HK1157017A1 - Measurement probe - Google Patents

Measurement probe

Info

Publication number
HK1157017A1
HK1157017A1 HK11111263.4A HK11111263A HK1157017A1 HK 1157017 A1 HK1157017 A1 HK 1157017A1 HK 11111263 A HK11111263 A HK 11111263A HK 1157017 A1 HK1157017 A1 HK 1157017A1
Authority
HK
Hong Kong
Prior art keywords
measurement probe
probe
measurement
Prior art date
Application number
HK11111263.4A
Other languages
English (en)
Chinese (zh)
Inventor
‧賽爾德
‧戈克
Original Assignee
羅森伯格高頻技術有限及兩合公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅森伯格高頻技術有限及兩合公司 filed Critical 羅森伯格高頻技術有限及兩合公司
Publication of HK1157017A1 publication Critical patent/HK1157017A1/xx

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R29/00Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
    • G01R29/08Measuring electromagnetic field characteristics
    • G01R29/0864Measuring electromagnetic field characteristics characterised by constructional or functional features
    • G01R29/0878Sensors; antennas; probes; detectors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/07Non contact-making probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G01R31/002Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
HK11111263.4A 2008-07-15 2011-10-20 Measurement probe HK1157017A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202008009469U DE202008009469U1 (de) 2008-07-15 2008-07-15 Messsonde
PCT/EP2009/004527 WO2010006683A1 (de) 2008-07-15 2009-06-23 Messsonde

Publications (1)

Publication Number Publication Date
HK1157017A1 true HK1157017A1 (en) 2012-06-22

Family

ID=39744708

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11111263.4A HK1157017A1 (en) 2008-07-15 2011-10-20 Measurement probe

Country Status (8)

Country Link
US (1) US8760184B2 (ja)
EP (1) EP2300835A1 (ja)
JP (1) JP5826628B2 (ja)
CN (1) CN102099693B (ja)
CA (1) CA2725636C (ja)
DE (1) DE202008009469U1 (ja)
HK (1) HK1157017A1 (ja)
WO (1) WO2010006683A1 (ja)

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DE202008013687U1 (de) * 2008-10-15 2009-01-02 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messanordnung mit Kalibriersubstrat und elektronischer Schaltung
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
CN102736007A (zh) * 2011-04-07 2012-10-17 旺矽科技股份有限公司 高频耦合信号调整方法及其测试装置
US20170019170A1 (en) * 2014-03-07 2017-01-19 Keysight Technologies, Inc. Dual-Directional Electro-Optic Probe
US10230202B2 (en) 2014-11-04 2019-03-12 X-Microwave, Llc Modular building block system for RF and microwave design of components and systems from concept to production
US10775414B2 (en) * 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
EP3495808A1 (en) 2017-12-05 2019-06-12 Airbus Helicopters A probe for non-intrusively detecting imperfections in a test object
EP3495809A1 (en) 2017-12-05 2019-06-12 Airbus Helicopters A method for non-intrusively detecting imperfections in a test object
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US11125779B2 (en) * 2018-11-15 2021-09-21 Rohde & Schwarz Gmbh & Co. Kg Probe with radio frequency power detector, test system and test method
CN110045269A (zh) * 2019-05-09 2019-07-23 肇庆学院 一种芯片测试装置及方法
JP7443017B2 (ja) * 2019-10-17 2024-03-05 株式会社日本マイクロニクス 検査プローブ、検査プローブの製造方法および検査装置
EP4170332A1 (en) 2021-10-20 2023-04-26 Airbus Helicopters Apparatus and method for non-intrusively detecting imperfections in a test object

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US5508630A (en) * 1994-09-09 1996-04-16 Board Of Regents, University Of Texas Systems Probe having a power detector for use with microwave or millimeter wave device
US6239752B1 (en) * 1995-02-28 2001-05-29 Stmicroelectronics, Inc. Semiconductor chip package that is also an antenna
JP3344682B2 (ja) * 1995-04-05 2002-11-11 日本電信電話株式会社 電磁妨害波侵入経路の特定方法及び電磁妨害波探索装置
JP2001124809A (ja) * 1999-10-26 2001-05-11 Advantest Corp 負荷容量付き水晶振動子の測定方法
JP3758439B2 (ja) * 1999-12-20 2006-03-22 日本精工株式会社 曲面を有する被検査体の欠陥を曲面に沿って非接触で検出する方法
JP2001242207A (ja) * 2000-02-25 2001-09-07 Anritsu Corp 高周波デバイス測定プログラムを記録した記憶媒体並びに高周波デバイス測定装置及び方法
US7006046B2 (en) * 2001-02-15 2006-02-28 Integral Technologies, Inc. Low cost electronic probe devices manufactured from conductive loaded resin-based materials
US20030115008A1 (en) * 2001-12-18 2003-06-19 Yutaka Doi Test fixture with adjustable pitch for network measurement
JP3613269B2 (ja) 2002-08-28 2005-01-26 日本電気株式会社 ノイズイミュニティ評価装置及びノイズイミュニティ評価方法
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
TW583409B (en) * 2002-12-25 2004-04-11 Advanced Semiconductor Eng Impedance standard substrate and correction method for vector network analyzer
JP2004325123A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Ind Co Ltd プローブカードおよび検査方法
JP4150296B2 (ja) * 2003-06-18 2008-09-17 日本電産リード株式会社 基板検査装置
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DE602004009778T2 (de) * 2004-07-08 2008-08-28 Alcatel Lucent Kopplungsanordnung für RF Differenzsignal-Übertragung
US7088109B2 (en) * 2004-09-30 2006-08-08 Agilent Technologies, Inc. Method and apparatus for measuring a digital device
US7548069B2 (en) * 2005-06-10 2009-06-16 Maury Microwave, Inc. Signal measurement systems and methods
US7362106B2 (en) * 2005-06-29 2008-04-22 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes
US7606592B2 (en) * 2005-09-19 2009-10-20 Becker Charles D Waveguide-based wireless distribution system and method of operation
JP2007101330A (ja) * 2005-10-04 2007-04-19 Nec Corp 磁界センサ
US7195404B1 (en) * 2006-03-03 2007-03-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Fiber optic transceiver module with electromagnetic interference absorbing material and method for making the module
US7235982B1 (en) * 2006-03-31 2007-06-26 Agilent Technologies, Inc. Re-calculating S-parameter error terms after modification of a calibrated port
DE102006030630B3 (de) * 2006-07-03 2007-10-25 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg HF-Messvorrichtung, Verfahren zu deren Kalibrierung sowie Verfahren zum Bestimmen von Streuparametern mit dieser HF-Messvorrichtung
DE202007010784U1 (de) * 2007-08-03 2007-10-04 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktloses Messsystem
US7705681B2 (en) * 2008-04-17 2010-04-27 Infineon Technologies Ag Apparatus for coupling at least one of a plurality of amplified input signals to an output terminal using a directional coupler

Also Published As

Publication number Publication date
US20110163773A1 (en) 2011-07-07
CN102099693A (zh) 2011-06-15
JP2011528107A (ja) 2011-11-10
CA2725636C (en) 2016-01-19
EP2300835A1 (de) 2011-03-30
JP5826628B2 (ja) 2015-12-02
DE202008009469U1 (de) 2008-09-11
CN102099693B (zh) 2014-07-02
US8760184B2 (en) 2014-06-24
WO2010006683A1 (de) 2010-01-21
CA2725636A1 (en) 2010-01-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200620