HK36696A - Apparatus for inspecting packaged electronic device - Google Patents

Apparatus for inspecting packaged electronic device

Info

Publication number
HK36696A
HK36696A HK36696A HK36696A HK36696A HK 36696 A HK36696 A HK 36696A HK 36696 A HK36696 A HK 36696A HK 36696 A HK36696 A HK 36696A HK 36696 A HK36696 A HK 36696A
Authority
HK
Hong Kong
Prior art keywords
packaged substrate
substrate
electronic device
land
packaged electronic
Prior art date
Application number
HK36696A
Other languages
English (en)
Inventor
Teruhisa Omron Tateisi Yotuya
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61236499A external-priority patent/JPH0820229B2/ja
Priority claimed from JP61256994A external-priority patent/JP2664141B2/ja
Priority claimed from JP61256995A external-priority patent/JPH07120420B2/ja
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of HK36696A publication Critical patent/HK36696A/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Length Measuring Devices By Optical Means (AREA)
HK36696A 1986-10-03 1996-02-29 Apparatus for inspecting packaged electronic device HK36696A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61236499A JPH0820229B2 (ja) 1986-10-03 1986-10-03 実装基板検査装置
JP61256994A JP2664141B2 (ja) 1986-10-30 1986-10-30 実装基板検査装置
JP61256995A JPH07120420B2 (ja) 1986-10-30 1986-10-30 実装基板検査装置

Publications (1)

Publication Number Publication Date
HK36696A true HK36696A (en) 1996-03-08

Family

ID=27332376

Family Applications (1)

Application Number Title Priority Date Filing Date
HK36696A HK36696A (en) 1986-10-03 1996-02-29 Apparatus for inspecting packaged electronic device

Country Status (5)

