HK1253218A1 - 與屏蔽的模塊的製造相關的裝置和方法 - Google Patents

與屏蔽的模塊的製造相關的裝置和方法

Info

Publication number
HK1253218A1
HK1253218A1 HK18112499.1A HK18112499A HK1253218A1 HK 1253218 A1 HK1253218 A1 HK 1253218A1 HK 18112499 A HK18112499 A HK 18112499A HK 1253218 A1 HK1253218 A1 HK 1253218A1
Authority
HK
Hong Kong
Prior art keywords
fabrication
devices
methods related
shielded modules
shielded
Prior art date
Application number
HK18112499.1A
Other languages
English (en)
Inventor
Yi Liu
Anthony James Lobianco
Matthew Sean Read
Hoang Mong Nguyen
Howard E Chen
Original Assignee
天工方案公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天工方案公司 filed Critical 天工方案公司
Publication of HK1253218A1 publication Critical patent/HK1253218A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/32051—Deposition of metallic or metal-silicide layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
HK18112499.1A 2015-09-30 2018-09-28 與屏蔽的模塊的製造相關的裝置和方法 HK1253218A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201562235437P 2015-09-30 2015-09-30

Publications (1)

Publication Number Publication Date
HK1253218A1 true HK1253218A1 (zh) 2019-06-14

Family

ID=58427974

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18112499.1A HK1253218A1 (zh) 2015-09-30 2018-09-28 與屏蔽的模塊的製造相關的裝置和方法

Country Status (6)

Country Link
US (3) US10192785B2 (zh)
KR (1) KR102647496B1 (zh)
CN (1) CN108292647B (zh)
HK (1) HK1253218A1 (zh)
TW (1) TWI720028B (zh)
WO (1) WO2017059189A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106463474A (zh) * 2014-05-12 2017-02-22 天工方案公司 用于处理单片化射频单元的设备和方法
TWI720028B (zh) * 2015-09-30 2021-03-01 美商西凱渥資訊處理科技公司 關於屏蔽模組之製造的裝置及方法
SG10201509996UA (en) * 2015-12-04 2017-07-28 Rokko Systems Pte Ltd Improved substrate processing and apparatus
JP2017200183A (ja) 2016-04-29 2017-11-02 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. 遮蔽されたダイバーシティ受信モジュール
WO2018045570A1 (zh) * 2016-09-09 2018-03-15 华为技术有限公司 一种封装方法、封装装置及终端
KR20190067839A (ko) * 2016-10-04 2019-06-17 스카이워크스 솔루션즈, 인코포레이티드 오버몰드 구조를 갖는 양면 라디오-주파수 패키지
TWI712104B (zh) 2020-01-10 2020-12-01 力成科技股份有限公司 晶片固定裝置
CN113903831B (zh) * 2021-09-29 2023-07-25 德鸿半导体设备(浙江)有限公司 基片处理装置及其方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4632871A (en) * 1984-02-16 1986-12-30 Varian Associates, Inc. Anodic bonding method and apparatus for X-ray masks
JPH08186191A (ja) 1994-12-28 1996-07-16 Matsushita Electric Works Ltd チップキャリア
JPH0992602A (ja) * 1995-09-26 1997-04-04 Canon Inc マスク構造体及びその製造方法
JP3592924B2 (ja) * 1998-03-11 2004-11-24 松下電器産業株式会社 Ｉｃチップの供給方法、供給装置、及びそれに使用する短冊テープ状支持体
US6713854B1 (en) * 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
JP2002198635A (ja) * 2000-12-27 2002-07-12 Matsushita Electric Ind Co Ltd 配線板及びその製造方法
US20030034557A1 (en) 2001-08-16 2003-02-20 Gupta Prem Swarup Chip carrier for a semiconductor chip module
US6521479B1 (en) * 2001-12-28 2003-02-18 Texas Instruments Incorporated Repackaging semiconductor IC devices for failure analysis
US6713857B1 (en) * 2002-12-05 2004-03-30 Ultra Tera Corporation Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package
JP4547377B2 (ja) 2004-05-11 2010-09-22 Ｓｐａｎｓｉｏｎ Ｊａｐａｎ株式会社 積層型半導体装置用キャリア及び積層型半導体装置の製造方法
US7645635B2 (en) * 2004-08-16 2010-01-12 Micron Technology, Inc. Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages
TWI326475B (en) 2007-03-03 2010-06-21 Siliconware Precision Industries Co Ltd Method for fabricating semiconductor device and carrier applied therein
US7701040B2 (en) * 2007-09-24 2010-04-20 Stats Chippac, Ltd. Semiconductor package and method of reducing electromagnetic interference between devices
JP5565068B2 (ja) * 2010-04-22 2014-08-06 セイコーエプソン株式会社 電気泳動表示装置及び電子機器
US8623699B2 (en) * 2010-07-26 2014-01-07 General Electric Company Method of chip package build-up
US20120037935A1 (en) * 2010-08-13 2012-02-16 Wen-Kun Yang Substrate Structure of LED (light emitting diode) Packaging and Method of the same
TWI452665B (zh) 2010-11-26 2014-09-11 矽品精密工業股份有限公司 具防靜電破壞及防電磁波干擾之封裝件及其製法
KR101385370B1 (ko) * 2011-10-17 2014-04-14 디테크 테크놀로지 주식회사 플립 칩 기판을 탑재하는 캐리어 및 플립 칩 방법
DE102012205230A1 (de) * 2012-03-30 2013-10-02 Sennheiser Electronic Gmbh & Co. Kg Mikrofon mit einer Mikrofonkapsel, dynamischer Schallgeber für Kopfhörer, Ohrhörer oder Headsets und Verfahren zum Herstellen einer Mikrofonkapsel oder eines Schallgebers
JP5874546B2 (ja) * 2012-06-21 2016-03-02 富士通株式会社 半導体装置の実装構造
CN106463474A (zh) * 2014-05-12 2017-02-22 天工方案公司 用于处理单片化射频单元的设备和方法
KR101479248B1 (ko) * 2014-05-28 2015-01-05 (주) 씨앤아이테크놀로지 액상 점착제를 이용한 반도체 패키지의 전자파 차폐를 위한 스퍼터링 방법 및 이를 위한 스퍼터링 장치
US20160099192A1 (en) * 2014-07-31 2016-04-07 Skyworks Solutions, Inc. Dual-sided radio-frequency package having ball grid array
KR101501735B1 (ko) * 2014-09-23 2015-03-12 제너셈(주) 반도체패키지의 ｅｍｉ 쉴드 처리공법
US10354958B2 (en) * 2014-10-01 2019-07-16 Nxp Usa, Inc. Through package circuit in fan-out wafer level package
US20160111375A1 (en) * 2014-10-17 2016-04-21 Tango Systems, Inc. Temporary bonding of packages to carrier for depositing metal layer for shielding
TWI720028B (zh) * 2015-09-30 2021-03-01 美商西凱渥資訊處理科技公司 關於屏蔽模組之製造的裝置及方法

