HK1207424A1 - 晶片級集成電路接觸器及構建方法 - Google Patents
晶片級集成電路接觸器及構建方法Info
- Publication number
- HK1207424A1 HK1207424A1 HK15108031.7A HK15108031A HK1207424A1 HK 1207424 A1 HK1207424 A1 HK 1207424A1 HK 15108031 A HK15108031 A HK 15108031A HK 1207424 A1 HK1207424 A1 HK 1207424A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- construction
- integrated circuit
- wafer level
- level integrated
- circuit contactor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261662124P | 2012-06-20 | 2012-06-20 | |
US201361760928P | 2013-02-05 | 2013-02-05 | |
PCT/US2013/046604 WO2013192322A2 (en) | 2012-06-20 | 2013-06-19 | Wafer level integrated circuit contactor and method of construction |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1207424A1 true HK1207424A1 (zh) | 2016-01-29 |
Family
ID=49769686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15108031.7A HK1207424A1 (zh) | 2012-06-20 | 2015-08-19 | 晶片級集成電路接觸器及構建方法 |
Country Status (12)
Country | Link |
---|---|
US (2) | US9261537B2 (zh) |
EP (1) | EP2864799B1 (zh) |
JP (1) | JP6175498B2 (zh) |
KR (1) | KR102069145B1 (zh) |
CN (2) | CN104395763B (zh) |
HK (1) | HK1207424A1 (zh) |
IL (1) | IL236156A0 (zh) |
MY (1) | MY181866A (zh) |
PH (1) | PH12014502745A1 (zh) |
SG (1) | SG11201407952SA (zh) |
TW (2) | TWI589883B (zh) |
WO (1) | WO2013192322A2 (zh) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10078101B2 (en) | 2009-04-21 | 2018-09-18 | Johnstech International Corporation | Wafer level integrated circuit probe array and method of construction |
CN104395763B (zh) | 2012-06-20 | 2017-09-01 | 约翰国际有限公司 | 晶片级集成电路接触器及构建方法 |
SG10201707975VA (en) * | 2013-07-11 | 2017-10-30 | Johnstech Int Corp | Testing apparatus and method for microcircuit and wafer level ic testing |
TWI651539B (zh) * | 2014-03-10 | 2019-02-21 | 美商瓊斯科技國際公司 | 晶圓級積體電路探針陣列及建構方法 |
US9733304B2 (en) * | 2014-09-24 | 2017-08-15 | Micron Technology, Inc. | Semiconductor device test apparatuses |
US10067164B2 (en) | 2015-08-24 | 2018-09-04 | Johnstech International Corporation | Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings |
IT201600084921A1 (it) * | 2016-08-11 | 2018-02-11 | Technoprobe Spa | Sonda di contatto e relativa testa di misura di un’apparecchiatura di test di dispositivi elettronici |
JP6881972B2 (ja) * | 2016-12-27 | 2021-06-02 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
TWI617812B (zh) * | 2017-02-16 | 2018-03-11 | 豪威科技股份有限公司 | 用於細間距封裝測試之測試座 |
JP6872960B2 (ja) * | 2017-04-21 | 2021-05-19 | 株式会社日本マイクロニクス | 電気的接続装置 |
US20190018060A1 (en) * | 2017-07-17 | 2019-01-17 | Jose E. Lopzed | Self cleaning Vertical sliding Electrical Contact Device for Semiconductor contacts |
US10545174B2 (en) * | 2017-09-05 | 2020-01-28 | Natali TAN | Kelvin contact finger for high current testing |
US10725069B1 (en) | 2017-09-19 | 2020-07-28 | Johnstech International Corporation | Integrated circuit contactor for testing ICs and method of construction |
CN110018334B (zh) * | 2018-01-10 | 2021-06-11 | 中华精测科技股份有限公司 | 探针卡装置及其矩形探针 |
TWI683108B (zh) * | 2018-01-10 | 2020-01-21 | 中華精測科技股份有限公司 | 探針卡裝置及其矩形探針 |
WO2019190676A1 (en) * | 2018-03-30 | 2019-10-03 | Applied Materials, Inc. | Integrating 3d printing into multi-process fabrication schemes |
KR102025766B1 (ko) * | 2018-07-06 | 2019-09-26 | 주식회사 마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
USD942290S1 (en) | 2019-07-12 | 2022-02-01 | Johnstech International Corporation | Tip for integrated circuit test pin |
KR102191701B1 (ko) * | 2019-08-22 | 2020-12-17 | 주식회사 이노글로벌 | 부분 교체가 가능한 테스트 소켓 |
KR102466454B1 (ko) * | 2019-08-29 | 2022-11-14 | 주식회사 아이에스시 | 검사용 소켓 |
