WO2018045570A1 - 一种封装方法、封装装置及终端 - Google Patents

一种封装方法、封装装置及终端 Download PDF

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Publication number
WO2018045570A1
WO2018045570A1 PCT/CN2016/098602 CN2016098602W WO2018045570A1 WO 2018045570 A1 WO2018045570 A1 WO 2018045570A1 CN 2016098602 W CN2016098602 W CN 2016098602W WO 2018045570 A1 WO2018045570 A1 WO 2018045570A1
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WO
WIPO (PCT)
Prior art keywords
package
module
housing
glue layer
substrate film
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PCT/CN2016/098602
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English (en)
French (fr)
Inventor
王洪星
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华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to KR1020197009826A priority Critical patent/KR102208888B1/ko
Priority to CN201680080832.6A priority patent/CN108605064B/zh
Priority to EP16915504.1A priority patent/EP3407576B1/en
Priority to JP2018543214A priority patent/JP6669348B2/ja
Priority to PCT/CN2016/098602 priority patent/WO2018045570A1/zh
Priority to US16/331,835 priority patent/US10827051B2/en
Publication of WO2018045570A1 publication Critical patent/WO2018045570A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly

Definitions

  • the embodiments of the present invention relate to the field of communications, and in particular, to a packaging method, a packaging device, and a terminal.
  • a narrow-frame mobile phone generally refers to a mobile phone with a narrow display space A of the display panel and a space D of the mobile phone body frame.
  • FIG. 2 which is a schematic diagram of a side cross-sectional structure of a current narrow-frame mobile phone
  • a display module 11 the display module 11 can have a touch function
  • a screen lens 13 Cross Glass
  • CG when packaging is performed, firstly, the display module 11 and the screen lens 13 are placed in the casing 12 of the mobile phone for alignment, so that the inner surface of the casing 12 is reserved between the display module 11 and the screen lens 13.
  • a certain gap 14 is further filled into the gap seal 14 to seal the frame seal, and the casing 12 is sealed with the display module 11 to form a mobile phone module.
  • the infusion technology of the frame sealant is not mature at present, and the hot melt adhesive is used as the frame sealant.
  • the hot melt adhesive melted at a high temperature needs to be sprayed to the slit 14, and the spray direction or the amount of glue is inaccurate.
  • the glue layer filled in the gap 14 is not flat and even, or the hot melt glue overflows or is sputtered onto the surface of the mobile phone module.
  • the packaged mobile phone module needs to be polished by manual or polishing equipment. Not only reduces the packaging efficiency, but also may cause damage to the components in the mobile phone module and reduce the yield of the mobile phone module.
  • the embodiment of the invention provides a packaging method, a packaging device and a terminal, which can improve the uniformity of the adhesive layer, reduce the probability of overflowing, and thereby improve the packaging efficiency and yield of the terminal.
  • an embodiment of the present invention provides a packaging method, including: forming a glue layer on a package surface of a package module, the shape and size of the glue layer being compatible with the package surface; and a package in which the glue layer is formed
  • the module is fixed in the housing of the terminal, and the glue layer is filled between the package surface and the side wall of the housing.
  • the size and shape of the glue layer can be more precisely controlled when the glue layer is directly formed on the package surface, so that the glue layer is more uniform and the glue overflow phenomenon is avoided. , thereby improving the packaging efficiency and yield of the terminal.
  • forming a glue layer on a package surface of the package module comprises: coating a sealant on the substrate film; and coating the back side of the substrate film with a sealant Pressing onto the package surface to adhere the sealant to the package surface; removing the substrate film to form the adhesive layer, so that the sealant is attached to the package module by transfer The surface of the package forms a glue layer to make the glue layer more uniform.
  • pressing a side of the substrate film coated with the sealant to the package surface comprises: adjusting a relative position between the substrate film and the package surface, so that The vertical projection of the sealant on the package surface coincides with the package surface; the substrate film is moved to the package surface, and pressure is applied to the substrate film.
  • removing the substrate film comprises: tearing off the substrate film before the frame seal rubber is completely cured, because the frame sealant is not easily separated from the substrate film after being completely cured, The substrate film can be directly peeled off before the frame sealant is completely cured, simplifying the process of removing the substrate film.
  • the method further comprises: grinding the shape and size of the glue layer, the shape and size of the surface of the glue layer contacting the package surface, and the shape and size of the package surface. the same.
  • the position of the housing is not limited by the grinding, so that the grinding complexity and the length of time can be reduced.
