HK1163345A1 - Method of forming a device with a piezoelectric transducer - Google Patents

Method of forming a device with a piezoelectric transducer

Info

Publication number
HK1163345A1
HK1163345A1 HK12103670.7A HK12103670A HK1163345A1 HK 1163345 A1 HK1163345 A1 HK 1163345A1 HK 12103670 A HK12103670 A HK 12103670A HK 1163345 A1 HK1163345 A1 HK 1163345A1
Authority
HK
Hong Kong
Prior art keywords
forming
piezoelectric material
piezoelectric transducer
handle layer
attaching
Prior art date
Application number
HK12103670.7A
Other languages
English (en)
Inventor
Andreas Bibl
John A Higginson
Christoph Menzel
Paul A Hoisington
Original Assignee
Fujifilm Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Dimatix Inc filed Critical Fujifilm Dimatix Inc
Publication of HK1163345A1 publication Critical patent/HK1163345A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Reciprocating Pumps (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Measuring Fluid Pressure (AREA)
HK12103670.7A 2004-10-15 2008-02-06 Method of forming a device with a piezoelectric transducer HK1163345A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/967,012 US7388319B2 (en) 2004-10-15 2004-10-15 Forming piezoelectric actuators

Publications (1)

Publication Number Publication Date
HK1163345A1 true HK1163345A1 (en) 2012-09-07

Family

ID=35649145

Family Applications (2)

Application Number Title Priority Date Filing Date
HK08101478.1A HK1107873A1 (en) 2004-10-15 2008-02-06 Method of forming a device with a piezoelectric transducer
HK12103670.7A HK1163345A1 (en) 2004-10-15 2008-02-06 Method of forming a device with a piezoelectric transducer

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK08101478.1A HK1107873A1 (en) 2004-10-15 2008-02-06 Method of forming a device with a piezoelectric transducer

Country Status (9)

Country Link
US (1) US7388319B2 (xx)
EP (2) EP1815537B1 (xx)
JP (2) JP5139805B2 (xx)
KR (1) KR101173329B1 (xx)
CN (1) CN101069295B (xx)
AT (1) ATE545159T1 (xx)
HK (2) HK1107873A1 (xx)
TW (1) TWI384661B (xx)
WO (1) WO2006044329A1 (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JP4504237B2 (ja) * 2005-03-18 2010-07-14 富士通株式会社 ウエットエッチング方法、マイクロ可動素子製造方法、およびマイクロ可動素子
US7779522B2 (en) * 2006-05-05 2010-08-24 Fujifilm Dimatix, Inc. Method for forming a MEMS
EP1997638B1 (en) * 2007-05-30 2012-11-21 Océ-Technologies B.V. Method of forming an array of piezoelectric actuators on a membrane
US8313174B2 (en) * 2008-08-06 2012-11-20 Xerox Corporation Method for reducing mechanical cross-talk between array structures on a substrate mounted to another substrate by an adhesive
US8053951B2 (en) * 2008-11-04 2011-11-08 Fujifilm Corporation Thin film piezoelectric actuators
JP5196184B2 (ja) * 2009-03-11 2013-05-15 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置並びにアクチュエーター
JP4930569B2 (ja) * 2009-10-14 2012-05-16 株式会社村田製作所 磁気ヘッド駆動用圧電セラミックアクチュエータ
CN102398419B (zh) * 2010-09-08 2014-06-25 研能科技股份有限公司 喷墨头压电致动单元的切割方法
WO2013001448A1 (en) * 2011-06-27 2013-01-03 Koninklijke Philips Electronics N.V. Ultrasound transducer assembly and method of manufacturing the same
JP2013093428A (ja) * 2011-10-25 2013-05-16 Stanley Electric Co Ltd 基板パッケージ
US9139004B2 (en) * 2012-03-05 2015-09-22 Xerox Corporation Print head transducer dicing directly on diaphragm
CN103327593B (zh) * 2012-03-21 2016-06-29 中国移动通信集团公司 一种自适应上行功控方法及移动中继设备
US9073322B1 (en) * 2014-03-14 2015-07-07 Xerox Corporation Electrostatic device improved membrane bonding
JP2016185600A (ja) * 2015-03-27 2016-10-27 セイコーエプソン株式会社 インクジェットヘッド、及び、インクジェットプリンター
US10770646B2 (en) * 2016-03-01 2020-09-08 Qualcomm Incorporated Manufacturing method for flexible PMUT array
JP6992292B2 (ja) * 2017-07-07 2022-01-13 コニカミノルタ株式会社 Ｍｅｍｓトランスデューサーの製造方法、ｍｅｍｓトランスデューサー、超音波探触子、および超音波診断装置

