HK1202975A1 - Method for manufacturing transparent conductive base material, and transparent conductive base material - Google Patents

Method for manufacturing transparent conductive base material, and transparent conductive base material

Info

Publication number
HK1202975A1
HK1202975A1 HK15103352.9A HK15103352A HK1202975A1 HK 1202975 A1 HK1202975 A1 HK 1202975A1 HK 15103352 A HK15103352 A HK 15103352A HK 1202975 A1 HK1202975 A1 HK 1202975A1
Authority
HK
Hong Kong
Prior art keywords
base material
transparent conductive
conductive base
manufacturing
manufacturing transparent
Prior art date
Application number
HK15103352.9A
Other languages
English (en)
Chinese (zh)
Inventor
三島崇司
後藤圭亮
‧普舍尼茨卡
‧韋斯特沃特
Original Assignee
Okura Industrial Co Ltd
Cambrios Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okura Industrial Co Ltd, Cambrios Technologies Corp filed Critical Okura Industrial Co Ltd
Publication of HK1202975A1 publication Critical patent/HK1202975A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/042—Directing or stopping the fluid to be coated with air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B05D1/265—Extrusion coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/02—Emulsion paints including aerosols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2252/00—Sheets
    • B05D2252/02—Sheets of indefinite length
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2601/00—Inorganic fillers
    • B05D2601/20—Inorganic fillers used for non-pigmentation effect
    • B05D2601/28—Metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254—After-treatment
    • B05D3/0272—After-treatment with ovens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
    • B05D3/0413—Heating with air
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0547—Nanofibres or nanotubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B2210/00—Drying processes and machines for solid objects characterised by the specific requirements of the drying good
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/81—Electrodes
    • H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Dispersion Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
HK15103352.9A 2012-02-16 2015-04-02 Method for manufacturing transparent conductive base material, and transparent conductive base material HK1202975A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/053654 WO2013121556A1 (ja) 2012-02-16 2012-02-16 透明導電基材の製造方法および透明導電基材

Publications (1)

Publication Number Publication Date
HK1202975A1 true HK1202975A1 (en) 2015-10-09

Family

ID=48983714

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15103352.9A HK1202975A1 (en) 2012-02-16 2015-04-02 Method for manufacturing transparent conductive base material, and transparent conductive base material

Country Status (8)

Country Link
US (1) US9776209B2 (xx)
EP (1) EP2816569B1 (xx)
JP (1) JP6199034B2 (xx)
KR (1) KR101940591B1 (xx)
CN (1) CN104094365B (xx)
HK (1) HK1202975A1 (xx)
TW (1) TWI549813B (xx)
WO (1) WO2013121556A1 (xx)

