ID16917A - Alat untuk melayani lapisan-lapisan bawah dalam kontener cairan. - Google Patents
Alat untuk melayani lapisan-lapisan bawah dalam kontener cairan.Info
- Publication number
- ID16917A ID16917A IDP971632A ID971632A ID16917A ID 16917 A ID16917 A ID 16917A ID P971632 A IDP971632 A ID P971632A ID 971632 A ID971632 A ID 971632A ID 16917 A ID16917 A ID 16917A
- Authority
- ID
- Indonesia
- Prior art keywords
- tools
- liquid content
- below layers
- serve below
- serve
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19621587 | 1996-05-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
ID16917A true ID16917A (id) | 1997-11-20 |
Family
ID=7795610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IDP971632A ID16917A (id) | 1996-05-29 | 1997-05-16 | Alat untuk melayani lapisan-lapisan bawah dalam kontener cairan. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6240938B1 (de) |
EP (1) | EP0956583A1 (de) |
JP (1) | JP3699485B2 (de) |
KR (1) | KR100338895B1 (de) |
DE (1) | DE19722423C2 (de) |
ID (1) | ID16917A (de) |
TW (1) | TW461828B (de) |
WO (1) | WO1997045860A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630052B1 (en) * | 1996-06-26 | 2003-10-07 | Lg. Philips Lcd Co., Ltd. | Apparatus for etching glass substrate |
DE19644255C1 (de) | 1996-10-24 | 1998-04-30 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten und Verwendung der Vorrichtung |
DE19758267A1 (de) * | 1997-12-31 | 1999-07-08 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Behandeln von Substraten |
DE10030718A1 (de) * | 2000-06-23 | 2002-01-10 | Univ Ilmenau Tech | Verfahren und Vorrichtung zum Reinigen von Gegenständen mit Schallwellen |
US20080000495A1 (en) * | 2001-12-07 | 2008-01-03 | Eric Hansen | Apparatus and method for single substrate processing |
US6726848B2 (en) * | 2001-12-07 | 2004-04-27 | Scp Global Technologies, Inc. | Apparatus and method for single substrate processing |
US20070079932A1 (en) * | 2001-12-07 | 2007-04-12 | Applied Materials, Inc. | Directed purge for contact free drying of wafers |
US20090029560A1 (en) * | 2001-12-07 | 2009-01-29 | Applied Materials, Inc. | Apparatus and method for single substrate processing |
US20070272657A1 (en) * | 2001-12-07 | 2007-11-29 | Eric Hansen | Apparatus and method for single substrate processing |
US7373941B2 (en) * | 2003-03-28 | 2008-05-20 | Taiwan Semiconductor Manufacturing Co. Ltd | Wet cleaning cavitation system and method to remove particulate wafer contamination |
DE102005012244B4 (de) | 2005-03-15 | 2008-12-24 | Rena Sondermaschinen Gmbh | Verfahren zur Reinigung von Gegenständen mittels Ultraschall |
US8070884B2 (en) * | 2005-04-01 | 2011-12-06 | Fsi International, Inc. | Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas enviroment including a drying enhancement substance |
US20070107748A1 (en) * | 2005-11-16 | 2007-05-17 | Donald Gray | Vacuum cavitational streaming |
KR101244896B1 (ko) * | 2006-06-05 | 2013-03-19 | 삼성디스플레이 주식회사 | 기판 식각장치 |
US7775219B2 (en) * | 2006-12-29 | 2010-08-17 | Applied Materials, Inc. | Process chamber lid and controlled exhaust |
US20080236615A1 (en) * | 2007-03-28 | 2008-10-02 | Mimken Victor B | Method of processing wafers in a sequential fashion |
EP2515323B1 (de) * | 2011-04-21 | 2014-03-19 | Imec | Verfahren und Vorrichtung zur Reinigung von Halbleitersubstraten |
EP3840024B1 (de) | 2019-12-20 | 2022-02-16 | Semsysco GmbH | Modul zur chemischen bearbeitung eines substrats |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3276459A (en) * | 1965-03-08 | 1966-10-04 | John J Harrison | Washing unit providing an up-and-down movement of a workpiece in a cleaning bath |
US3702795A (en) * | 1968-02-21 | 1972-11-14 | Grace W R & Co | Apparatus for ultrasonic etching of polymeric printing plates |