  • the package module formed with the adhesive layer is fixed in the housing of the terminal, and includes: coating a double-sided adhesive on the bottom surface of the package module with the adhesive layer; The package module is fixed in the housing.
  • the package module formed with the adhesive layer is fixed in the housing of the terminal, comprising: assembling a package module formed with a glue layer into the housing; heating the glue layer to make The adhesive layer restores tack; the package module is secured within the housing by the adhesive layer.
  • the package module includes oppositely disposed screen lenses and The display module, the screen lens and the surface of the display module perpendicular to the display surface form a package surface.
  • an embodiment of the present invention provides a terminal, including a housing, and a package module disposed in the housing, and the package and the package module are packaged by the above packaging method.
  • an embodiment of the present invention provides a packaging device, including a control module, and an adsorption fixture and a fixed module connected to the control module.
  • the control module is configured to control a package surface of the adsorption module in the package module. Forming a glue layer, the shape and size of the glue layer are adapted to the package surface; and controlling the fixing module to fix the package module formed with the glue layer in the housing of the terminal, so that the glue layer is filled on the package surface Between the side wall of the housing.
  • control module is specifically configured to apply a sealant on the substrate film; and control the adsorption jig to press the side of the substrate film coated with the sealant to the package On the surface, the sealant is adhered to the package surface; the substrate film is removed to form the adhesive layer.
  • control module is specifically configured to control the adsorption fixture to adjust the relative position between the substrate film and the package surface, so that the projection of the sealant on the package surface coincides with the package surface. Controlling the adsorption jig to move the substrate film to the package surface and apply pressure to the substrate film.
  • control module is specifically configured to apply a double-sided tape to the bottom surface of the package module; and the control fixing module fixes the package module in the casing through the double-sided tape.
  • control module is specifically configured to control the fixing module to assemble the package module into the housing; heating the adhesive layer to restore the adhesive layer; and applying the adhesive layer through the adhesive layer The module is fixed in the housing.
  • the names of the foregoing packaging device, the terminal, and the package module are not limited to the device or the function module itself. In actual implementation, these devices or function modules may appear under other names. As long as the functions of the respective devices or functional modules are similar to the present invention, they are within the scope of the claims and equivalents thereof.
  • FIG. 1 is a schematic diagram of a narrow-frame mobile phone in the prior art
  • FIG. 2 is a schematic cross-sectional structural view of a narrow-frame mobile phone in the prior art
  • FIG. 3 is a schematic flowchart diagram of a packaging method according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic diagram 1 of a principle of a packaging method according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram 2 of a principle of a packaging method according to an embodiment of the present disclosure
  • FIG. 6 is a schematic diagram 3 of a principle of a packaging method according to an embodiment of the present disclosure.
  • FIG. 7 is a schematic diagram 4 of a principle of a packaging method according to an embodiment of the present disclosure.
  • FIG. 8 is a schematic diagram 5 of a principle of a packaging method according to an embodiment of the present disclosure.
  • FIG. 9 is a schematic diagram 6 of a principle of a packaging method according to an embodiment of the present disclosure.
  • FIG. 10 is a schematic diagram VII of a packaging method according to an embodiment of the present disclosure.
  • FIG. 11 is a schematic structural diagram of a packaging device according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more of the features either explicitly or implicitly. In the description of the present invention, "a plurality” means two or more unless otherwise stated.
  • Embodiments of the present invention provide a packaging method applicable to various types of terminals, such as a mobile phone, a tablet computer, a notebook computer, a UMPC (Ultra-mobile Personal Computer), a netbook, and a PDA (Personal Digital Assistant).
  • Terminal devices such as personal digital assistants are especially suitable for the packaging process of narrow-frame terminals.
  • a narrow bezel terminal usually assembles a package module to be packaged, for example, a display module and a screen lens, into a housing of the terminal, and a housing with the housing. A certain gap is reserved, and the hot melt adhesive is poured into the gap by spraying or the like, so that the package module is fixed in the casing and protects the package module.
  • an embodiment of the present invention provides a packaging method, as shown in FIG. 3, including:
  • the package module refers to one or more components that need to be packaged into the housing of the terminal.
  • the package module may include a relatively disposed screen glass (Cover Glass, CG) and a display module.
  • the lens may be a transparent protective substrate, or may be a TP (Touch Panel) integrated with a touch function, which is not limited in the embodiment of the present invention; and the display module may be an LCD (Liquid Crystal Display).
  • the display may be a touch display integrated with a touch function, which is not limited in this embodiment of the present invention.
