HK1140720A1 - Liquid droplet discharging device and method - Google Patents

Liquid droplet discharging device and method

Info

Publication number
HK1140720A1
HK1140720A1 HK10107193.8A HK10107193A HK1140720A1 HK 1140720 A1 HK1140720 A1 HK 1140720A1 HK 10107193 A HK10107193 A HK 10107193A HK 1140720 A1 HK1140720 A1 HK 1140720A1
Authority
HK
Hong Kong
Prior art keywords
plunger
liquid
droplet discharging
leading end
discharging device
Prior art date
Application number
HK10107193.8A
Other languages
English (en)
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of HK1140720A1 publication Critical patent/HK1140720A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve
HK10107193.8A 2007-03-08 2010-07-27 Liquid droplet discharging device and method HK1140720A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007057963 2007-03-08
PCT/JP2008/000433 WO2008108097A1 (ja) 2007-03-08 2008-03-04 液滴吐出装置および方法

Publications (1)

Publication Number Publication Date
HK1140720A1 true HK1140720A1 (en) 2010-10-22

Family

ID=39737994

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10107193.8A HK1140720A1 (en) 2007-03-08 2010-07-27 Liquid droplet discharging device and method

Country Status (6)

Country Link
JP (4) JP5271254B2 (ko)
KR (3) KR101600432B1 (ko)
CN (1) CN101646502B (ko)
HK (1) HK1140720A1 (ko)
TW (4) TWI631997B (ko)
WO (1) WO2008108097A1 (ko)

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JP2010022881A (ja) * 2007-03-30 2010-02-04 Musashi Eng Co Ltd 液材吐出装置および液材吐出方法
JP5465936B2 (ja) * 2009-07-01 2014-04-09 武蔵エンジニアリング株式会社 液体材料吐出方法、装置およびプログラム
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JP5806868B2 (ja) * 2011-07-11 2015-11-10 武蔵エンジニアリング株式会社 液滴吐出装置および方法
JP5986727B2 (ja) 2011-10-07 2016-09-06 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法
WO2013118669A1 (ja) 2012-02-06 2013-08-15 武蔵エンジニアリング株式会社 液体材料の吐出装置および吐出方法
JP5971018B2 (ja) * 2012-08-06 2016-08-17 富士通株式会社 塗布ノズル、塗布装置、及び塗布方法
DE102013110402A1 (de) * 2013-09-20 2015-03-26 Smart Pac Gmbh Technology Services Anordnung und Verfahren zum reproduzierbaren Aufbringen kleiner Flüssigkeitsmengen
JP6180283B2 (ja) * 2013-11-06 2017-08-16 武蔵エンジニアリング株式会社 液体材料吐出装置および方法
KR101512766B1 (ko) * 2013-11-14 2015-04-16 한형수 솔더 페이스트 토출 장치
KR20160122198A (ko) * 2014-02-14 2016-10-21 노드슨 코포레이션 분사 디스펜서, 및 유체 물질의 액적을 분사하기 위한 방법
WO2015137271A1 (ja) * 2014-03-10 2015-09-17 武蔵エンジニアリング株式会社 塗布装置および塗布方法
WO2015178239A1 (ja) * 2014-05-20 2015-11-26 エンジニアリングシステム株式会社 微量液体流出方法および微量液体ディスペンサ
JP5802347B1 (ja) * 2014-05-20 2015-10-28 エンジニアリングシステム株式会社 微量液体滴下方法および微量液体ディスペンサ
JP6582238B2 (ja) * 2016-01-18 2019-10-02 パナソニックＩｐマネジメント株式会社 液体吐出装置
JP6842152B2 (ja) * 2016-05-31 2021-03-17 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
CN106076693A (zh) * 2016-07-15 2016-11-09 苏州锡友微连电子科技有限公司 一种锡膏喷射阀
JP6772725B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
US11173562B2 (en) 2017-04-14 2021-11-16 Illinois Tool Works Inc. Solder paste feeding assembly and method
MY200719A (en) 2017-05-31 2024-01-12 Musashi Eng Inc Liquid material application method and device for implementing said method
IT201700067828A1 (it) * 2017-06-19 2018-12-19 Kromia S R L Macchina di smaltatura per supporti ceramici.
JP6892686B2 (ja) * 2017-12-27 2021-06-23 株式会社日本スペリア社 はんだ塗布装置用ノズル
AT522763B1 (de) * 2019-12-05 2021-01-15 Metallconcept Gmbh Druckkopf
KR102446597B1 (ko) * 2020-11-17 2022-09-23 주식회사 엠아이티 고정밀 솔더링 장치 및 이의 제어방법
JP7066229B2 (ja) * 2021-01-06 2022-05-13 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
TWI775477B (zh) * 2021-06-07 2022-08-21 萬潤科技股份有限公司 液室機構及液材擠出裝置
CN114405764B (zh) * 2022-02-23 2022-11-29 无锡冰平自动化技术有限公司 一种阀座型腔开合行程相同的注胶管体

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Also Published As

Publication number Publication date
KR101600432B1 (ko) 2016-03-08
KR20150029008A (ko) 2015-03-17
JP5990290B2 (ja) 2016-09-14
JP2015134347A (ja) 2015-07-27
TWI426973B (zh) 2014-02-21
JPWO2008108097A1 (ja) 2010-06-10
KR20140077222A (ko) 2014-06-23
JP5684853B2 (ja) 2015-03-18
TW201642983A (zh) 2016-12-16
KR101499597B1 (ko) 2015-03-06
TW200918229A (en) 2009-05-01
CN101646502B (zh) 2013-02-20
KR20090119770A (ko) 2009-11-19
TWI537084B (zh) 2016-06-11
TW201733685A (zh) 2017-10-01
JP2017006916A (ja) 2017-01-12
CN101646502A (zh) 2010-02-10
KR101521902B1 (ko) 2015-05-20
JP6312758B2 (ja) 2018-04-18
JP5271254B2 (ja) 2013-08-21
JP2013208613A (ja) 2013-10-10
WO2008108097A1 (ja) 2008-09-12
TWI631997B (zh) 2018-08-11
TWI590904B (zh) 2017-07-11
TW201427788A (zh) 2014-07-16

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