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2705392A (en) 1952-06-11 1955-04-05 Selectronics Inc Method of manufacture of piezo electric crystals
JPS56171A (en) * 1979-06-18 1981-01-06 Hitachi Ltd Ink droplet jetting device
US4730197A (en) 1985-11-06 1988-03-08 Pitney Bowes Inc. Impulse ink jet system
US4680595A (en) * 1985-11-06 1987-07-14 Pitney Bowes Inc. Impulse ink jet print head and method of making same
DE69026765T2 (de) * 1989-07-11 1996-10-24 Ngk Insulators Ltd Einen piezoelektrischen/elektrostriktiven Film enthaltende piezoelektrischer/elektrostriktiver Antrieb
US5071792A (en) 1990-11-05 1991-12-10 Harris Corporation Process for forming extremely thin integrated circuit dice
JPH07108102B2 (ja) * 1990-05-01 1995-11-15 日本碍子株式会社 圧電／電歪膜型アクチュエータの製造方法
JP3151644B2 (ja) * 1993-03-08 2001-04-03 日本碍子株式会社 圧電／電歪膜型素子
US5736993A (en) 1993-07-30 1998-04-07 Tektronix, Inc. Enhanced performance drop-on-demand ink jet head apparatus and method
JP3235635B2 (ja) 1993-11-29 2001-12-04 セイコーエプソン株式会社 インクジェット記録ヘッド
EP0695641B1 (de) * 1994-08-03 2001-04-04 Francotyp-Postalia Aktiengesellschaft & Co. Anordnung für plattenförmige Piezoaktoren und Verfahren zu deren Herstellung
US5790156A (en) 1994-09-29 1998-08-04 Tektronix, Inc. Ferroelectric relaxor actuator for an ink-jet print head
JPH08108540A (ja) * 1994-10-07 1996-04-30 Ricoh Co Ltd インクジェットヘッドの製造方法
DE69612333T2 (de) 1995-07-26 2001-10-11 Sony Corp., Tokio/Tokyo Druckvorrichtung und Verfahren zu ihrer Herstellung
JP3209082B2 (ja) * 1996-03-06 2001-09-17 セイコーエプソン株式会社 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド
JP3267151B2 (ja) * 1996-04-12 2002-03-18 ミノルタ株式会社 圧電振動部材およびその製造方法
US5855049A (en) 1996-10-28 1999-01-05 Microsound Systems, Inc. Method of producing an ultrasound transducer
JPH10202874A (ja) * 1997-01-24 1998-08-04 Seiko Epson Corp インクジェットプリンタヘッド及びその製造方法
US6102516A (en) * 1997-03-17 2000-08-15 Lexmark International, Inc. Fiducial system and method for conducting an inspection to determine if a second element is properly aligned relative to a first element
JPH10264385A (ja) 1997-03-27 1998-10-06 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP3520403B2 (ja) 1998-01-23 2004-04-19 セイコーエプソン株式会社 圧電体薄膜素子、アクチュエータ、インクジェット式記録ヘッド、及びインクジェット式記録装置
JP3379479B2 (ja) * 1998-07-01 2003-02-24 セイコーエプソン株式会社 機能性薄膜、圧電体素子、インクジェット式記録ヘッド、プリンタ、圧電体素子の製造方法およびインクジェット式記録ヘッドの製造方法、
JP2000117989A (ja) * 1998-10-13 2000-04-25 Sony Corp プリントヘッドの製造方法
JP3517876B2 (ja) 1998-10-14 2004-04-12 セイコーエプソン株式会社 強誘電体薄膜素子の製造方法、インクジェット式記録ヘッド及びインクジェットプリンタ
JP3241334B2 (ja) 1998-11-16 2001-12-25 松下電器産業株式会社 インクジェットヘッド及びその製造方法
US6552471B1 (en) * 1999-01-28 2003-04-22 Parallel Design, Inc. Multi-piezoelectric layer ultrasonic transducer for medical imaging
JP2000228547A (ja) * 1999-02-09 2000-08-15 Matsushita Electric Ind Co Ltd 圧電基板の製造方法
DE60038514D1 (de) 1999-02-17 2008-05-21 Konica Corp Tintenstrahldruckkopf
KR100691046B1 (ko) 1999-04-20 2007-03-09 시게이트 테크놀로지 엘엘씨 차동 ｐｚｔ 액티베이터를 위한 전극 패터닝