  • the package module may further include an LCD protection frame, and the LCD protection frame may be used for fixing and protecting the screen lens and the display.
  • the module is not limited in this embodiment of the present invention.
  • the package surface of the package module refers to a surface of the package module that needs to be packaged with the package.
  • the package surface is a side of the package module.
  • the package surface may be a display module. The four surfaces that are perpendicular to the display surface.
  • a glue layer 202 corresponding to the shape and size of the package surface 201 may be formed on the package surface 201 of the package module 21 before the package module 21 is assembled with the housing.
  • the size and shape of the adhesive layer 202 can be more precisely controlled when the adhesive layer 202 is directly formed on the package surface 201, so that the adhesive layer 202 is more Uniformity, avoiding the phenomenon of overflow, which improves the packaging efficiency and yield of the terminal.
  • the size and shape of the surface of the adhesive layer 202 contacting the package surface 201 may be the same as the shape and size of the package surface 201, or the size of the surface of the adhesive layer 202 contacting the package surface 201 may be smaller than the package surface.
  • the shape of the surface of the adhesive layer 202 contacting the package surface 201 may be the same as or different from the shape of the package surface 201, and the present invention The embodiment does not impose any limitation on this.
  • the method for forming the glue layer 202 on the package surface 201 of the package module 21 is not limited, and those skilled in the art can operate according to actual experience. Illustratively, the following provides a transfer.
  • the method of attaching the sealant to the encapsulation surface 201 of the package module 21 to form the adhesive layer 202 includes the following steps 301-303:
  • a certain thickness of the sealant 32 can be coated on the substrate film 31 by a dispensing technique.
  • the shape of the sealant 32 can be controlled according to the shape and size of the package surface 201. And size.
  • the frame sealant in the embodiment of the present invention may be any viscous colloid, for example, a hot melt adhesive, which is not limited in the embodiment of the present invention.
  • the substrate film 31 may be made of any material that does not chemically react with the sealant 32.
  • the substrate film 31 may be a PET (polyethylene terephthalate) film. sheet.
  • step 302 first, the relative position between the substrate film 31 and the package surface 201 can be adjusted, so that the vertical projection of the sealant 32 on the package surface 201 coincides with the package surface 201.
  • the side of the substrate film 31 not coated with the sealant 32 may be adsorbed by using an adsorption jig, and then the adsorption jig is aligned with the package surface 201 by adjusting its position, as shown in FIG.
  • the adsorption jig 33 moves the substrate film 31 to the package surface 201, and applies pressure to the substrate film 31 to cause the frame seal on the substrate film 31. 32 is pasted on the package surface 201.
  • the substrate film 31 and the sealant 32 are attached to the package surface 201.
  • the package faces 201 of the package module 21 there may be a plurality of package faces 201 of the package module 21.
  • the package lens 21 and the display module 42 are oppositely disposed.
  • the side faces are all package faces.
  • the sealant 32 can be coated on the two substrate films 31 respectively.
  • the two can be simultaneously applied by the adsorption jig 33.
  • the side of the substrate film 31 coated with the sealant 32 is pressed onto the two package faces 201, so that not only the regular rubber faces can be formed on the two package faces, but also the screen lens 41 and the display mode can be made.
  • the position of the group 42 is aligned at the glue face, reducing the step difference between the screen lens 41 and the display module 42.
  • the thickness of the sealant 32 By adjusting the thickness of the sealant 32, the size of the entire package module 21 in the direction perpendicular to the package surface 201 can be controlled, thereby improving the dimensional accuracy of the terminal.
  • step 303 after the substrate film 31 of FIG. 7 is removed, a glue layer 202 as shown in FIG. 4 can be formed on the package surface 201.
  • the substrate film 31 can be directly peeled off before the sealant 32 is completely cured.
  • the sealant 32 since the sealant 32 is pressed onto the package surface 201 in step 302, the sealant 32 may be deformed.
  • the adhesive layer 202 obtained after the substrate film 31 is removed, the adhesive layer 202 and The surface that the package surface 201 contacts may be the size of the package surface 201
  • the shape of the adhesive layer 202 may be higher than that of the package module. Therefore, the shape and size of the surface of the adhesive layer 202 contacting the package surface 201 and the surface of the package surface 201 may be The shape and size are the same, and at the same time, the glue layer 202 is not beyond the height of the package module.
  • the adhesive layer 202 can be attached to the package surface 201 of the package module 21 by transferring the sealant, and the adhesive layer 202 is formed on the package surface 201.
