタ |
US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
JP5588851B2 (ja) * | 2010-12-14 | 2014-09-10 | 株式会社日本マイクロニクス | 電気的接続装置及びその製造方法 |
US8939252B2 (en) * | 2012-11-11 | 2015-01-27 | David Sanborn | Protective material for acoustic transmission |
US9633883B2 (en) | 2015-03-20 | 2017-04-25 | Rohinni, LLC | Apparatus for transfer of semiconductor devices |
US11469057B2 (en) * | 2015-12-30 | 2022-10-11 | Schneider Electric Industries Sas | Adjustable contactor |
CN205303357U (zh) * | 2015-12-30 | 2016-06-08 | 施耐德电器工业公司 | 可调节的接触器 |
US10261108B2 (en) | 2016-07-12 | 2019-04-16 | International Business Machines Corporation | Low force wafer test probe with variable geometry |
US10444260B2 (en) | 2016-07-12 | 2019-10-15 | International Business Machines Corporation | Low force wafer test probe |
US10141215B2 (en) * | 2016-11-03 | 2018-11-27 | Rohinni, LLC | Compliant needle for direct transfer of semiconductor devices |
WO2018160557A1 (en) | 2017-03-03 | 2018-09-07 | Aehr Test Systems | Electronics tester |
US11094571B2 (en) | 2018-09-28 | 2021-08-17 | Rohinni, LLC | Apparatus to increase transferspeed of semiconductor devices with micro-adjustment |
WO2022076333A1 (en) | 2020-10-07 | 2022-04-14 | Aehr Test Systems | Electronics tester |
CN114200278B (zh) * | 2021-11-29 | 2022-12-27 | 强一半导体(苏州)有限公司 | 一种薄膜探针卡及其探针头 |
CN114200279B (zh) * | 2021-11-29 | 2023-03-14 | 强一半导体(苏州)有限公司 | 一种薄膜探针卡及其探针头 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4636722A (en) * | 1984-05-21 | 1987-01-13 | Probe-Rite, Inc. | High density probe-head with isolated and shielded transmission lines |
JPH0833413B2 (ja) * | 1986-01-07 | 1996-03-29 | ヒューレット・パッカード・カンパニー | 試験用プロ−ブ |
DE3850664T2 (de) * | 1987-03-11 | 1994-10-20 | Hewlett Packard Co | Gerät zum automatischen Aufkratzen einer oxidierten Oberfläche. |
DE68909811D1 (de) * | 1988-03-01 | 1993-11-18 | Hewlett Packard Co | IC-Testsonde auf Membranbasis mit präzise positionierten Kontakten. |
US4906920A (en) * | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
GB8901817D0 (en) * | 1989-01-27 | 1989-03-15 | Stag Electronic Designs | Apparatus for testing an electrical device |
US4975638A (en) * | 1989-12-18 | 1990-12-04 | Wentworth Laboratories | Test probe assembly for testing integrated circuit devices |
US5334029A (en) * | 1993-05-11 | 1994-08-02 | At&T Bell Laboratories | High density connector for stacked circuit boards |
-
1993
- 1993-02-25 US US08/023,189 patent/US5461326A/en not_active Expired - Lifetime
-
1994
- 1994-01-31 IL IL108503A patent/IL108503A/xx not_active IP Right Cessation
- 1994-02-24 KR KR1019940003278A patent/KR940019577A/ko active IP Right Grant
- 1994-02-24 EP EP94301312A patent/EP0613013A1/de not_active Withdrawn
- 1994-02-25 JP JP6028200A patent/JP2591904B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5461326A (en) | 1995-10-24 |
JP2591904B2 (ja) | 1997-03-19 |
KR940019577A (ko) | 1994-09-14 |
EP0613013A1 (de) | 1994-08-31 |
JPH077056A (ja) | 1995-01-10 |
IL108503A0 (en) | 1994-05-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed | ||
RH | Patent void |