Country Link
US (2) US4953100A (fr)
EP (1) EP0263473B1 (fr)
AT (1) ATE109278T1 (fr)
DE (1) DE3750285T2 (fr)
HK (1) HK36696A (fr)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4953100A (en) * 1986-10-03 1990-08-28 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
US5093797A (en) * 1987-01-13 1992-03-03 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
JP2517637B2 (ja) * 1988-02-15 1996-07-24 キヤノン株式会社 マ―ク位置検出方法及びそれが適用される装置
DE68929481T2 (de) * 1988-05-09 2004-06-09 Omron Corp. Vorrichtung und Verfahren zur Anzeige der Ergebnisse einer Leiterplattenprüfung
JPH01284743A (ja) * 1988-05-10 1989-11-16 Toshiba Corp 半導体装置の樹脂モールドの外観検査方法とその検査装置
JPH02140886A (ja) * 1988-11-21 1990-05-30 Omron Tateisi Electron Co 画像の前処理装置
US5027417A (en) * 1989-03-31 1991-06-25 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
US5144681A (en) * 1989-03-31 1992-09-01 Dainnippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
JPH03188358A (ja) * 1989-12-19 1991-08-16 Hajime Sangyo Kk 物体の表面検査装置
JP3092809B2 (ja) * 1989-12-21 2000-09-25 株式会社日立製作所 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置
DE69030869T2 (de) * 1989-12-29 1997-10-16 Canon Kk Bildverarbeitungsverfahren zur Bewertung von Objekten und Vorrichtung zur Qualitätsprüfung zur Durchführung des Verfahrens
US5243665A (en) * 1990-03-07 1993-09-07 Fmc Corporation Component surface distortion evaluation apparatus and method
US5197105A (en) * 1990-05-30 1993-03-23 Dainippon Screen Mfg. Co. Ltd. Method of reading optical image of inspected surface and image reading system employabale therein
GB9021444D0 (en) * 1990-10-02 1990-11-14 Delco Electronic Overseas Corp Light mask
US5598345A (en) * 1990-11-29 1997-01-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
EP0526080B1 (fr) * 1991-07-22 1996-10-02 Omron Corporation Système et méthode d'apprentisage pour inspection des composants montés
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
GB2262339B (en) * 1991-12-13 1995-09-06 Honda Motor Co Ltd Method of inspecting the surface of a workpiece
US5495535A (en) * 1992-01-31 1996-02-27 Orbotech Ltd Method of inspecting articles
DE69331433T2 (de) * 1992-10-22 2002-10-02 Advanced Interconnection Technology, Inc. Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten
US5392360A (en) * 1993-04-28 1995-02-21 International Business Machines Corporation Method and apparatus for inspection of matched substrate heatsink and hat assemblies
US5566244A (en) * 1993-11-22 1996-10-15 Honda Giken Kogyo Kabushiki Kaisha Method of inspecting a workpiece surface including a picturing system with a shortened focal plane
MY127829A (en) * 1996-05-30 2006-12-29 Sony Emcs Malaysia Sdn Bhd Mounting system.
IE80676B1 (en) * 1996-08-02 1998-11-18 M V Research Limited A measurement system
DE19653403C2 (de) * 1996-10-21 2001-05-10 Koenig & Bauer Ag Verfahren zum Transport von Bogen
JPH10143660A (ja) * 1996-11-11 1998-05-29 Hitachi Ltd 欠陥判定処理方法およびその装置
KR19980039109A (ko) * 1996-11-27 1998-08-17 배순훈 클린칭 검사기능을 갖는 자삽경로 작성장치와 그 검사방법
US6047084A (en) * 1997-11-18 2000-04-04 Motorola, Inc. Method for determining accuracy of a circuit assembly process and machine employing the same
JP2000326495A (ja) * 1999-05-24 2000-11-28 Matsushita Electric Ind Co Ltd クリーム半田印刷の検査方法
US6542630B1 (en) 1999-09-14 2003-04-01 Teradyne, Inc. Inspecting component placement relative to component pads
JP3870872B2 (ja) * 2002-08-06 2007-01-24 オムロン株式会社 検査データ作成方法およびこの方法を用いた基板検査装置
DE10261865A1 (de) * 2002-12-20 2004-07-15 Uwe Braun Sonnenlichtleitsysteme Lichtsysteme Gmbh Verfahren, Vorrichtung und Computerprogramm zur optischen Oberflächenerfassung
GB0324638D0 (en) * 2003-10-22 2003-11-26 Gore W L & Ass Uk An on-line inspection system
CN1662132B (zh) * 2004-02-26 2010-08-18 欧姆龙株式会社 安装错误检测方法和采用该方法的基板检测装置
JP4165538B2 (ja) 2004-07-21 2008-10-15 オムロン株式会社 部品実装検査方法および部品実装検査装置
JP4935109B2 (ja) * 2005-03-17 2012-05-23 オムロン株式会社 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置
JP4595705B2 (ja) * 2005-06-22 2010-12-08 オムロン株式会社 基板検査装置並びにそのパラメータ設定方法およびパラメータ設定装置
CN102292700A (zh) * 2009-01-24 2011-12-21 惠普开发有限公司 用于增强安全印刷的系统和方法
US11084225B2 (en) 2018-04-02 2021-08-10 Nanotronics Imaging, Inc. Systems, methods, and media for artificial intelligence process control in additive manufacturing
US11209795B2 (en) 2019-02-28 2021-12-28 Nanotronics Imaging, Inc. Assembly error correction for assembly lines
US10481579B1 (en) 2019-02-28 2019-11-19 Nanotronics Imaging, Inc. Dynamic training for assembly lines
CN110534411B (zh) * 2019-08-21 2021-07-13 大同新成新材料股份有限公司 一种芯片硅的加工方法
EP4028228A4 (fr) 2019-09-10 2023-09-27 Nanotronics Imaging, Inc. Systèmes, procédés et supports pour procédés de fabrication
US11100221B2 (en) 2019-10-08 2021-08-24 Nanotronics Imaging, Inc. Dynamic monitoring and securing of factory processes, equipment and automated systems
US11086988B1 (en) 2020-02-28 2021-08-10 Nanotronics Imaging, Inc. Method, systems and apparatus for intelligently emulating factory control systems and simulating response data
KR20220133712A (ko) * 2021-03-25 2022-10-05 현대자동차주식회사 차량의 품질 관리 시스템 및 그 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1129509B (it) * 1980-01-14 1986-06-04 Tasco Spa Procedimento ed apparecchiatura per il ritrovamento in tempo reale di difetti in oggetti industriali
US4379308A (en) * 1980-02-25 1983-04-05 Cooper Industries, Inc. Apparatus for determining the parameters of figures on a surface
DE3070433D1 (en) * 1980-12-18 1985-05-09 Ibm Method for the inspection and automatic sorting of objects with configurations of fixed dimensional tolerances, and device for carrying out the method
US4473842A (en) * 1981-07-06 1984-09-25 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus and method for examining printed circuit board provided with electronic parts
JPS5863838A (ja) * 1981-10-14 1983-04-15 Fuji Electric Co Ltd 欠陥検出回路
US4589139A (en) * 1982-02-04 1986-05-13 Nippon Kogaku K. K. Apparatus for detecting defects in pattern
JPS58201185A (ja) * 1982-05-19 1983-11-22 Toshiba Corp 位置検出装置
DE3347645C1 (de) * 1983-12-30 1985-10-10 Dr.-Ing. Ludwig Pietzsch Gmbh & Co, 7505 Ettlingen Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt
JPS60263807A (ja) * 1984-06-12 1985-12-27 Dainippon Screen Mfg Co Ltd プリント配線板のパタ−ン欠陥検査装置
FI73329B (fi) * 1984-08-29 1987-05-29 Halton Oy Anordning foer identifiering och registrering av flaskor och/eller flaskkorgar.
US4794647A (en) * 1985-04-08 1988-12-27 Northern Telecom Limited Automatic optical inspection system
US4707734A (en) * 1985-06-17 1987-11-17 The Perkin-Elmer Corporation Coarse flaw detector for printed circuit board inspection
JPS6261390A (ja) * 1985-09-11 1987-03-18 興和株式会社 プリント基板検査方法およびその装置
JPH0762868B2 (ja) * 1985-10-02 1995-07-05 株式会社日立製作所 プリント基板の配線パターン欠陥検査方法
JPS62173731A (ja) * 1986-01-28 1987-07-30 Toshiba Corp 被検査物の表面検査装置
US4953100A (en) * 1986-10-03 1990-08-28 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
US4760444A (en) * 1987-07-22 1988-07-26 Csd International, Inc. Machine visual inspection device and method
US4876656A (en) * 1987-08-28 1989-10-24 Motorola Inc. Circuit location sensor for component placement apparatus

