ATE545159T1 - Verfahren zur bildung einer einrichtung mit einem piezoelektrischen wandler - Google Patents

Verfahren zur bildung einer einrichtung mit einem piezoelektrischen wandler

Info

Publication number
ATE545159T1
ATE545159T1 AT05806986T AT05806986T ATE545159T1 AT E545159 T1 ATE545159 T1 AT E545159T1 AT 05806986 T AT05806986 T AT 05806986T AT 05806986 T AT05806986 T AT 05806986T AT E545159 T1 ATE545159 T1 AT E545159T1
Authority
AT
Austria
Prior art keywords
forming
piezoelectric material
piezoelectric transducer
handle layer
attaching
Prior art date
Application number
AT05806986T
Other languages
English (en)
Inventor
Andreas Bibl
John Higginson
Christoph Menzel
Paul Hoisington
Original Assignee
Fujifilm Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Dimatix Inc filed Critical Fujifilm Dimatix Inc
Application granted granted Critical
Publication of ATE545159T1 publication Critical patent/ATE545159T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Micromachines (AREA)
  • Reciprocating Pumps (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Measuring Fluid Pressure (AREA)
AT05806986T 2004-10-15 2005-10-11 Verfahren zur bildung einer einrichtung mit einem piezoelektrischen wandler ATE545159T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/967,012 US7388319B2 (en) 2004-10-15 2004-10-15 Forming piezoelectric actuators
PCT/US2005/036441 WO2006044329A1 (en) 2004-10-15 2005-10-11 Microelectromechanical device with chambers and piezoelectric islands and a method of forming a device with a piezoelectric transducer

Publications (1)

Publication Number Publication Date
ATE545159T1 true ATE545159T1 (de) 2012-02-15

Family

ID=35649145

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05806986T ATE545159T1 (de) 2004-10-15 2005-10-11 Verfahren zur bildung einer einrichtung mit einem piezoelektrischen wandler

Country Status (9)

Country Link
US (1) US7388319B2 (de)
EP (2) EP1815537B1 (de)
JP (2) JP5139805B2 (de)
KR (1) KR101173329B1 (de)
CN (1) CN101069295B (de)
AT (1) ATE545159T1 (de)
HK (2) HK1163345A1 (de)
TW (1) TWI384661B (de)
WO (1) WO2006044329A1 (de)

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* Cited by examiner, † Cited by third party
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US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JP4504237B2 (ja) * 2005-03-18 2010-07-14 富士通株式会社 ウエットエッチング方法、マイクロ可動素子製造方法、およびマイクロ可動素子
US7779522B2 (en) * 2006-05-05 2010-08-24 Fujifilm Dimatix, Inc. Method for forming a MEMS
EP1997638B1 (de) * 2007-05-30 2012-11-21 Océ-Technologies B.V. Verfahren zur Erzeugung eines Arrays piezoelektrischer Aktuatoren auf einer Membran
US8313174B2 (en) 2008-08-06 2012-11-20 Xerox Corporation Method for reducing mechanical cross-talk between array structures on a substrate mounted to another substrate by an adhesive
US8053951B2 (en) * 2008-11-04 2011-11-08 Fujifilm Corporation Thin film piezoelectric actuators
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JP4930569B2 (ja) * 2009-10-14 2012-05-16 株式会社村田製作所 磁気ヘッド駆動用圧電セラミックアクチュエータ
CN102398419B (zh) * 2010-09-08 2014-06-25 研能科技股份有限公司 喷墨头压电致动单元的切割方法
US9293690B2 (en) * 2011-06-27 2016-03-22 Koninklijke Philips N.V. Ultrasound transducer assembly and method of manufacturing the same
JP2013093428A (ja) * 2011-10-25 2013-05-16 Stanley Electric Co Ltd 基板パッケージ
US9139004B2 (en) * 2012-03-05 2015-09-22 Xerox Corporation Print head transducer dicing directly on diaphragm
CN103327593B (zh) * 2012-03-21 2016-06-29 中国移动通信集团公司 一种自适应上行功控方法及移动中继设备
US9073322B1 (en) * 2014-03-14 2015-07-07 Xerox Corporation Electrostatic device improved membrane bonding
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US10770646B2 (en) * 2016-03-01 2020-09-08 Qualcomm Incorporated Manufacturing method for flexible PMUT array
JP6992292B2 (ja) * 2017-07-07 2022-01-13 コニカミノルタ株式会社 Ｍｅｍｓトランスデューサーの製造方法、ｍｅｍｓトランスデューサー、超音波探触子、および超音波診断装置

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Also Published As

Publication number Publication date
HK1107873A1 (en) 2008-04-18
EP1815537A1 (de) 2007-08-08
CN101069295A (zh) 2007-11-07
JP5139805B2 (ja) 2013-02-06
WO2006044329A1 (en) 2006-04-27
US7388319B2 (en) 2008-06-17
EP2383810A1 (de) 2011-11-02
KR20070083774A (ko) 2007-08-24
KR101173329B1 (ko) 2012-08-10
JP2012016818A (ja) 2012-01-26
EP2383810B1 (de) 2013-04-24
CN101069295B (zh) 2010-08-18
JP5398805B2 (ja) 2014-01-29
US20060082257A1 (en) 2006-04-20
TWI384661B (zh) 2013-02-01
HK1163345A1 (en) 2012-09-07
EP1815537B1 (de) 2012-02-08
TW200620723A (en) 2006-06-16
JP2008516784A (ja) 2008-05-22

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