  • a double-sided tape 22, such as foam rubber, may be attached to the bottom surface of the package module 21; then the package module 21 is fixed in the casing 23 by the double-sided tape 22. At this time, the rubber layer 202 is filled between the sidewall of the casing 23 and the package module 21 to closely match the casing 23 and the package module 21, and the function of protecting the package module 21 is achieved.
  • a double-sided tape 22 such as foam rubber
  • the package module 21 may be first assembled into the housing 23 such that the adhesive layer 202 is filled between the package surface 201 and the sidewall of the housing 23. At this time, the adhesive layer 202 is performed. Heating, for example, using the laser to scan the adhesive layer 202, the adhesive layer 202 is restored to the adhesive layer. Thus, the adhesive layer 202 can adhere the package module 21 and the housing 23 together to fix the package module 21 in the housing 23.
  • an embodiment of the present invention provides a packaging method.
  • a glue layer is formed on a package surface of a package module.
  • a shape and a size of a surface of the glue layer contacting the package surface may be different from a shape of the package surface.
  • the same size; further, the package module formed with the glue layer is fixed in the housing of the terminal, so that the glue is directly formed on the package surface compared to the prior art, the glue is filled from the smaller gap.
  • the size and shape of the glue layer can be controlled more precisely, so that the glue layer is more uniform, and the phenomenon of overflowing glue is avoided, thereby improving the packaging efficiency and yield of the terminal.
  • an embodiment of the present invention further provides a terminal, including a housing, and The package module is disposed in the housing.
  • the packaging process of the housing and the package module can be referred to the detailed description in the above embodiments.
  • an embodiment of the present invention further provides a packaging device.
  • a functional module may be divided into a packaging device.
  • each functional module may be divided according to each function, or two or more functions may be used.
  • the functionality is integrated in a processing module.