Also Published As

Publication number Publication date
US4953100A (en) 1990-08-28
EP0263473A3 (en) 1990-10-10
DE3750285T2 (de) 1995-03-30
US5027295A (en) 1991-06-25
EP0263473A2 (fr) 1988-04-13
DE3750285D1 (de) 1994-09-01
EP0263473B1 (fr) 1994-07-27
ATE109278T1 (de) 1994-08-15

Similar Documents

Publication Publication Date Title
HK36696A (en) Apparatus for inspecting packaged electronic device
EP0385625A3 (fr) Méthode et appareil d'inspection de substrats
EP0242626A3 (en) Method for mounting electronic components on a substrate
EP0247714A3 (en) Method and apparatus for forming a film on a substrate
EP0535718A3 (en) Apparatus for forming images on an objective body
EP0949798A3 (fr) Procédé et appareil de traitement d'images
EP1553815A3 (fr) Appareil et procédé de montage d'un composant
NO871159L (no) Fremgangsmaate og apparatur for forbedret sar-avbildning (syntisert aperturradar) for skipsklassifisering.
EP0480754A3 (en) Mounting device for mounting an electronic device on a substrate by the surface mounting technology
AU2081588A (en) Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
DE3850889D1 (de) Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung.
AU1997588A (en) Method and apparatus for mounting components on a printed circuit board or similar mounting surface
FR2615346B1 (fr) Dispositif assurant la tenue d'un boitier d'equipements electroniques sur un plateau
GB2232280B (en) A digital electronic device for processing an image.
EP0755159A3 (fr) Appareil d'analyse d'image comportant un circuit de compensation d'élément d'image
EP0123271A3 (en) Process and device for compensating the image motion of an aerial camera
JPS5739599A (en) Method and device for automatically mounting leadless electronic part on printed board or like
SG63840A1 (en) Apparatus and method for mounting semiconductor hips on a substrate
FR2605112B1 (fr) Dispositif et procede de generation de vecteurs de test et procede de test pour circuit integre
IL68958A0 (en) Process and apparatus for forming multiple electronic images on a photo-sensitive surface
EP0281426A3 (en) Electronic circuit device for diagnosing status-holding circuits by scanning
GB8331348D0 (en) Machine for placing electronic components on substrate
GB2177519B (en) Apparatus for mounting an image-carrying substrate on a mounting sheet with the image at a desired orientation
GB2303755B (en) Electronic counter-measures apparatus for towing by an aircraft
KR930003300B1 (en) Apparatus for the inspection of printed circuit boards on which components have been mounted

Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20071004