HK1196457A1 - Transparent electronic display board and method for manufacturing same - Google Patents

Transparent electronic display board and method for manufacturing same

Info

Publication number
HK1196457A1
HK1196457A1 HK14109751.4A HK14109751A HK1196457A1 HK 1196457 A1 HK1196457 A1 HK 1196457A1 HK 14109751 A HK14109751 A HK 14109751A HK 1196457 A1 HK1196457 A1 HK 1196457A1
Authority
HK
Hong Kong
Prior art keywords
display board
electronic display
manufacturing same
transparent electronic
transparent
Prior art date
Application number
HK14109751.4A
Other languages
English (en)
Chinese (zh)
Inventor
李昊埈
Original Assignee
思瑪特有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 思瑪特有限公司 filed Critical 思瑪特有限公司
Publication of HK1196457A1 publication Critical patent/HK1196457A1/xx

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1064—Partial cutting [e.g., grooving or incising]
HK14109751.4A 2012-07-18 2014-09-27 Transparent electronic display board and method for manufacturing same HK1196457A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120078116A KR101188747B1 (ko) 2012-07-18 2012-07-18 투명전광판 및 그 제조방법
PCT/KR2012/010103 WO2014014169A1 (ko) 2012-07-18 2012-11-27 투명전광판 및 그 제조방법

Publications (1)

Publication Number Publication Date
HK1196457A1 true HK1196457A1 (en) 2014-12-12

Family

ID=47287572

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14109751.4A HK1196457A1 (en) 2012-07-18 2014-09-27 Transparent electronic display board and method for manufacturing same

Country Status (11)

Country Link
US (1) US10170023B2 (xx)
EP (1) EP2879120A4 (xx)
JP (1) JP6153608B2 (xx)
KR (1) KR101188747B1 (xx)
CN (1) CN103827947B (xx)
BR (1) BR112015000738A2 (xx)
HK (1) HK1196457A1 (xx)
MX (1) MX338760B (xx)
RU (1) RU2595982C1 (xx)
SG (1) SG11201500327PA (xx)
WO (1) WO2014014169A1 (xx)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101442705B1 (ko) * 2012-10-18 2014-09-19 지스마트 주식회사 균일한 광출력이 가능한 투명전광판
KR101434954B1 (ko) * 2013-02-15 2014-08-28 지스마트 주식회사 투명전광판을 구비한 무빙워크
KR101434953B1 (ko) * 2013-02-15 2014-08-28 지스마트 주식회사 투명전광판을 구비한 탑승교
KR101434955B1 (ko) 2013-03-18 2014-08-29 지스마트 주식회사 투명전광판의 접착제 도포방법
KR101459310B1 (ko) * 2013-12-10 2014-11-10 지스마트 주식회사 투명전광판의 고정장치
KR101512661B1 (ko) * 2013-12-10 2015-04-17 지스마트 주식회사 창틀에 설치가능한 복층 구조를 갖는 투명전광판 및 그 제조방법
KR20160049613A (ko) * 2014-10-27 2016-05-10 지스마트 주식회사 처짐 방지수단을 구비한 투명전광판의 제조방법
KR101649212B1 (ko) * 2014-10-27 2016-08-19 지스마트 주식회사 재귀반사방지수단을 구비한 투명전광판
CN104715680B (zh) * 2014-11-07 2017-08-11 G思玛特有限公司 可绝缘的透明电子显示屏
KR101784406B1 (ko) * 2015-02-25 2017-10-12 금호전기주식회사 투명 전광 장치
CN104715684A (zh) * 2015-03-30 2015-06-17 赵琪科 透光玻璃显示屏及制造方法
KR101581745B1 (ko) 2015-04-12 2015-12-31 이동원 칩 led 및 그를 이용한 투명전광판
KR101689131B1 (ko) * 2015-07-24 2016-12-23 케이알에코스타 주식회사 메탈 메쉬를 이용한 투명 디스플레이
KR101584739B1 (ko) 2015-08-26 2016-01-13 주식회사 누리플랜 투명전광판 및 그 제조방법
KR101584734B1 (ko) 2015-09-08 2016-01-13 주식회사 누리플랜 투명전광판 및 그 제조방법
KR101763107B1 (ko) 2015-09-14 2017-08-07 루미마이크로 주식회사 발광 패키지 및 이를 포함하는 투명 디스플레이 장치
KR101780688B1 (ko) 2015-09-14 2017-10-23 루미마이크로 주식회사 네트패턴을 갖는 메쉬형 전극배선 및 이를 포함하는 led 투명전광판
KR101785528B1 (ko) 2015-09-14 2017-10-17 루미마이크로 주식회사 네트패턴을 갖는 led 투명전광판 배선구조
KR101618861B1 (ko) 2015-10-28 2016-05-11 주식회사 누리플랜 투명전광판 고정장치
KR101842680B1 (ko) * 2017-02-07 2018-03-27 주식회사 누리플랜 방음벽 구조물
KR102275576B1 (ko) 2017-08-08 2021-07-12 엘지전자 주식회사 디스플레이 디바이스
KR102577090B1 (ko) 2018-01-26 2023-09-12 엘지전자 주식회사 반도체 발광 소자를 이용한 램프
DE102018107309B4 (de) 2018-03-27 2019-10-10 Symonics GmbH Transparente Anzeigevorrichtung
TWI720418B (zh) * 2019-01-31 2021-03-01 致伸科技股份有限公司 半導體發光單元及其封裝方法
CN110137165B (zh) * 2019-04-19 2021-10-12 开发晶照明（厦门）有限公司 显示器件及其制作方法
KR20210099461A (ko) 2020-02-04 2021-08-12 주식회사 국영지앤엠 투명 엘이디 디스플레이 패널 및 이의 제조 방법
KR102639991B1 (ko) 2022-05-26 2024-03-19 주식회사 루미디아 방수 및 방진 구조를 갖는 투명 led 디스플레이 모듈 및 이의 제조방법