  • the above integrated modules can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of the module in the embodiment of the present invention is schematic, and is only a logical function division, and the actual implementation may have another division manner.
  • FIG. 11 shows a possible structural diagram of the packaging device involved in the above embodiment, the packaging device comprising: a control module 51, and an adsorption fixture connected to the control module 51. 33 and fixed module 52.
  • the control module 51 is configured to control and control the action of the package device.
  • the control module 51 is configured to control the adsorption jig 33 to perform step 101 in FIG. 3, and the control module 51 is further configured to control the fixed module 52 to perform step 102 in FIG. And/or other processes for the techniques described herein. All the related content of the steps involved in the foregoing method embodiments may be referred to the functional descriptions of the corresponding functional modules, and details are not described herein again.
  • the functions described herein can be implemented in hardware, software, firmware, or any combination thereof.
  • the functions may be stored in a computer readable medium or transmitted as one or more instructions or code on a computer readable medium.
  • Computer readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one location to another.
  • a storage medium may be any available media that can be accessed by a general purpose or special purpose computer.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明的实施例提供一种封装方法、封装装置及终端，涉及通信领域，可提高胶层的均一性，降低溢胶几率，从而提高终端的封装效率和良率。该方法包括：在封装模组的封装面上形成胶层，该胶层的形状和大小与该封装面相适应；将形成有该胶层的封装模组固定在终端的壳体内，使所述胶层填充在所述封装面和所述壳体的侧壁之间。

Description

一种封装方法、封装装置及终端 技术领域
本发明实施例涉及通信领域，尤其涉及一种封装方法、封装装置及终端。
背景技术
如图1所示，窄边框手机，一般是指显示面板的有效显示区AA与手机机身边框间距D较窄的手机。如图2所示，为目前窄边框手机的侧边剖面结构示意图，手机的壳体12内设置有显示模组11(该显示模组11可具有触控功能)和屏幕镜片13(Cover Glass，CG)，在进行封装的时候，首先在手机的壳体12内放置显示模组11和屏幕镜片13进行对位，使壳体12的内表面与显示模组11和屏幕镜片13之间预留一定缝隙14，进而，在缝隙14内灌注至封框胶，使壳体12与显示模组11密封，形成手机模组。
但是，目前封框胶的灌注技术并不成熟，以热熔胶为封框胶举例，在灌注过程中需要将经高温融化后的热熔胶喷射至缝隙14，喷射方向或胶量不准确时，会使缝隙14内填充的胶层不够平整均匀，或者，使热熔胶溢出或溅射到手机模组的表面，此时，还需要通过人工或打磨设备对封装后的手机模组进行打磨，不仅降低了封装效率，还可能导致手机模组内的器件损坏，降低手机模组的良率。
发明内容
本发明的实施例提供一种封装方法、封装装置及终端，可提高胶层的均一性，降低溢胶几率，从而提高终端的封装效率和良率。
为达到上述目的，本发明的实施例采用如下技术方案：
第一方面，本发明的实施例提供一种封装方法，包括：在封装模组的封装面上形成胶层，该胶层的形状和大小与该封装面相适应；将形成有该胶层的封装模组固定在终端的壳体内，胶层填充在封装面和壳体的侧壁之间。这样，相比于现有技术中从较小的缝隙中灌 注封框胶而言，在封装模组与壳体进行装配之前，直接在封装面上形成胶层时可以更加精准的控制胶层的大小和形状，使胶层更加均匀，避免发生溢胶现象，从而提高了终端的封装效率和良率。