AU1430001A (en) 1999-09-03 2001-04-10 University Of Maryland At College Park, The Process for fabrication of 3-dimensional micromechanisms
ATE249341T1 (de) 1999-11-15 2003-09-15 Seiko Epson Corp Tintenstrahldruckkopf und tintenstrahlaufzeichnungsvorrichtung
JP2001171132A (ja) 1999-12-10 2001-06-26 Samsung Electro Mech Co Ltd インクジェットプリンタヘッド用アクチュエータの製造方法
US6464324B1 (en) 2000-01-31 2002-10-15 Picojet, Inc. Microfluid device and ultrasonic bonding process
US6753638B2 (en) 2000-02-03 2004-06-22 Calient Networks, Inc. Electrostatic actuator for micromechanical systems
GB2367532B (en) 2000-07-27 2004-03-10 Kyocera Corp Layered unit provided with piezoelectric ceramics,method of producing the same and ink jet printing head employing the same
JP2002141569A (ja) * 2000-08-03 2002-05-17 Tokin Ceramics Corp マイクロアクチュエータ素子
JP2002134806A (ja) * 2000-10-19 2002-05-10 Canon Inc 圧電膜型アクチュエータおよび液体噴射ヘッドとその製造方法
JP4387623B2 (ja) * 2000-12-04 2009-12-16 キヤノン株式会社 圧電素子の製造方法
US6705708B2 (en) * 2001-02-09 2004-03-16 Seiko Espon Corporation Piezoelectric thin-film element, ink-jet head using the same, and method for manufacture thereof
JP3603828B2 (ja) 2001-05-28 2004-12-22 富士ゼロックス株式会社 インクジェット式記録ヘッド及びその製造方法並びにインクジェット式記録装置
CN1403281A (zh) * 2001-09-05 2003-03-19 飞赫科技股份有限公司 压电式喷墨头的喷墨装置及其制造方法
JP2003094655A (ja) * 2001-09-27 2003-04-03 Fuji Xerox Co Ltd インクジェット記録ヘッド及びその製造方法
CN1408550A (zh) * 2001-09-28 2003-04-09 飞赫科技股份有限公司 压电式喷墨打印头及其制造方法
WO2003049209A1 (en) 2001-11-21 2003-06-12 Apogent Robotics Limited Actuator structure
JP2003266397A (ja) * 2002-03-08 2003-09-24 Tokyo Denki Univ 薄膜材料の精密切り出し加工方法
JP4305016B2 (ja) * 2002-03-18 2009-07-29 セイコーエプソン株式会社 圧電アクチュエータユニット、及び、それを用いた液体噴射ヘッド
JP4141727B2 (ja) * 2002-04-17 2008-08-27 シャープ株式会社 インクジェットヘッドおよびその製造方法
US7052117B2 (en) 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
JP4326772B2 (ja) * 2002-09-10 2009-09-09 株式会社リコー 液滴吐出ヘッド、インクカートリッジ並びにインクジェット記録装置
US6878643B2 (en) 2002-12-18 2005-04-12 The Regents Of The University Of California Electronic unit integrated into a flexible polymer body
JP4308558B2 (ja) * 2003-03-19 2009-08-05 セイコーインスツル株式会社 ヘッドチップ及びその製造方法
JP4521751B2 (ja) * 2003-03-26 2010-08-11 国立大学法人東京工業大学 チタン酸ジルコニウム酸鉛系膜、誘電体素子、誘電体膜の製造方法
US7344228B2 (en) * 2004-08-02 2008-03-18 Fujifilm Dimatix, Inc. Actuator with reduced drive capacitance
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators

Also Published As

Publication number Publication date
EP2383810A1 (en) 2011-11-02
TW200620723A (en) 2006-06-16
EP1815537A1 (en) 2007-08-08
JP5398805B2 (ja) 2014-01-29
EP1815537B1 (en) 2012-02-08
CN101069295A (zh) 2007-11-07
TWI384661B (zh) 2013-02-01
WO2006044329A1 (en) 2006-04-27
EP2383810B1 (en) 2013-04-24
ATE545159T1 (de) 2012-02-15
JP5139805B2 (ja) 2013-02-06
US7388319B2 (en) 2008-06-17
JP2012016818A (ja) 2012-01-26
US20060082257A1 (en) 2006-04-20
HK1107873A1 (en) 2008-04-18
JP2008516784A (ja) 2008-05-22
KR20070083774A (ko) 2007-08-24
CN101069295B (zh) 2010-08-18
KR101173329B1 (ko) 2012-08-10

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