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1037326A1 (ru) * 1982-02-08 1983-08-23 Ордена Ленина Физический Институт Им.П.Н.Лебедева Оптоэлектронный дисплей
JP2848480B2 (ja) * 1994-03-30 1999-01-20 株式会社デンソー 薄膜ｅｌ表示装置及びその製造方法
JPH07282604A (ja) * 1994-04-12 1995-10-27 Sanyo Electric Works Ltd 発光表示体及び同発光表示体を用いた発光表示装置
JP2002067075A (ja) 2000-08-25 2002-03-05 Maxell Seiki Kk 表示窓用透明パネルの製造方法
DE10335727A1 (de) * 2003-08-05 2005-02-24 H.C. Starck Gmbh Transparente Elektrode für elektro-optische Aufbauten
KR20060007270A (ko) 2004-07-19 2006-01-24 주식회사 미라클 투명표시창 및 그 제조방법
JP4265515B2 (ja) * 2004-09-29 2009-05-20 カシオ計算機株式会社 ディスプレイパネル
WO2006103596A2 (en) * 2005-03-30 2006-10-05 Koninklijke Philips Electronics N.V. Flexible led array
ATE546836T1 (de) * 2005-04-21 2012-03-15 Fiat Ricerche Anwendung einer transparenten leuchtdiodenanzeigevorrichtung in einem kraftfahrzeug
KR100618942B1 (ko) * 2005-11-08 2006-09-01 김성규 투명전광판
KR100618941B1 (ko) * 2005-11-08 2006-09-01 김성규 투명발광장치 및 그 제조방법
KR100618943B1 (ko) * 2005-12-13 2006-09-01 김성규 투명전광판 및 이에 사용되는 칩 엘이디
JPWO2007119473A1 (ja) * 2006-03-30 2009-08-27 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子、有機エレクトロルミネッセンス素子の製造方法、照明装置及びディスプレイ装置
KR20080060490A (ko) * 2006-12-27 2008-07-02 김성규 투명전광판
KR20080098245A (ko) * 2007-05-04 2008-11-07 김성규 투명발광장치
JP2009157015A (ja) * 2007-12-26 2009-07-16 Komaden:Kk Ｌｅｄ表示装置及びｌｅｄ表示ユニット
KR101509111B1 (ko) * 2008-02-20 2015-04-06 삼성디스플레이 주식회사 박막 트랜지스터 표시판
JP5070190B2 (ja) * 2008-12-03 2012-11-07 シチズンホールディングス株式会社 液晶光学素子及び光ピックアップ装置
DE202008017988U1 (de) * 2008-05-26 2011-02-10 C.R.F. Società Consortile per Azioni, Orbassano Transparente Anzeigevorrichtung mit Leiterbahnen, die mit undurchsichtiger Beschichtung versehen sind
CN101447507A (zh) * 2008-12-12 2009-06-03 信利半导体有限公司 一种具有触摸屏功能的有机电致发光显示器
KR101108164B1 (ko) * 2010-02-03 2012-02-06 삼성모바일디스플레이주식회사 유기 발광 표시 장치
JP5537983B2 (ja) * 2010-02-15 2014-07-02 株式会社ジャパンディスプレイ 液晶表示装置
KR101659751B1 (ko) 2010-07-22 2016-09-26 현대모비스 주식회사 차량용 투명 전광판
CN202003646U (zh) * 2011-03-07 2011-10-05 安徽众和达光电有限公司 一种led数码显示屏