在一种可能的设计中，在封装模组的封装面上形成胶层，包括：在衬底膜片上涂覆封框胶；将该衬底膜片上涂覆有封框胶的一侧按压至该封装面上，使该封框胶粘贴在该封装面上；去除该衬底膜片，形成该胶层，这样，通过转印的方式将封框胶贴附到封装模组的封装面，形成胶层，使胶层更加均匀。
在一种可能的设计中，将该衬底膜片上涂覆有封框胶的一侧按压至该封装面上，包括：调整该衬底膜片与该封装面之间的相对位置，使该封框胶在该封装面的垂直投影与该封装面重合；将该衬底膜片移动至该封装面，并向该衬底膜片施加压力。
在一种可能的设计中，去除该衬底膜片，包括：在该封框胶完全固化之前，撕去该衬底膜片，由于封框胶完全固化后不易与衬底膜片分离，因此，可在封框胶完全固化之前直接撕去衬底膜片，简化去除衬底膜片的工艺。
在一种可能的设计中，在去除该衬底膜片之后，还包括：打磨该胶层的形状和大小，使胶层与封装面接触的面的形状和大小，与封装面的形状和大小相同。在上述打磨过程中，由于封装模组还未装配至终端的壳体内，因此，打磨时不会受到壳体位置的限制，从而可以降低打磨的复杂度和花费的时长。
在一种可能的设计中，将形成有该胶层的封装模组固定在终端的壳体内，包括：在形成有胶层的封装模组的底面粘贴双面胶；通过该双面胶将该封装模组固定在该壳体内。
在一种可能的设计中，将形成有该胶层的封装模组固定在终端的壳体内，包括：将形成有胶层的封装模组装配至该壳体内；对该胶层进行加热，使该胶层恢复粘性；通过该胶层将该封装模组固定在该壳体内。
在一种可能的设计中，该封装模组包括相对设置的屏幕镜片和 显示模组，屏幕镜片和显示模组中与显示面垂直的表面组成了封装面。
第二方面，本发明的实施例提供一种终端，包括壳体，以及设置在该壳体内的封装模组，该壳体与该封装模组之间通过上述封装方法进行封装。
第三方面，本发明实施例提供了一种封装装置，包括控制模块，以及与该控制模块均相连的吸附夹具和固定模块；该控制模块，用于控制该吸附夹具在封装模组的封装面上形成胶层，该胶层的形状和大小与该封装面相适应；以及，控制该固定模块将形成有该胶层的封装模组固定在终端的壳体内，使该胶层填充在该封装面和该壳体的侧壁之间。
在一种可能的设计中，该控制模块，具体用于在衬底膜片上涂覆封框胶；控制吸附夹具将该衬底膜片上涂覆有封框胶的一侧按压至该封装面上，使该封框胶粘贴在该封装面上；去除该衬底膜片，形成该胶层。
在一种可能的设计中，该控制模块，具体用于控制吸附夹具调整该衬底膜片与该封装面之间的相对位置，使该封框胶在该封装面的投影与该封装面重合；控制吸附夹具将该衬底膜片移动至该封装面，并向该衬底膜片施加压力。
在一种可能的设计中，该控制模块，具体用于在该封装模组的底面粘贴双面胶；控制固定模块通过该双面胶将该封装模组固定在该壳体内。
在一种可能的设计中，该控制模块，具体用于控制固定模块将该封装模组装配至该壳体内；对该胶层进行加热，使该胶层恢复粘性；通过该胶层将该封装模组固定在该壳体内。
本发明实施例中，上述封装装置、终端以及封装模组的名字对设备或功能模块本身不构成限定，在实际实现中，这些设备或功能模块可以以其他名称出现。只要各个设备或功能模块的功能和本发明类似，属于本发明权利要求及其等同技术的范围之内。
另外，第二方面至第三方面中任一种设计方式所带来的技术效果可参见第一方面中不同设计方式所带来的技术效果，此处不再赘述。
本发明的这些方面或其他方面在以下实施例的描述中会更加简明易懂。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。
图1为现有技术中窄边框手机的示意图；
图2为现有技术中窄边框手机的侧边剖面结构示意图；
图3为本发明实施例提供的一种封装方法的流程示意图；
图4为本发明实施例提供的一种封装方法的原理示意图一；
图5为本发明实施例提供的一种封装方法的原理示意图二；
图6为本发明实施例提供的一种封装方法的原理示意图三；
图7为本发明实施例提供的一种封装方法的原理示意图四；
图8为本发明实施例提供的一种封装方法的原理示意图五；
图9为本发明实施例提供的一种封装方法的原理示意图六；
图10为本发明实施例提供的一种封装方法的原理示意图七；
图11为本发明实施例提供的一种封装装置的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。
另外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
本文中术语“和/或”，仅仅是一种描述关联对象的关联关系， 表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
本发明的实施例提供一种封装方法，可应用于各种类型的终端，例如手机、平板电脑、笔记本电脑、UMPC(Ultra-mobile Personal Computer，超级移动个人计算机)、上网本、PDA(Personal Digital Assistant，个人数字助理)等终端设备，尤其适用于窄边框终端的封装过程中。
以窄边框终端为例，目前，窄边框终端在封装过程中通常是先将待封装的封装模组，例如，显示模组和屏幕镜片等部件，装配至终端的壳体内，并与壳体之间预留一定缝隙，进而在缝隙内通过喷射等方式灌注热熔胶，使封装模组固定在壳体内，并对封装模组产生保护作用。
但是，由于预留的缝隙较为狭窄，上述封装方法很难在该缝隙内将热熔胶填充均匀，且容易发生溢胶现象。对此，本发明的实施例提供一种封装方法，如图3所示，包括：
101、在封装模组的封装面上形成胶层，该胶层的形状和大小与封装面相适应。
