HK27993A - Resin encapsulating method - Google Patents
Resin encapsulating methodInfo
- Publication number
- HK27993A HK27993A HK279/93A HK27993A HK27993A HK 27993 A HK27993 A HK 27993A HK 279/93 A HK279/93 A HK 279/93A HK 27993 A HK27993 A HK 27993A HK 27993 A HK27993 A HK 27993A
- Authority
- HK
- Hong Kong
- Prior art keywords
- encapsulating method
- resin encapsulating
- resin
- encapsulating
- Prior art date
Links
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2708—Gates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5825—Measuring, controlling or regulating dimensions or shape, e.g. size, thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5073888 | 1988-03-04 | ||
JP5940988A JPH01234217A (ja) | 1988-03-15 | 1988-03-15 | 樹脂封止方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK27993A true HK27993A (en) | 1993-04-02 |
Family
ID=26391193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK279/93A HK27993A (en) | 1988-03-04 | 1993-03-25 | Resin encapsulating method |
Country Status (5)
Country | Link |
---|---|
US (1) | US4954308A (xx) |
FR (1) | FR2628263B1 (xx) |
GB (1) | GB2217646B (xx) |
HK (1) | HK27993A (xx) |
SG (1) | SG893G (xx) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5049526A (en) * | 1989-06-07 | 1991-09-17 | Motorola, Inc. | Method for fabricating semiconductor device including package |
US5067008A (en) * | 1989-08-11 | 1991-11-19 | Hitachi Maxell, Ltd. | Ic package and ic card incorporating the same thereinto |
JP2505051B2 (ja) * | 1990-02-01 | 1996-06-05 | 三菱電機株式会社 | 半導体素子用樹脂封止装置及び半導体装置の製造方法 |
US5061114A (en) * | 1990-02-05 | 1991-10-29 | Pac-Tec, Inc. | Reflective pavement marker and method of apparatus for making same |
JP3290986B2 (ja) * | 1991-05-10 | 2002-06-10 | ゲーアーオー ゲゼルシャフト フュア アウトマツィオーン ウント オルガニザツィオーン ミット ベシュレンクテル ハフツング | 壁面の厚さを部分的に薄くしたプラスチック成形物の製造方法及び製造装置 |
US5275546A (en) * | 1991-12-30 | 1994-01-04 | Fierkens Richard H J | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor |
US5254501A (en) * | 1992-09-11 | 1993-10-19 | Cypress Semiconductor Corporation | Same-side gated process for encapsulating semiconductor devices |
JP3627222B2 (ja) * | 1992-09-30 | 2005-03-09 | 日本ゼオン株式会社 | 電子部品封止体製造用型枠、およびそれを用いた電子部品封止体の製造方法 |
JPH06302633A (ja) * | 1993-04-13 | 1994-10-28 | Fujitsu Ltd | 半導体装置の製造方法 |
US5670429A (en) * | 1993-06-30 | 1997-09-23 | Rohm Co. Ltd. | Process of conveying an encapsulated electronic component by engaging an integral resin projection |
JPH07183317A (ja) * | 1993-12-22 | 1995-07-21 | Matsushita Electric Ind Co Ltd | 電子部品の製造装置及び製造方法 |
US5783134A (en) * | 1994-01-13 | 1998-07-21 | Citizen Watch Co., Ltd. | Method of resin-sealing semiconductor device |
DE4401588C2 (de) * | 1994-01-20 | 2003-02-20 | Gemplus Gmbh | Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul |
US5478517A (en) * | 1994-02-28 | 1995-12-26 | Gennum Corporation | Method for molding IC chips |
US5635671A (en) * | 1994-03-16 | 1997-06-03 | Amkor Electronics, Inc. | Mold runner removal from a substrate-based packaged electronic device |
US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
JPH0885285A (ja) * | 1994-07-21 | 1996-04-02 | Hitachi Maxell Ltd | セキュリティカード用基板の製造方法、およびセキュリティカード用基板 |
DE4427309C2 (de) * | 1994-08-02 | 1999-12-02 | Ibm | Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten |
NL9401682A (nl) * | 1994-10-12 | 1996-05-01 | Fico Bv | Werkwijze voor het omhullen van een chip en scheidingsstrip en matrijshelft te gebruiken met deze werkwijze. |
JP3246848B2 (ja) * | 1995-02-22 | 2002-01-15 | アピックヤマダ株式会社 | 汎用ゲート位置樹脂モールド装置および樹脂モールド方法 |
FR2734948B1 (fr) * | 1995-05-31 | 1997-07-18 | Sgs Thomson Microelectronics | Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation. |
US6130383A (en) * | 1995-05-31 | 2000-10-10 | Sgs-Thomson Microelectronics, S.A. | Solder ball array package and a method of encapsulation |
FR2734947A1 (fr) * | 1995-05-31 | 1996-12-06 | Sgs Thomson Microelectronics | Boitier d'encapsulation a reseau de boules de soudure et procede d'encapsulation. |
KR0151828B1 (ko) * | 1995-07-25 | 1998-12-01 | 김광호 | 패키지 성형장치 |
US5796589A (en) * | 1995-12-20 | 1998-08-18 | Intel Corporation | Ball grid array integrated circuit package that has vias located within the solder pads of a package |
US5656549A (en) * | 1996-08-19 | 1997-08-12 | Motorola, Inc. | Method of packaging a semiconductor device |
US5833903A (en) * | 1996-12-10 | 1998-11-10 | Great American Gumball Corporation | Injection molding encapsulation for an electronic device directly onto a substrate |
US6001672A (en) * | 1997-02-25 | 1999-12-14 | Micron Technology, Inc. | Method for transfer molding encapsulation of a semiconductor die with attached heat sink |
US6015280A (en) * | 1997-04-28 | 2000-01-18 | Advanced Micro Devices | Apparatus for reducing warping of plastic packages |
US5766535A (en) * | 1997-06-04 | 1998-06-16 | Integrated Packaging Assembly Corporation | Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
US5986209A (en) * | 1997-07-09 | 1999-11-16 | Micron Technology, Inc. | Package stack via bottom leaded plastic (BLP) packaging |
TW381329B (en) * | 1998-04-03 | 2000-02-01 | Silicom Ware Prec Ind Co Ltd | Packaging method for chips |
US6372553B1 (en) | 1998-05-18 | 2002-04-16 | St Assembly Test Services, Pte Ltd | Disposable mold runner gate for substrate based electronic packages |
US6306331B1 (en) | 1999-03-24 | 2001-10-23 | International Business Machines Corporation | Ultra mold for encapsulating very thin packages |
JP3578262B2 (ja) * | 1999-04-06 | 2004-10-20 | 日東電工株式会社 | 半導体チップの樹脂封止方法及びその方法に使用する離型フィルム |
NL1012488C2 (nl) * | 1999-07-01 | 2001-01-03 | Fico Bv | Inrichting en werkwijze voor het omhullen van op een drager bevestigde elektronische componenten. |
US6365434B1 (en) | 2000-06-28 | 2002-04-02 | Micron Technology, Inc. | Method and apparatus for reduced flash encapsulation of microelectronic devices |
EP1174822A1 (de) * | 2000-07-21 | 2002-01-23 | Sempac SA | Verfahren zur Herstellung eines Kunststoffobjektes |
US20020043389A1 (en) * | 2000-09-29 | 2002-04-18 | Selvarajan Murugan | Virtual gate design for thin packages |
US7220615B2 (en) * | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
JP4614584B2 (ja) * | 2001-06-28 | 2011-01-19 | 三洋電機株式会社 | 混成集積回路装置およびその製造方法 |
US7114939B2 (en) * | 2002-04-11 | 2006-10-03 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Encapsulating brittle substrates using transfer molding |
KR100563584B1 (ko) * | 2002-07-29 | 2006-03-22 | 야마하 가부시키가이샤 | 자기 센서의 제조 방법과 그 리드 프레임, 자기 센서, 및센서 장치 |
JP4508839B2 (ja) * | 2004-11-12 | 2010-07-21 | パナソニック株式会社 | 樹脂封止金型および樹脂封止装置 |
WO2006129343A1 (ja) * | 2005-05-30 | 2006-12-07 | Spansion Llc | 半導体装置の製造装置及び半導体装置の製造方法 |