Also Published As

Publication number Publication date
US20170117184A1 (en) 2017-04-27
US20190214300A1 (en) 2019-07-11
TW201724292A (zh) 2017-07-01
TWI720028B (zh) 2021-03-01
WO2017059189A1 (en) 2017-04-06
US10192785B2 (en) 2019-01-29
US20230420301A1 (en) 2023-12-28
KR20180063887A (ko) 2018-06-12
CN108292647A (zh) 2018-07-17
KR102647496B1 (ko) 2024-03-15
CN108292647B (zh) 2022-09-30
US11682585B2 (en) 2023-06-20

Similar Documents

Publication Publication Date Title
HK1253218A1 (zh) 與屏蔽的模塊的製造相關的裝置和方法
HK1217908A1 (zh) 治療膽管癌的方法
SG11201507379YA (en) Equipment assembly and method of processing particles
EP3588586C0 (en) PHOTOVOLTAIC DEVICES AND METHOD OF PRODUCTION
SG11201504442YA (en) Semiconductor device and method of making semiconductor device
GB201402508D0 (en) Semiconductor modification process and structures
SG11201602321YA (en) Emi shielding method of semiconductor packages
PL3107651T3 (pl) Układ reaktora i sposób zastosowania takiego układu reaktora
HK1254333A1 (zh) 將零件臨時安裝到骨骼的設備和方法
EP2992556A4 (en) PHOTOVOLTAIC DEVICES AND METHOD FOR THE PRODUCTION THEREOF
EP2943049A4 (en) ELECTRONIC DEVICE AND METHOD OF MANUFACTURING A SHIELDING ELEMENT
PL3071230T3 (pl) Kompozycje do leczenia reumatoidalnego zapalenia stawów oraz sposoby ich stosowania
HK1216052A1 (zh) 屏蔽應用的陶瓷基板的金屬化的器件及方法
GB2525555B (en) Methods of processing cocoa
HK1223205A1 (zh) 與用於射頻模塊的接口相關的裝置和方法
SG11201509376PA (en) Glass structures and methods of creating and processing glass structures
EP2973742A4 (en) PHOTOVOLTAIC DEVICES AND METHOD OF MAKING
GB201720310D0 (en) Semiconductor structure and process
GB2517285B (en) Semiconductor devices and methods of manufacture
HK1207449A1 (zh) 用於模塊的有效執行的方法和設備
GB201318737D0 (en) Photovoltaic Device and method of Manufacture
TWI563617B (en) Substrate structure and method of manufacture
EP2962332A4 (en) PHOTOVOLTAIC DEVICES AND METHODS OF MANUFACTURE
TWI560899B (en) Roll-to-roll manufacturing equipment and system thereof
HK1225635A1 (zh) 用於類風濕性關節炎治療的組合物及使用該組合物的方法