其中，该封装模组是指需要封装至终端的壳体内的一个或多个部件，通常，该封装模组可包括相对设置的屏幕镜片(Cover Glass，CG)和显示模组，其中，上述屏幕镜片可以为透明的保护基板，也可能是集成有触控功能的TP(TouchPanel，触控面板)，本发明实施例对此不作任何限定；而上述显示模组可以为LCD(Liquid Crystal Display，液晶显示器)，也可以为集成有触控功能的触控显示器，本发明实施例对此不作任何限定。
需要说明的是，本领域技术人员可以根据实际经验设置上述封装模组内的部件，例如，上述封装模组中可进一步包括LCD保护框，该LCD保护框可用于固定以及保护上述屏幕镜片和显示模组，本发明实施例对此不作任何限定。
进一步地，封装模组的封装面，是指封装模组中需要与壳体封装的表面，通常，在终端中，该封装面为封装模组的侧面，例如，该封装面可以为显示模组中与显示面垂直的四个表面。
在步骤101中，如图4所示，可以在封装模组21与壳体进行装配之前，在封装模组21的封装面201上，形成与封装面201的形状和大小相适应的胶层202，相比于现有技术中从较小的缝隙中灌注封框胶而言，直接在封装面201上形成胶层202时可以更加精准的控制胶层202的大小和形状，使胶层202更加均匀，避免发生溢胶现象，从而提高了终端的封装效率和良率。
示例性的，胶层202与封装面201接触的面的大小和形状，可以与封装面201的形状和大小相同，或者，胶层202与封装面201接触的面的大小，也可以小于封装面201的大小，当胶层202与封装面201接触的面的大小小于封装面201的大小时，胶层202与封装面201接触的面的形状可以与封装面201的形状相同或不同，本发明实施例对此不作任何限制。
具体的，本发明实施例对在封装模组21的封装面201上形成胶层202的方法不做限定，本领域技术人员可以根据实际经验进行操作，示例性的，以下提供一种通过转印的方式将封框胶贴附到封装模组21的封装面201，形成胶层202的方法，具体包括下述步骤301-303：
301、在衬底膜片上涂覆封框胶。
具体的，如图5所示，可以通过点胶技术在衬底膜片31上涂覆一定厚度的封框胶32，此时，可以根据封装面201的形状和大小控制封框胶32的形状和大小。
其中，本发明实施例中涉及到的封框胶可以是任何具有粘性的胶体，例如，热熔胶，本发明实施例对此不作任何限定。
另外，该衬底膜片31可以由任意不与封框胶32发生化学反应的材料制成，例如，该衬底膜片31可以为PET(Polyethylene terephthalate，聚对苯二甲酸乙二酯)膜片。
302、将衬底膜片上涂覆有封框胶的一侧按压至封装面上，使封框胶粘贴在封装面上。
具体的，在步骤302中，首先，可以调整衬底膜片31与封装面201之间的相对位置，使封框胶32在封装面201的垂直投影与该封装面201重合。例如，可以使用吸附夹具吸附衬底膜片31未涂覆封框胶32的一侧，然后吸附夹具通过调整自身的位置与封装面201进行对位，如图6所示，当封框胶32在封装面201的投影与该封装面201重合时，吸附夹具33将衬底膜片31移动至封装面201，并向衬底膜片31施加压力，使衬底膜片31上的封框胶32粘贴在封装面201上，此时，撤走吸附夹具33后，如图7所示，衬底膜片31和封框胶32均粘贴在封装面201上。
另外，封装模组21的封装面201可能有多个，如图8所示，以封装模组21为相对设置的屏幕镜片41和显示模组42为例，此时，作为终端侧边的两个侧面均为封装面，那么，可以分别在两个衬底膜片31上涂覆封框胶32，进而，在步骤302中，如图8所示，可以通过吸附夹具33同时将这两个衬底膜片31上涂覆有封框胶32的一侧，按压至两个封装面201上，这样不仅可以在两个封装面上形成规则的胶面，还可以使屏幕镜片41和显示模组42的位置在胶面处对齐，降低屏幕镜片41和显示模组42之间的段差。
当然，也可以通过调整封框胶32的厚度，来控制整个封装模组21在与封装面201垂直的方向上的尺寸，从而提高终端的尺寸精度。
303、去除衬底膜片，形成胶层。
在步骤303中，去除图7中的衬底膜片31后，即可在封装面201上形成如图4所示的胶层202。
具体的，由于封框胶32完全固化后不易与衬底膜片31分离，因此，可在封框胶32完全固化之前，直接撕去衬底膜片31即可。
另外，由于在步骤302中将封框胶32按压至封装面201上时，可能会使封框胶32产生形变，此时，去除衬底膜片31后得到的胶层202，胶层202与封装面201接触的面可能与封装面201的大小 和形状有所偏差，同时，胶层202的高度也可能高出封装模组，因此，可以通过打磨胶层202，使胶层202与封装面201接触的面的形状和大小与封装面201的形状和大小相同，同时，使胶层202不超出封装模组高度。
可以理解的是，在上述打磨过程中，由于封装模组21还未装配至终端的壳体内，因此，打磨时不会受到壳体位置的限制，从而可以降低打磨的复杂度和花费的时长。
至此，通过执行步骤301-303，可以通过转印封框胶的方式将胶层202贴附到封装模组21的封装面201，在封装面201上形成胶层202。
102、将形成有胶层的封装模组固定在终端的壳体内。
具体的，在步骤102中，如图9所示，可以在封装模组21的底面粘贴双面胶22，例如泡棉胶；然后通过双面胶22将封装模组21固定在壳体23内，此时，壳体23的侧壁与封装模组21之间填充有胶层202，使壳体23与封装模组21之间紧密配合，并达到保护封装模组21的功能。
又或者，如图10所示，可以先将封装模组21装配至壳体23内，使胶层202填充在封装面201和壳体23的侧壁之间，此时，对胶层202进行加热，例如，使用激光扫描胶层202，使胶层202恢复粘性，这样，胶层202可以将封装模组21和壳体23粘连在一起，使封装模组21固定在壳体23内。