JP2007046925A (ja) * | 2005-08-08 | 2007-02-22 | Seiko Instruments Inc | 時計輪列支持板の成形方法、時計輪列支持板成形用金型構造体、これにより成形される時計輪列支持板、該支持板を備えた時計 |
US7909482B2 (en) | 2006-08-21 | 2011-03-22 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
WO2009076579A2 (en) * | 2007-12-12 | 2009-06-18 | Innotec Corporation | Overmolded circuit board and method |
US7815339B2 (en) * | 2008-01-09 | 2010-10-19 | Innotec Corporation | Light module |
TW201219186A (en) * | 2010-11-05 | 2012-05-16 | Quanta Comp Inc | Coupling element, injection molding object implanted with the coupling element, and injection mold for manufacturing the injection molding object |
US9022631B2 (en) | 2012-06-13 | 2015-05-05 | Innotec Corp. | Flexible light pipe |
JP6321482B2 (ja) | 2013-09-26 | 2018-05-09 | エイブリック株式会社 | 半導体製造装置 |
JP2015108573A (ja) * | 2013-12-05 | 2015-06-11 | 中西金属工業株式会社 | リング形状インサート成形品 |
JP6278370B2 (ja) * | 2014-08-05 | 2018-02-14 | 株式会社江東彫刻 | 配線回路部品を作製するための金型 |
NL2013978B1 (en) * | 2014-12-15 | 2016-10-11 | Besi Netherlands Bv | Device and method for controlled moulding and degating of a carrier with electronic components and moulded product. |
US10335985B2 (en) * | 2015-10-14 | 2019-07-02 | Capital One Services, Llc | Molded pocket in transaction card construction |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE639857A (xx) * | 1962-11-13 | |||
DE1934394A1 (de) * | 1969-07-07 | 1971-01-14 | Guardin Electric Mfg Co | Form zur Halterung mehrerer Elemente |
US4368168A (en) * | 1978-07-17 | 1983-01-11 | Dusan Slepcevic | Method for encapsulating electrical components |
US4332537A (en) * | 1978-07-17 | 1982-06-01 | Dusan Slepcevic | Encapsulation mold with removable cavity plates |
US4442056A (en) * | 1980-12-06 | 1984-04-10 | Dusan Slepcevic | Encapsulation mold with gate plate and method of using same |
JPS57128930A (en) * | 1981-02-04 | 1982-08-10 | Yamagata Nippon Denki Kk | Resin sealing |
US4480975A (en) * | 1981-07-01 | 1984-11-06 | Kras Corporation | Apparatus for encapsulating electronic components |
JPS5932139A (ja) * | 1982-08-18 | 1984-02-21 | Toshiba Corp | 半導体樹脂封止用金型 |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
JPS59124734A (ja) * | 1983-01-04 | 1984-07-18 | Nec Kyushu Ltd | ゲ−トインサ−ト式封入金型 |
JPS614234A (ja) * | 1984-06-19 | 1986-01-10 | Michio Osada | 半導体素子の樹脂モ−ルド成形方法及び半導体リ−ドフレ−ム |
JPS6146049A (ja) * | 1984-08-10 | 1986-03-06 | Hitachi Ltd | 半導体装置 |
JPS61144033A (ja) * | 1984-12-18 | 1986-07-01 | Toshiba Corp | 半導体装置の樹脂封止成形方法 |
JPS6213312A (ja) * | 1985-07-12 | 1987-01-22 | Toyota Motor Corp | 射出成形金型 |
FR2598258B1 (fr) * | 1986-04-30 | 1988-10-07 | Aix Les Bains Composants | Procede d'encapsulation de circuits integres. |
US4741507A (en) * | 1986-06-02 | 1988-05-03 | Motorola Inc. | Self-cleaning mold |
-
1988
- 1988-12-27 US US07/290,227 patent/US4954308A/en not_active Expired - Lifetime
- 1988-12-30 GB GB8830385A patent/GB2217646B/en not_active Expired - Lifetime
-
1989
- 1989-02-10 FR FR8901746A patent/FR2628263B1/fr not_active Expired - Lifetime
-
1993
- 1993-01-04 SG SG8/93A patent/SG893G/en unknown
- 1993-03-25 HK HK279/93A patent/HK27993A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2217646B (en) | 1992-01-08 |
US4954308A (en) | 1990-09-04 |
FR2628263A1 (fr) | 1989-09-08 |
GB2217646A (en) | 1989-11-01 |
FR2628263B1 (fr) | 1994-01-14 |
SG893G (en) | 1993-03-12 |
GB8830385D0 (en) | 1989-03-01 |
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