HK17888A - Fine gold alloy wire for bonding of a semiconductor device - Google Patents

Fine gold alloy wire for bonding of a semiconductor device

Info

Publication number
HK17888A
HK17888A HK178/88A HK17888A HK17888A HK 17888 A HK17888 A HK 17888A HK 178/88 A HK178/88 A HK 178/88A HK 17888 A HK17888 A HK 17888A HK 17888 A HK17888 A HK 17888A
Authority
HK
Hong Kong
Prior art keywords
gold alloy
alloy wire
bonding
fine gold
semiconductor device
Prior art date
Application number
HK178/88A
Other languages
English (en)
Inventor
Naoyuki Hosoda
Masayuki Tanaka
Tamotsu Mori
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP56195299A external-priority patent/JPS5896741A/ja
Priority claimed from JP57037580A external-priority patent/JPS58154242A/ja
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Publication of HK17888A publication Critical patent/HK17888A/xx

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/43—Manufacturing methods
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
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    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/45144—Gold (Au) as principal constituent
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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HK178/88A 1981-12-04 1988-03-03 Fine gold alloy wire for bonding of a semiconductor device HK17888A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP56195299A JPS5896741A (ja) 1981-12-04 1981-12-04 半導体素子結線用高張力ａｕ合金細線
JP57037580A JPS58154242A (ja) 1982-03-10 1982-03-10 半導体素子ボンデイング用金合金細線

Publications (1)

Publication Number Publication Date
HK17888A true HK17888A (en) 1988-03-11

Family

ID=26376707

Family Applications (1)

Application Number Title Priority Date Filing Date
HK178/88A HK17888A (en) 1981-12-04 1988-03-03 Fine gold alloy wire for bonding of a semiconductor device

Country Status (10)

Country Link
US (2) US4885135A (ko)
KR (1) KR890003143B1 (ko)
DE (1) DE3237385A1 (ko)
FR (1) FR2517885B1 (ko)
GB (1) GB2116208B (ko)
HK (1) HK17888A (ko)
IT (1) IT1156088B (ko)
MY (1) MY8700920A (ko)
NL (1) NL8203706A (ko)
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KR840002161A (ko) 1984-06-11
DE3237385C2 (ko) 1991-06-20
GB2116208A (en) 1983-09-21
IT8268243A0 (it) 1982-10-25
US5071619A (en) 1991-12-10
FR2517885A1 (fr) 1983-06-10
US4885135A (en) 1989-12-05
DE3237385A1 (de) 1983-06-09
GB2116208B (en) 1985-12-04
KR890003143B1 (ko) 1989-08-23
IT1156088B (it) 1987-01-28
FR2517885B1 (fr) 1987-01-30
MY8700920A (en) 1987-12-31
NL8203706A (nl) 1983-07-01
SG93487G (en) 1988-09-16

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