US11561243B2 (en) * | 2019-09-12 | 2023-01-24 | International Business Machines Corporation | Compliant organic substrate assembly for rigid probes |
KR102132662B1 (ko) * | 2019-09-16 | 2020-07-13 | 주식회사 마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
KR102212872B1 (ko) * | 2020-01-23 | 2021-02-05 | (주)티에스이 | 신호 전송 커넥터 및 그 제조방법 |
KR102455150B1 (ko) * | 2020-02-10 | 2022-10-18 | 주식회사 아이에스시 | 피검사 디바이스 검사용 테스트 소켓 |
TWI729822B (zh) * | 2020-05-22 | 2021-06-01 | 美商第一檢測有限公司 | 環境控制設備及晶片測試系統 |
US11674977B2 (en) | 2020-06-11 | 2023-06-13 | Jf Microtechnology Sdn. Bhd | Short interconnect assembly with strip elastomer |
MY197431A (en) | 2020-06-11 | 2023-06-17 | Jf Microtechnology Sdn Bhd | Short interconnect assembly with strip elastomer |
CN112180244B (zh) * | 2020-12-01 | 2021-02-12 | 四川斯艾普电子科技有限公司 | 一种载板式裸芯片功放模块测试装置 |
TWI759159B (zh) * | 2021-03-26 | 2022-03-21 | 經登企業股份有限公司 | 磁性感測器及限位裝置 |
WO2023081635A1 (en) * | 2021-11-03 | 2023-05-11 | Johnstech International Corporation | Housing with vertical backstop |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5098311A (en) * | 1989-06-12 | 1992-03-24 | Ohio Associated Enterprises, Inc. | Hermaphroditic interconnect system |
EP0462706A1 (en) | 1990-06-11 | 1991-12-27 | ITT INDUSTRIES, INC. (a Delaware corporation) | Contact assembly |
US7064566B2 (en) * | 1993-11-16 | 2006-06-20 | Formfactor, Inc. | Probe card assembly and kit |
JP2648120B2 (ja) * | 1995-02-08 | 1997-08-27 | 山一電機株式会社 | 表面接触形接続器 |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
TW293938B (en) * | 1995-11-09 | 1996-12-21 | Formfactor Inc | Probe card assembly and kit, and methods of using same |
US5949244A (en) | 1996-01-03 | 1999-09-07 | Miley; David M. | Low tolerance probe card and probe ring systems |
US5947749A (en) * | 1996-07-02 | 1999-09-07 | Johnstech International Corporation | Electrical interconnect contact system |
US6181149B1 (en) * | 1996-09-26 | 2001-01-30 | Delaware Capital Formation, Inc. | Grid array package test contactor |
US6734690B1 (en) * | 2000-04-29 | 2004-05-11 | Hewlett-Packard Development Company, L.P. | Back pressure test fixture to allow probing of integrated circuit package signals |
JP3798651B2 (ja) * | 2001-05-31 | 2006-07-19 | 株式会社エンプラス | 電気部品用ソケット |
JP4000151B2 (ja) * | 2003-02-10 | 2007-10-31 | 株式会社日本マイクロニクス | 電気的接続装置 |
US7170306B2 (en) | 2003-03-12 | 2007-01-30 | Celerity Research, Inc. | Connecting a probe card and an interposer using a compliant connector |
JP2005129428A (ja) * | 2003-10-27 | 2005-05-19 | Sumitomo Electric Ind Ltd | 竹の子状コンタクトの製造方法、その方法により製造されたコンタクトおよびそのコンタクトを備える検査装置または電子機器 |
US7176702B2 (en) * | 2004-04-07 | 2007-02-13 | Micron Technology, Inc. | Contact system for wafer level testing |
JP4487261B2 (ja) | 2005-09-09 | 2010-06-23 | エルピーダメモリ株式会社 | Icソケット |
SG131790A1 (en) * | 2005-10-14 | 2007-05-28 | Tan Yin Leong | Probe for testing integrated circuit devices |
US20070103179A1 (en) | 2005-11-10 | 2007-05-10 | Silicon Integrated Systems Corp. | Socket base adaptable to a load board for testing ic |
US7695286B2 (en) * | 2007-09-18 | 2010-04-13 | Delaware Capital Formation, Inc. | Semiconductor electromechanical contact |
KR101890825B1 (ko) * | 2009-03-10 | 2018-08-22 | 존스테크 인터내셔널 코포레이션 | 마이크로 회로 테스터를 위한 전기 전도성 핀 |
TWI534432B (zh) | 2010-09-07 | 2016-05-21 | 瓊斯科技國際公司 | 用於微電路測試器之電氣傳導針腳 |
US9007082B2 (en) * | 2010-09-07 | 2015-04-14 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
CN104395763B (zh) | 2012-06-20 | 2017-09-01 | 约翰国际有限公司 | 晶片级集成电路接触器及构建方法 |
-
2013
- 2013-06-19 CN CN201380032930.9A patent/CN104395763B/zh active Active
- 2013-06-19 KR KR1020157001453A patent/KR102069145B1/ko active IP Right Grant
