HK1222714A1 - 曝光裝置、曝光方法、以及組件製造方法 - Google Patents
曝光裝置、曝光方法、以及組件製造方法Info
- Publication number
- HK1222714A1 HK1222714A1 HK16110753.8A HK16110753A HK1222714A1 HK 1222714 A1 HK1222714 A1 HK 1222714A1 HK 16110753 A HK16110753 A HK 16110753A HK 1222714 A1 HK1222714 A1 HK 1222714A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- device manufacturing
- exposure apparatus
- exposure method
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70108—Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Optical Transform (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23670109P | 2009-08-25 | 2009-08-25 | |
US12/859,983 US8493547B2 (en) | 2009-08-25 | 2010-08-20 | Exposure apparatus, exposure method, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1222714A1 true HK1222714A1 (zh) | 2017-07-07 |
Family
ID=43625431
Family Applications (8)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12111801.2A HK1171088A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
HK16110753.8A HK1222714A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
HK16110754.7A HK1222715A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
HK18110246.1A HK1250795A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
HK15100703.1A HK1200543A1 (zh) | 2009-08-25 | 2015-01-22 | 曝光設備、曝光方法以及裝置製造方法 |
HK15105600.4A HK1205280A1 (zh) | 2009-08-25 | 2015-06-12 | 曝光裝置、曝光方法、以及組件製造方法 |
HK15107120.1A HK1206437A1 (zh) | 2009-08-25 | 2015-07-27 | 曝光裝置、曝光方法、以及組件製造方法 |
HK15107117.6A HK1206436A1 (zh) | 2009-08-25 | 2015-07-27 | 曝光裝置、曝光方法、以及組件製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12111801.2A HK1171088A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16110754.7A HK1222715A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
HK18110246.1A HK1250795A1 (zh) | 2009-08-25 | 2012-11-20 | 曝光裝置、曝光方法、以及組件製造方法 |
HK15100703.1A HK1200543A1 (zh) | 2009-08-25 | 2015-01-22 | 曝光設備、曝光方法以及裝置製造方法 |
HK15105600.4A HK1205280A1 (zh) | 2009-08-25 | 2015-06-12 | 曝光裝置、曝光方法、以及組件製造方法 |
HK15107120.1A HK1206437A1 (zh) | 2009-08-25 | 2015-07-27 | 曝光裝置、曝光方法、以及組件製造方法 |
HK15107117.6A HK1206436A1 (zh) | 2009-08-25 | 2015-07-27 | 曝光裝置、曝光方法、以及組件製造方法 |
Country Status (8)
Country | Link |
---|---|
US (11) | US8493547B2 (zh) |
EP (5) | EP2470962B1 (zh) |
JP (9) | JP5637495B2 (zh) |
KR (8) | KR101680546B1 (zh) |
CN (4) | CN104698772B (zh) |
HK (8) | HK1171088A1 (zh) |
TW (7) | TWI649644B (zh) |
WO (1) | WO2011024985A1 (zh) |
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US8514395B2 (en) * | 2009-08-25 | 2013-08-20 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8493547B2 (en) * | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
NL2006699A (en) * | 2010-06-03 | 2011-12-06 | Asml Netherlands Bv | Stage apparatus and lithographic apparatus comprising such stage apparatus. |
JP5756267B2 (ja) * | 2010-09-03 | 2015-07-29 | オリンパス株式会社 | エンコーダ用信号処理回路 |
NL2007818A (en) | 2010-12-20 | 2012-06-21 | Asml Netherlands Bv | Method of updating calibration data and a device manufacturing method. |
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US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
CN103246172B (zh) * | 2012-02-10 | 2016-12-28 | 约翰内斯﹒海德汉博士有限公司 | 具有位置测量装置的多个扫描单元的装置 |
DE102012210309A1 (de) * | 2012-06-19 | 2013-12-19 | Dr. Johannes Heidenhain Gmbh | Positionsmesseinrichtung |
EP2905805B1 (en) | 2012-10-02 | 2020-07-22 | Nikon Corporation | Exposure apparatus, exposure method, and pattern-manufacturing method by lithography |
TWI630463B (zh) * | 2013-06-28 | 2018-07-21 | 日商尼康股份有限公司 | 移動體裝置及曝光裝置、以及元件製造方法 |
JP6223091B2 (ja) * | 2013-09-25 | 2017-11-01 | 株式会社Screenホールディングス | 位置計測装置、アライメント装置、パターン描画装置および位置計測方法 |
CN104865798B (zh) * | 2014-02-21 | 2017-07-11 | 无锡华润上华科技有限公司 | 光刻工艺中的曝光场的尺寸选择方法 |
JP6488073B2 (ja) * | 2014-02-28 | 2019-03-20 | 株式会社日立ハイテクノロジーズ | ステージ装置およびそれを用いた荷電粒子線装置 |
CN106537256B (zh) * | 2014-07-16 | 2019-12-27 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
KR20240010551A (ko) | 2015-02-23 | 2024-01-23 | 가부시키가이샤 니콘 | 기판 처리 시스템 및 기판 처리 방법, 그리고 디바이스 제조 방법 |
CN112068406A (zh) | 2015-02-23 | 2020-12-11 | 株式会社尼康 | 测量装置、光刻系统、以及组件制造方法 |
WO2016136690A1 (ja) | 2015-02-23 | 2016-09-01 | 株式会社ニコン | 計測装置、リソグラフィシステム及び露光装置、並びに管理方法、重ね合わせ計測方法及びデバイス製造方法 |
KR20180016423A (ko) | 2015-06-08 | 2018-02-14 | 가부시키가이샤 니콘 | 하전 입자 빔 노광 장치 및 디바이스 제조 방법 |
US10268121B2 (en) * | 2015-09-30 | 2019-04-23 | Nikon Corporation | Exposure apparatus and exposure method, and flat panel display manufacturing method |
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