US4671206A (en) * | 1983-06-20 | 1987-06-09 | Hoppestad Lamont I | Article support rack |
JPS60130832A (ja) * | 1983-12-19 | 1985-07-12 | Mitsubishi Electric Corp | 半導体ウエハの水洗装置 |
US4911761A (en) * | 1984-05-21 | 1990-03-27 | Cfm Technologies Research Associates | Process and apparatus for drying surfaces |
JPS61189642A (ja) * | 1985-02-18 | 1986-08-23 | Mitsubishi Electric Corp | プラズマ反応装置 |
JPS61189647A (ja) * | 1985-02-19 | 1986-08-23 | Toshiba Ceramics Co Ltd | 半導体ウエハ洗浄用ウエハボ−ト |
US4902350A (en) | 1987-09-09 | 1990-02-20 | Robert F. Orr | Method for rinsing, cleaning and drying silicon wafers |
JPH01304733A (ja) * | 1988-06-01 | 1989-12-08 | Mitsubishi Electric Corp | 半導体ウエハの洗浄装置 |
JPH02117135A (ja) * | 1988-10-26 | 1990-05-01 | Mitsubishi Electric Corp | ウエハ洗浄槽 |
JP2653511B2 (ja) * | 1989-03-30 | 1997-09-17 | 株式会社東芝 | 半導体装置の洗浄方法及びその洗浄装置 |
JPH04500033A (ja) * | 1989-05-17 | 1992-01-09 | ミンスキ ラディオテフニチェスキ インスティテュト | 液体媒体内の物品を超音波加工するための装置 |
JP2549735B2 (ja) | 1989-07-14 | 1996-10-30 | 株式会社東芝 | 流液式超音波洗浄装置 |
JPH0366124A (ja) * | 1989-08-04 | 1991-03-20 | Fujitsu Ltd | 洗浄装置 |
JPH03231428A (ja) * | 1990-02-07 | 1991-10-15 | Hitachi Cable Ltd | 半導体ウエハの洗浄方法 |
JPH0437131A (ja) * | 1990-06-01 | 1992-02-07 | Fuji Electric Co Ltd | 半導体ウエハの純水水洗槽及び水洗方法 |
US5090432A (en) | 1990-10-16 | 1992-02-25 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
US5275184A (en) | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
JPH04245432A (ja) | 1991-01-31 | 1992-09-02 | Fujitsu Ltd | 基板の洗浄方法 |
US5088510A (en) * | 1991-02-04 | 1992-02-18 | Bannon John H | Ultrasonic parts cleaning container |
JP2901098B2 (ja) | 1991-04-02 | 1999-06-02 | 東京エレクトロン株式会社 | 洗浄装置および洗浄方法 |
US5488964A (en) | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
JPH05109685A (ja) * | 1991-10-15 | 1993-04-30 | Toshiba Corp | 超音波洗浄装置 |
JPH05129268A (ja) * | 1991-10-31 | 1993-05-25 | Fuji Electric Co Ltd | ウエーハ洗浄装置 |
KR0163362B1 (ko) | 1992-03-05 | 1999-02-01 | 이노우에 아키라 | 세정장치용 처리조 |
US5427622A (en) * | 1993-02-12 | 1995-06-27 | International Business Machines Corporation | Method for uniform cleaning of wafers using megasonic energy |
US5383484A (en) | 1993-07-16 | 1995-01-24 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
JPH07263397A (ja) * | 1994-03-25 | 1995-10-13 | Hitachi Ltd | 超音波洗浄方法 |
DE4413077C2 (de) | 1994-04-15 | 1997-02-06 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
DE4428169C2 (de) | 1994-08-09 | 1996-07-11 | Steag Micro Tech Gmbh | Träger für Substrate |
US5593505A (en) * | 1995-04-19 | 1997-01-14 | Memc Electronic Materials, Inc. | Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface |
DE19616402C2 (de) * | 1996-04-24 | 2001-11-29 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
-
1996
- 1996-12-06 US US08/761,717 patent/US6240938B1/en not_active Expired - Fee Related
-
1997
- 1997-03-27 WO PCT/EP1997/001576 patent/WO1997045860A1/de not_active Application Discontinuation
- 1997-03-27 EP EP97915452A patent/EP0956583A1/de not_active Withdrawn
- 1997-03-27 JP JP54143797A patent/JP3699485B2/ja not_active Expired - Fee Related
- 1997-03-27 KR KR1019980704777A patent/KR100338895B1/ko not_active IP Right Cessation
- 1997-05-13 TW TW086106386A patent/TW461828B/zh not_active IP Right Cessation
- 1997-05-16 ID IDP971632A patent/ID16917A/id unknown
- 1997-05-28 DE DE19722423A patent/DE19722423C2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6240938B1 (en) | 2001-06-05 |
EP0956583A1 (de) | 1999-11-17 |
JPH11512888A (ja) | 1999-11-02 |
DE19722423C2 (de) | 1999-04-22 |
DE19722423A1 (de) | 1997-12-11 |
KR19990076665A (ko) | 1999-10-15 |
JP3699485B2 (ja) | 2005-09-28 |
WO1997045860A1 (de) | 1997-12-04 |
KR100338895B1 (ko) | 2002-07-18 |
TW461828B (en) | 2001-11-01 |
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