- 2013-06-19 EP EP13806898.6A patent/EP2864799B1/en active Active
- 2013-06-19 SG SG11201407952SA patent/SG11201407952SA/en unknown
- 2013-06-19 US US13/921,484 patent/US9261537B2/en not_active Expired - Fee Related
- 2013-06-19 TW TW102121777A patent/TWI589883B/zh active
- 2013-06-19 WO PCT/US2013/046604 patent/WO2013192322A2/en active Application Filing
- 2013-06-19 TW TW106115821A patent/TWI648542B/zh active
- 2013-06-19 CN CN201710655352.4A patent/CN107271737B/zh active Active
- 2013-06-19 JP JP2015518555A patent/JP6175498B2/ja not_active Expired - Fee Related
- 2013-06-19 MY MYPI2015700102A patent/MY181866A/en unknown
-
2014
- 2014-12-09 PH PH12014502745A patent/PH12014502745A1/en unknown
- 2014-12-09 IL IL236156A patent/IL236156A0/en active IP Right Grant
-
2015
- 2015-08-19 HK HK15108031.7A patent/HK1207424A1/zh unknown
-
2016
- 2016-02-15 US US15/043,898 patent/US9817026B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN107271737A (zh) | 2017-10-20 |
CN104395763B (zh) | 2017-09-01 |
KR20150040858A (ko) | 2015-04-15 |
US20160161528A1 (en) | 2016-06-09 |
TWI648542B (zh) | 2019-01-21 |
IL236156A0 (en) | 2015-01-29 |
US9261537B2 (en) | 2016-02-16 |
WO2013192322A2 (en) | 2013-12-27 |
MY181866A (en) | 2021-01-11 |
CN107271737B (zh) | 2020-01-10 |
TW201405130A (zh) | 2014-02-01 |
PH12014502745B1 (en) | 2015-02-02 |
JP2015523567A (ja) | 2015-08-13 |
US9817026B2 (en) | 2017-11-14 |
PH12014502745A1 (en) | 2015-02-02 |
CN104395763A (zh) | 2015-03-04 |
KR102069145B1 (ko) | 2020-02-11 |
EP2864799B1 (en) | 2021-04-14 |
EP2864799A2 (en) | 2015-04-29 |
SG11201407952SA (en) | 2015-01-29 |
WO2013192322A3 (en) | 2014-02-20 |
TW201809685A (zh) | 2018-03-16 |
EP2864799A4 (en) | 2016-07-27 |
US20130342233A1 (en) | 2013-12-26 |
TWI589883B (zh) | 2017-07-01 |
JP6175498B2 (ja) | 2017-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1207424A1 (zh) | 晶片級集成電路接觸器及構建方法 | |
HK1206233A1 (zh) | 用於植入物部件的添加製造的裝置和方法 | |
HK1198303A1 (zh) | 半導體裝置和半導體裝置的製造方法 | |
KR102365046B9 (ko) | 식각 조성물, 식각 방법 및 반도체 소자 | |
EP2730031A4 (en) | STABILIZATION CIRCUIT FOR A NON-FOSTER CIRCUIT AND METHOD THEREFOR | |
PL3757746T3 (pl) | Terminal i sposób obsługi terminala | |
HK1169744A1 (zh) | 種集成電路封裝及其組裝方法 | |
EP2804214A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
SG11201404930SA (en) | Post-cmp removal using compositions and method of use | |
SG2014012306A (en) | Etching liquid composition and etching method | |
EP2820173A4 (en) | DIAMOND GALLIUM NITRIDE SLICES AND MANUFACTURING EQUIPMENT AND METHODS OF MANUFACTURE | |
EP2824696A4 (en) | SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF | |
GB2487917B (en) | Semiconductor devices and fabrication methods | |
SG2013077375A (en) | Circuit arrangement and method of forming the same | |
GB2488587B (en) | Semiconductor devices and fabrication methods | |
EP2793267A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | |
EP2804216A4 (en) | SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF | |
EP2725619A4 (en) | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | |
EP2614529A4 (en) | METHOD FOR FORMING SEMICONDUCTOR CONTACTS AND SEMICONDUCTOR DEVICES THEREWITH | |
TWI561832B (en) | Semiconductor integrated circuit | |
SG11201408564SA (en) | Semiconductor wafer evaluation method and semiconductor wafer manufacturing method | |
GB201213673D0 (en) | Semiconductor device and fabrication method | |
SG2014009930A (en) | Method and device for permanent bonding of wafers | |
EP2835828A4 (en) | SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | |
EP2858095A4 (en) | SEMICONDUCTOR MANUFACTURING METHOD AND ANNEALING METHOD |