HK1185368A1 - Heat-curable polyorganosiloxane composition and use thereof - Google Patents

Heat-curable polyorganosiloxane composition and use thereof

Info

Publication number
HK1185368A1
HK1185368A1 HK13112651.0A HK13112651A HK1185368A1 HK 1185368 A1 HK1185368 A1 HK 1185368A1 HK 13112651 A HK13112651 A HK 13112651A HK 1185368 A1 HK1185368 A1 HK 1185368A1
Authority
HK
Hong Kong
Prior art keywords
heat
polyorganosiloxane composition
curable polyorganosiloxane
curable
composition
Prior art date
Application number
HK13112651.0A
Other languages
English (en)
Chinese (zh)
Inventor
大皷弘二
小野�和久
Original Assignee
邁圖高新材料日本合同公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 邁圖高新材料日本合同公司 filed Critical 邁圖高新材料日本合同公司
Publication of HK1185368A1 publication Critical patent/HK1185368A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK13112651.0A 2010-12-22 2013-11-12 Heat-curable polyorganosiloxane composition and use thereof HK1185368A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010286155 2010-12-22
PCT/JP2011/078146 WO2012086404A1 (ja) 2010-12-22 2011-12-06 熱硬化型ポリオルガノシロキサン組成物及びその使用

Publications (1)

Publication Number Publication Date
HK1185368A1 true HK1185368A1 (en) 2014-02-14

Family

ID=46313684

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13112651.0A HK1185368A1 (en) 2010-12-22 2013-11-12 Heat-curable polyorganosiloxane composition and use thereof

Country Status (9)

Country Link
US (1) US9540551B2 (ko)
EP (1) EP2657300B1 (ko)
JP (2) JP5920766B2 (ko)
KR (1) KR101790820B1 (ko)
CN (1) CN103180394B (ko)
HK (1) HK1185368A1 (ko)
PT (1) PT2657300E (ko)
TW (1) TWI546340B (ko)
WO (1) WO2012086404A1 (ko)

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WO2011107592A1 (en) * 2010-03-05 2011-09-09 Momentive Performance Materials Gmbh Curable polyorganosiloxane composition for use as an encapsulant for a solar cell module
IN2014KN03028A (ko) * 2012-06-22 2015-05-08 Momentive Performance Mat Jp
JP6173764B2 (ja) * 2013-05-08 2017-08-02 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 画像表示装置用のダム材組成物、及びそれを用いた画像表示装置
WO2015076612A1 (ko) * 2013-11-21 2015-05-28 주식회사 엘지화학 보호 필름
TWI506058B (zh) * 2014-03-18 2015-11-01 Benq Materials Corp 可固化矽樹脂組成物
JP6023737B2 (ja) 2014-03-18 2016-11-09 信越化学工業株式会社 ウエハ加工体、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
JP6645823B2 (ja) * 2015-12-22 2020-02-14 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 付加硬化性ポリフルオロオルガノシロキサン組成物
KR101880211B1 (ko) * 2015-12-30 2018-07-20 주식회사 엘지화학 경화성 조성물
US11001758B2 (en) * 2016-06-10 2021-05-11 Dow Silicones Corporation Non-linear side chain liquid crystal polyorganosiloxanes and methods for their preparation and use in electro-optic applications and devices
KR102257952B1 (ko) 2016-06-15 2021-06-01 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 경화성 폴리오가노실록산 조성물 및 그 사용
JP7130316B2 (ja) * 2017-07-05 2022-09-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 硬化性ポリオルガノシロキサン組成物
TWI782066B (zh) * 2017-08-03 2022-11-01 德商漢高股份有限及兩合公司 可固化的聚矽氧光學透明黏著劑及其用途
US11549039B2 (en) 2017-10-19 2023-01-10 Dow Silicones Corporation Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications
TW201946976A (zh) 2018-05-11 2019-12-16 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物
TW201946975A (zh) * 2018-05-11 2019-12-16 美商陶氏有機矽公司 用於可撓式顯示器之聚矽氧背板
CN109280535B (zh) * 2018-09-12 2020-11-10 烟台德邦科技有限公司 一种功能性甲基乙烯基树脂的制备方法
KR102136686B1 (ko) * 2018-09-21 2020-08-13 주식회사 케이씨씨 실리콘 조성물
JP2021001257A (ja) * 2019-06-20 2021-01-07 信越化学工業株式会社 室温硬化型シリコーンゴム組成物
JP7365798B2 (ja) * 2019-07-03 2023-10-20 ダウ・東レ株式会社 シリコーンゲル組成物、その硬化物、電子部品封止剤、電子部品、および半導体チップの保護方法
JP7471111B2 (ja) * 2020-03-06 2024-04-19 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 密着剤パッケージ

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Also Published As

Publication number Publication date
JP5920766B2 (ja) 2016-05-18
KR20140006765A (ko) 2014-01-16
US20130071673A1 (en) 2013-03-21
CN103180394A (zh) 2013-06-26
EP2657300B1 (en) 2015-12-02
WO2012086404A1 (ja) 2012-06-28
TWI546340B (zh) 2016-08-21
JP2012144705A (ja) 2012-08-02
CN103180394B (zh) 2015-04-08
TW201231558A (en) 2012-08-01
JP5010762B2 (ja) 2012-08-29
EP2657300A1 (en) 2013-10-30
US9540551B2 (en) 2017-01-10
PT2657300E (pt) 2016-01-20
KR101790820B1 (ko) 2017-10-26
EP2657300A4 (en) 2014-08-20
JPWO2012086404A1 (ja) 2014-05-22

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