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CN105324820B (zh) * 2013-06-20 2019-04-30 Lg 电子株式会社 导电膜和包括导电膜的触摸板
JP2015099748A (ja) * 2013-11-20 2015-05-28 デクセリアルズ株式会社 透明導電体及び透明導電体の製造方法
KR101780528B1 (ko) * 2014-03-19 2017-09-21 제일모직주식회사 투명 도전체, 이의 제조방법 및 이를 포함하는 광학표시장치
EP2944604A1 (en) * 2014-05-16 2015-11-18 Université de Strasbourg Preparation of coatings containing at least one in-plane oriented layer of anisotropic shaped objects
CN105225727B (zh) * 2014-06-30 2017-06-09 乐金显示有限公司 透明导电层、用于制造其的方法及包括其的显示装置
US10831327B2 (en) 2016-09-30 2020-11-10 Dai Nippon Printing Co., Ltd. Electroconductive film, touch panel, and image display device
CN108251820A (zh) * 2018-03-09 2018-07-06 无锡博硕珈睿科技有限公司 自加热制品/材料的制造方法及制造设备
CN110534256B (zh) * 2018-05-23 2021-04-02 睿明科技股份有限公司 导电膜的制造方法
CN108962434A (zh) * 2018-06-15 2018-12-07 张家港康得新光电材料有限公司 一种纳米银线导电薄膜及其制作方法
CN108598288A (zh) * 2018-07-10 2018-09-28 上海大学 一种复合多功能oled电极及其制备方法
CN113365762A (zh) * 2019-04-03 2021-09-07 英属维京群岛商天材创新材料科技股份有限公司 金属纳米结构的纯化
US11535047B2 (en) 2019-05-31 2022-12-27 Showa Denko K.K. Method for producing transparent conducting film
JPWO2021065827A1 (xx) 2019-10-02 2021-04-08
KR20220070223A (ko) 2019-10-02 2022-05-30 닛토덴코 가부시키가이샤 투명 도전성 필름의 제조 방법
JPWO2021065828A1 (xx) 2019-10-02 2021-04-08
CN111029039B (zh) * 2019-12-12 2021-02-09 湖南中天碧水膜科技有限公司 一种改善纳米银线导电膜电阻异向性的方法
KR102316141B1 (ko) 2019-12-27 2021-10-22 쇼와 덴코 가부시키가이샤 투명 도전 필름의 제조 방법
CN112970075B (zh) * 2019-12-27 2021-11-19 昭和电工株式会社 透明导电膜的制造方法
JP2021136085A (ja) * 2020-02-25 2021-09-13 日東電工株式会社 透明導電性フィルム
CN111383804B (zh) * 2020-02-28 2022-12-09 深圳市华科创智技术有限公司 一种改进向异性的纳米线导电膜的制备方法及纳米线导电膜
JP2022042664A (ja) 2020-09-03 2022-03-15 日東電工株式会社 透明導電性フィルムの製造方法
JP2022108460A (ja) * 2021-01-13 2022-07-26 日東電工株式会社 透明導電性フィルムの製造方法
JP2022108459A (ja) 2021-01-13 2022-07-26 日東電工株式会社 透明導電性フィルム

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JP3560333B2 (ja) 2001-03-08 2004-09-02 独立行政法人 科学技術振興機構 金属ナノワイヤー及びその製造方法
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US9214256B2 (en) * 2008-03-14 2015-12-15 Nano-C, Inc. Carbon nanotube-transparent conductive inorganic nanoparticles hybrid thin films for transparent conductive applications
JP5561714B2 (ja) * 2009-10-13 2014-07-30 日本写真印刷株式会社 ディスプレイ電極用透明導電膜
JP2011090879A (ja) 2009-10-22 2011-05-06 Fujifilm Corp 透明導電体の製造方法
JP2011090878A (ja) * 2009-10-22 2011-05-06 Fujifilm Corp 透明導電体の製造方法
JP2011119142A (ja) 2009-12-04 2011-06-16 Konica Minolta Holdings Inc 透明導電基材の製造方法
JP5567871B2 (ja) * 2010-03-19 2014-08-06 パナソニック株式会社 透明導電膜付き基材及びその製造方法
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JP5285667B2 (ja) * 2010-08-05 2013-09-11 パナソニック株式会社 ナノファイバ製造装置、ナノファイバ製造方法
CN102319661B (zh) * 2011-07-25 2013-08-21 云梦县德邦实业有限责任公司 导电膜的涂布方法

Also Published As

Publication number Publication date
EP2816569A4 (en) 2015-09-23
JP6199034B2 (ja) 2017-09-20
US9776209B2 (en) 2017-10-03
CN104094365B (zh) 2016-09-07
WO2013121556A1 (ja) 2013-08-22
TW201334955A (zh) 2013-09-01
CN104094365A (zh) 2014-10-08
EP2816569A1 (en) 2014-12-24
EP2816569B1 (en) 2017-04-19
TWI549813B (zh) 2016-09-21
KR20140131397A (ko) 2014-11-13
JPWO2013121556A1 (ja) 2015-05-11
US20150321220A1 (en) 2015-11-12
KR101940591B1 (ko) 2019-01-21

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