Also Published As

Publication number Publication date
EP2879120A1 (en) 2015-06-03
MX338760B (es) 2016-04-29
CN103827947B (zh) 2015-09-02
CN103827947A (zh) 2014-05-28
EP2879120A4 (en) 2016-02-17
WO2014014169A1 (ko) 2014-01-23
MX2015000634A (es) 2015-07-06
SG11201500327PA (en) 2015-03-30
US20150235578A1 (en) 2015-08-20
BR112015000738A2 (pt) 2017-06-27
RU2595982C1 (ru) 2016-08-27
US10170023B2 (en) 2019-01-01
JP2015523604A (ja) 2015-08-13
KR101188747B1 (ko) 2012-10-10
JP6153608B2 (ja) 2017-06-28

Similar Documents

Publication Publication Date Title
HK1196457A1 (en) Transparent electronic display board and method for manufacturing same
HK1196458A1 (en) Transparent electronic display board and method for manufacturing same
GB201218894D0 (en) Foldable electronic display
EP2874162A4 (en) PACKAGE UNIT AND ELECTRONIC COMPONENT
HK1191499A1 (en) Electronic circuit module and method for producing the same
EP2800463A4 (en) FITTED PCB AND MANUFACTURING PROCESS THEREFOR
TWI561149B (en) Housing for electronic device and method for making same
EP2916440A4 (en) ELECTRIC CIRCUIT
EP2784807A4 (en) PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
EP2720520A4 (en) PCB AND ELECTRONIC DEVICE THEREFOR
TWI560510B (en) Electronic ink display device and method for manufacturing the same
EP2773169A4 (en) PCB AND ELECTRONIC DEVICE THEREFOR
EP2932497A4 (en) DISPLAY FOR AN ELECTRONIC DEVICE
EP2904884A4 (en) CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
EP2931008A4 (en) PCB AND MANUFACTURING METHOD THEREFOR
EP2924681A4 (en) DISPLAY DEVICE AND ELECTRONIC DEVICE
EP2811050A4 (en) CONDUCTOR PLATE AND METHOD FOR MANUFACTURING THE PCB
EP2741136A4 (en) Hand-written electronic document display and method of making same
GB201008322D0 (en) Electronic display modules
EP2899751A4 (en) WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
EP2866534A4 (en) CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING THE SAME
EP2820927A4 (en) CONDUCTOR PLATE AND METHOD FOR THE PRODUCTION THEREOF
TWI561129B (en) Light-pervious printed circuit board method for manufacturing same
EP2866078A4 (en) SINGLE SUBSTRATE DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME
EP2725447B8 (en) Electronic device and electronic device manufacturing method

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20191125