CH694831A5 - Vorrichtung zur Prüfung vereinzelter Halbleiterchips. - Google Patents
Vorrichtung zur Prüfung vereinzelter Halbleiterchips. Download PDFInfo
- Publication number
- CH694831A5 CH694831A5 CH00767/99A CH76799A CH694831A5 CH 694831 A5 CH694831 A5 CH 694831A5 CH 00767/99 A CH00767/99 A CH 00767/99A CH 76799 A CH76799 A CH 76799A CH 694831 A5 CH694831 A5 CH 694831A5
- Authority
- CH
- Switzerland
- Prior art keywords
- electrical contact
- die
- contact pad
- test unit
- prepackage
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8296698P | 1998-04-24 | 1998-04-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CH694831A5 true CH694831A5 (de) | 2005-07-29 |
CH694831A9 CH694831A9 (de) | 2005-10-14 |
Family
ID=34709725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH76799A CH694831A9 (de) | 1998-04-24 | 1999-04-23 | Vorrichtung zur Pruefung vereinzelter Halbleiterchips. |
Country Status (2)
Country | Link |
---|---|
US (1) | US6246251B1 (de) |
CH (1) | CH694831A9 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7188995B2 (en) | 2003-03-03 | 2007-03-13 | Wtach -U-License Ag | Tourbillon |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001007165A (ja) * | 1999-06-21 | 2001-01-12 | Mitsubishi Electric Corp | プローブカード装置 |
US6667631B2 (en) | 2001-12-27 | 2003-12-23 | Stmicroelectronics, Inc. | High temperature probe card |
US7218094B2 (en) * | 2003-10-21 | 2007-05-15 | Formfactor, Inc. | Wireless test system |
US20050139450A1 (en) * | 2003-12-30 | 2005-06-30 | International Product Technology, Inc. | Electrical part processing unit |
US7466157B2 (en) * | 2004-02-05 | 2008-12-16 | Formfactor, Inc. | Contactless interfacing of test signals with a device under test |
US7202687B2 (en) * | 2004-04-08 | 2007-04-10 | Formfactor, Inc. | Systems and methods for wireless semiconductor device testing |
US20060139045A1 (en) * | 2004-12-29 | 2006-06-29 | Wesley Gallagher | Device and method for testing unpackaged semiconductor die |
KR100656586B1 (ko) * | 2005-01-07 | 2006-12-13 | 삼성전자주식회사 | 프로브 카드 냉각용 공기 분사기를 갖는 웨이퍼 번인 시스템 |
TWI287752B (en) * | 2005-01-31 | 2007-10-01 | All Fine Technology Co Ltd | Composite equipment for automatic marking and reading |
WO2006134532A2 (en) * | 2005-06-16 | 2006-12-21 | Nxp B.V. | A tool for stretching the foil of a foil carrier, a machine for removing dies from a wafer and a method for removing dies |
KR100723503B1 (ko) * | 2005-09-13 | 2007-05-30 | 삼성전자주식회사 | 회전형 모듈 탑재부를 구비하는 메모리 모듈의 테스트시스템 |
US7274202B2 (en) * | 2005-10-07 | 2007-09-25 | Verigy (Singapore) Pte. Ltd. | Carousel device, system and method for electronic circuit tester |
US7671614B2 (en) * | 2005-12-02 | 2010-03-02 | Formfactor, Inc. | Apparatus and method for adjusting an orientation of probes |
TW200745572A (en) * | 2006-06-09 | 2007-12-16 | Visera Technologies Co Ltd | Manufacturing method of wafer-level testing circuit board, and the structure thereof |
TWM430614U (en) * | 2011-12-21 | 2012-06-01 | Youngtek Electronics Corp | Fiber optic light guiding top cover structure |
NL2014943B1 (en) * | 2015-06-09 | 2017-02-15 | Sluis Cigar Machinery Bv | Testing apparatus and testing method of vaporizers electronic cigarettes. |
CN113358970B (zh) * | 2021-07-07 | 2024-06-18 | 覃政友 | 一种自复式过欠压保护器检测装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3384236A (en) * | 1966-08-31 | 1968-05-21 | Corning Glass Works | Machine for automatically testing and orienting miniature semiconductor chips |
US3579102A (en) * | 1968-09-30 | 1971-05-18 | John F Keating | Apparatus for testing successive ones of a plurality of electrical components |
US3584741A (en) * | 1969-06-30 | 1971-06-15 | Ibm | Batch sorting apparatus |
US3750878A (en) * | 1971-11-15 | 1973-08-07 | Dixon K Corp | Electrical component testing apparatus |
US5634267A (en) | 1991-06-04 | 1997-06-03 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
JP2921937B2 (ja) * | 1990-07-18 | 1999-07-19 | 東京エレクトロン株式会社 | Ic検査装置 |
US5589781A (en) | 1990-09-20 | 1996-12-31 | Higgins; H. Dan | Die carrier apparatus |
US5519332A (en) | 1991-06-04 | 1996-05-21 | Micron Technology, Inc. | Carrier for testing an unpackaged semiconductor die |
US5177439A (en) | 1991-08-30 | 1993-01-05 | U.S. Philips Corporation | Probe card for testing unencapsulated semiconductor devices |
JPH0567652A (ja) * | 1991-09-05 | 1993-03-19 | Tokyo Electron Ltd | プローブ装置 |
US5313156A (en) * | 1991-12-04 | 1994-05-17 | Advantest Corporation | Apparatus for automatic handling |
US5475317A (en) | 1993-12-23 | 1995-12-12 | Epi Technologies, Inc. | Singulated bare die tester and method of performing forced temperature electrical tests and burn-in |
US5546012A (en) | 1994-04-15 | 1996-08-13 | International Business Machines Corporation | Probe card assembly having a ceramic probe card |
IT1272853B (it) * | 1994-11-30 | 1997-06-30 | Circuit Line Spa | Metodo e apparecchiatura per il carico e lo scarico automatico di circuiti stampati su macchine per l'esecuzione del test elettrico |
JP2877011B2 (ja) | 1994-12-20 | 1999-03-31 | 日本電気株式会社 | ベアチップテストキャリア |
US5497103A (en) * | 1995-01-25 | 1996-03-05 | International Business Machines Corporation | Test apparatus for circuitized substrate |
US5561377A (en) * | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
US5756370A (en) | 1996-02-08 | 1998-05-26 | Micron Technology, Inc. | Compliant contact system with alignment structure for testing unpackaged semiconductor dice |
-
1999
- 1999-04-23 CH CH76799A patent/CH694831A9/de not_active IP Right Cessation
- 1999-04-23 US US09/298,659 patent/US6246251B1/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7188995B2 (en) | 2003-03-03 | 2007-03-13 | Wtach -U-License Ag | Tourbillon |
Also Published As
Publication number | Publication date |
---|---|
US6246251B1 (en) | 2001-06-12 |
CH694831A9 (de) | 2005-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PK | Correction |
Free format text: BERICHTIGUNG DER GANZEN PATENTSCHRIFT |
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PL | Patent ceased |