HK1184180A1 - Molded polyamide resin article - Google Patents

Molded polyamide resin article

Info

Publication number
HK1184180A1
HK1184180A1 HK13111620.0A HK13111620A HK1184180A1 HK 1184180 A1 HK1184180 A1 HK 1184180A1 HK 13111620 A HK13111620 A HK 13111620A HK 1184180 A1 HK1184180 A1 HK 1184180A1
Authority
HK
Hong Kong
Prior art keywords
polyamide resin
resin article
molded polyamide
molded
article
Prior art date
Application number
HK13111620.0A
Other languages
English (en)
Chinese (zh)
Inventor
三田寺淳
黑河優志
高野隆大
Original Assignee
三菱瓦斯化學株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱瓦斯化學株式會社 filed Critical 三菱瓦斯化學株式會社
Publication of HK1184180A1 publication Critical patent/HK1184180A1/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/60Polyamides or polyester-amides
    • C08G18/603Polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/04Preparatory processes
    • C08G69/06Solid state polycondensation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/29Compounds containing one or more carbon-to-nitrogen double bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2377/00Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2377/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK13111620.0A 2010-10-08 2013-10-16 Molded polyamide resin article HK1184180A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010228509 2010-10-08
PCT/JP2011/072396 WO2012046629A1 (ja) 2010-10-08 2011-09-29 ポリアミド樹脂成形体

Publications (1)

Publication Number Publication Date
HK1184180A1 true HK1184180A1 (en) 2014-01-17

Family

ID=45927624

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13111620.0A HK1184180A1 (en) 2010-10-08 2013-10-16 Molded polyamide resin article

Country Status (14)

Country Link
US (1) US9334365B2 (ko)
EP (1) EP2626377B1 (ko)
JP (1) JP5842820B2 (ko)
KR (2) KR101953882B1 (ko)
CN (1) CN103154087B (ko)
AU (1) AU2011313399B8 (ko)
BR (1) BR112013008038A2 (ko)
CA (1) CA2813713C (ko)
HK (1) HK1184180A1 (ko)
MX (1) MX348751B (ko)
RU (1) RU2628072C2 (ko)
TW (1) TWI501995B (ko)
WO (1) WO2012046629A1 (ko)
ZA (1) ZA201301710B (ko)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103249765B (zh) 2010-12-07 2016-06-08 三菱瓦斯化学株式会社 聚酰胺树脂薄膜及其制造方法
WO2012140785A1 (ja) 2011-04-12 2012-10-18 三菱瓦斯化学株式会社 ポリアミド樹脂系複合材およびその製造方法
CA2804131C (en) * 2011-06-10 2013-10-29 Mitsubishi Gas Chemical Company, Inc. Reactive polyamide resins and polyamide resin compositions
EP2604643B1 (en) * 2011-09-12 2018-05-30 Mitsubishi Gas Chemical Company, Inc. Thin-wall article
JP5105014B1 (ja) * 2012-03-23 2012-12-19 富士ゼロックス株式会社 管状体の製造方法
US10148006B2 (en) * 2012-09-14 2018-12-04 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer
CN103910128B (zh) * 2014-04-16 2016-05-04 厦门智盛包装有限公司 多层耐磨塑料包装袋
CN106604955B (zh) * 2014-09-30 2019-06-18 积水化成品工业株式会社 树脂发泡片材和树脂发泡成形品的制造方法
WO2016080185A1 (ja) * 2014-11-19 2016-05-26 三菱瓦斯化学株式会社 ポリアミド樹脂組成物、成形品、成形品の製造方法
CN108137921B (zh) * 2015-10-09 2020-07-07 宇部兴产株式会社 聚酰胺树脂组合物
KR102204087B1 (ko) * 2017-12-26 2021-01-18 주식회사 엘지화학 폴리아미드 수지 조성물, 이의 제조방법 및 이로부터 제조된 성형품
WO2019172354A1 (ja) * 2018-03-09 2019-09-12 東洋紡株式会社 ポリアミド樹脂組成物
JP7213608B2 (ja) * 2018-06-22 2023-01-27 株式会社イノアックコーポレーション 衣料用補強部材
JP2022174909A (ja) 2021-05-12 2022-11-25 三菱瓦斯化学株式会社 樹脂組成物および成形品