至此，本发明的实施例提供一种封装方法，首先，在封装模组的封装面上形成胶层，进一步的，该胶层与封装面接触的面的形状和大小可以与封装面的形状和大小相同；进而，将形成有胶层的封装模组固定在终端的壳体内，这样，相比于现有技术中从较小的缝隙中灌注封框胶而言，直接在封装面上形成胶层时可以更加精准的控制胶层的大小和形状，使胶层更加均匀，避免发生溢胶现象，从而提高了终端的封装效率和良率。
进一步地，本发明的实施例还提供一种终端，包括壳体，以及 设置在壳体内的封装模组，其中，壳体与封装模组的封装过程可参见上述实施例中的详细阐述。
进一步地，本发明的实施例还提供一种封装装置，基于上述封装方法，可以对封装装置进行功能模块的划分，例如，可以对应各个功能划分各个功能模块，也可以将两个或两个以上的功能集成在一个处理模块中。上述集成的模块既可以采用硬件的形式实现，也可以采用软件功能模块的形式实现。需要说明的是，本发明实施例中对模块的划分是示意性的，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式。
在采用集成的单元的情况下，图11示出了上述实施例中所涉及的封装装置的一种可能的结构示意图，该封装装置包括：控制模块51，以及与控制模块51均相连的吸附夹具33和固定模块52。控制模块51用于对封装装置的动作进行控制管理，例如，控制模块51用于控制吸附夹具33执行图3中的步骤101，控制模块51还用于控制固定模块52执行图3中的步骤102，和/或用于本文所描述的技术的其它过程。其中，上述方法实施例涉及的各步骤的所有相关内容均可以援引到对应功能模块的功能描述，在此不再赘述。
本领域技术人员应该可以意识到，在上述一个或多个示例中，本发明所描述的功能可以用硬件、软件、固件或它们的任意组合来实现。当使用软件实现时，可以将这些功能存储在计算机可读介质中或者作为计算机可读介质上的一个或多个指令或代码进行传输。计算机可读介质包括计算机存储介质和通信介质，其中通信介质包括便于从一个地方向另一个地方传送计算机程序的任何介质。存储介质可以是通用或专用计算机能够存取的任何可用介质。
以上所述的具体实施方式，对本发明的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上所述仅为本发明的具体实施方式而已，并不用于限定本发明的保护范围，凡在本发明的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本发明的保护范围之内。

Claims (10)

  1. 一种封装方法，其特征在于，包括：
    在封装模组的封装面上形成胶层，所述胶层的形状和大小与所述封装面相适应；
    将形成有所述胶层的封装模组固定在终端的壳体内，所述胶层填充在所述封装面和所述壳体的侧壁之间。
  2. 根据权利要求1所述的方法，其特征在于，在封装模组的封装面上形成胶层，包括：
    在衬底膜片上涂覆封框胶；
    将所述衬底膜片上涂覆有封框胶的一侧按压至所述封装面上，使所述封框胶粘贴在所述封装面上；
    去除所述衬底膜片，形成所述胶层。
  3. 根据权利要求2所述的方法，其特征在于，将所述衬底膜片上涂覆有封框胶的一侧按压至所述封装面上，包括：
    调整所述衬底膜片与所述封装面之间的相对位置，使所述封框胶在所述封装面的垂直投影与所述封装面重合；
    将所述衬底膜片移动至所述封装面，并向所述衬底膜片施加压力。
  4. 根据权利要求2所述的方法，其特征在于，去除所述衬底膜片，包括：
    在所述封框胶完全固化之前，撕去所述衬底膜片。
  5. 根据权利要求2-4中任一项所述的方法，其特征在于，在去除所述衬底膜片之后，还包括：
    打磨所述胶层的形状和大小，使所述胶层与所述封装面接触的面的形状和大小与所述封装面的形状和大小相同。
  6. 根据权利要求1-5中任一项所述的方法，其特征在于，将形成有所述胶层的封装模组固定在终端的壳体内，包括：
    在形成有胶层的封装模组的底面粘贴双面胶；
    通过所述双面胶将所述封装模组固定在所述壳体内。
  7. 根据权利要求1-5中任一项所述的方法，其特征在于，将形成有所述胶层的封装模组固定在终端的壳体内，包括：
    将形成有胶层的封装模组装配至所述壳体内；
    对所述胶层进行加热，使所述胶层恢复粘性；
    通过所述胶层将所述封装模组固定在所述壳体内。
  8. 根据权利要求1-7中任一项所述的方法，其特征在于，所述封装模组包括相对设置的屏幕镜片CG和显示模组，所述CG和所述显示模组中与显示面垂直的表面组成了所述封装面。
  9. 一种终端，包括壳体，以及设置在所述壳体内的封装模组，其特征在于，所述壳体与所述封装模组之间通过如权利要求1-8中任一项所述的封装方法进行封装。
  10. 一种封装装置，其特征在于，包括控制模块，以及与所述控制模块均相连的吸附夹具和固定模块；
    所述控制模块，用于控制所述吸附夹具在封装模组的封装面上形成胶层，所述胶层的形状和大小与所述封装面相适应；以及，控制所述固定模块将形成有所述胶层的封装模组固定在终端的壳体内，使所述胶层填充在所述封装面和所述壳体的侧壁之间。
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CN108605064B (zh) 2020-08-14
EP3407576A4 (en) 2019-03-20
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