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217237A (ja) * 1984-04-12 1985-10-30 Mitsubishi Chem Ind Ltd 共重合ポリアミド
ZA873833B (en) * 1986-05-30 1989-01-25 Du Pont High modulus poly-p-phenylene terephthalamide fiber
CA1288885C (en) 1986-12-01 1991-09-10 Kenichi Narita Molding polyamide resin composition
JPS63137956A (ja) 1986-12-01 1988-06-09 Mitsubishi Gas Chem Co Inc 成形用ポリアミド樹脂組成物
JPH03262633A (ja) * 1990-03-13 1991-11-22 Ube Ind Ltd ポリアミドフィルムの製造方法
JPH055056A (ja) * 1990-10-30 1993-01-14 Mitsubishi Kasei Corp 熱可塑性樹脂組成物
JP3412657B2 (ja) * 1994-09-08 2003-06-03 三菱瓦斯化学株式会社 ポリアミドの乾燥方法および固相重合方法
JP2001302845A (ja) * 2000-04-20 2001-10-31 Toray Ind Inc ポリアミド樹脂組成物
JP4042378B2 (ja) * 2001-10-12 2008-02-06 東レ株式会社 ポリアミド樹脂組成物およびポリアミド樹脂成形品
JP2003252987A (ja) * 2002-02-28 2003-09-10 Mitsubishi Gas Chem Co Inc ポリアミドの固相乾燥および固相重合方法
CN101528854B (zh) 2006-10-26 2011-07-27 三菱瓦斯化学株式会社 阻隔性良好的热塑性树脂组合物
JP5581567B2 (ja) * 2006-10-26 2014-09-03 三菱瓦斯化学株式会社 バリア性に優れた熱可塑性樹脂組成物
US20090169882A1 (en) * 2007-12-28 2009-07-02 Louis Jay Jandris Compatibilized polyester-polyamide with high modulus, and good abrasion and fibrillation resistance and fabric produced thereof
JP5151646B2 (ja) * 2008-04-17 2013-02-27 三菱瓦斯化学株式会社 易熱成形性多層構造体
BRPI0918757A2 (pt) * 2008-09-18 2015-12-08 Mitsubishi Gas Chemical Co resina de poliamida
MX338658B (es) 2010-07-08 2016-04-27 Mitsubishi Gas Chemical Co Composicion de resina de poliamida.
CA2800350C (en) 2010-07-27 2013-06-11 Mitsubishi Gas Chemical Company, Inc. Polyamide resins
CA2804131C (en) 2011-06-10 2013-10-29 Mitsubishi Gas Chemical Company, Inc. Reactive polyamide resins and polyamide resin compositions

Also Published As

Publication number Publication date
KR20180061428A (ko) 2018-06-07
AU2011313399B2 (en) 2014-06-12
CA2813713C (en) 2018-04-24
AU2011313399B9 (en) 2014-10-09
AU2011313399B8 (en) 2014-10-09
BR112013008038A2 (pt) 2016-06-14
AU2011313399A1 (en) 2013-05-02
RU2628072C2 (ru) 2017-08-14
KR101953882B1 (ko) 2019-03-05
JPWO2012046629A1 (ja) 2014-02-24
WO2012046629A1 (ja) 2012-04-12
MX2013003786A (es) 2013-06-24
US9334365B2 (en) 2016-05-10
KR20140031165A (ko) 2014-03-12
ZA201301710B (en) 2014-05-28
TWI501995B (zh) 2015-10-01
EP2626377A4 (en) 2014-05-07
TW201221551A (en) 2012-06-01
EP2626377A1 (en) 2013-08-14
CN103154087A (zh) 2013-06-12
MX348751B (es) 2017-06-28
US20130172460A1 (en) 2013-07-04
CN103154087B (zh) 2015-04-08
CA2813713A1 (en) 2012-04-12
EP2626377B1 (en) 2018-10-24
RU2013120548A (ru) 2014-11-20
JP5842820B2 (ja) 2016-01-13

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220928