HK1129904A1 - Polyimide resin - Google Patents
Polyimide resinInfo
- Publication number
- HK1129904A1 HK1129904A1 HK09108453A HK09108453A HK1129904A1 HK 1129904 A1 HK1129904 A1 HK 1129904A1 HK 09108453 A HK09108453 A HK 09108453A HK 09108453 A HK09108453 A HK 09108453A HK 1129904 A1 HK1129904 A1 HK 1129904A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- polyimide resin
- polyimide
- resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006187980 | 2006-07-07 | ||
PCT/JP2007/063447 WO2008004615A1 (en) | 2006-07-07 | 2007-07-05 | Polyimide resin |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1129904A1 true HK1129904A1 (en) | 2009-12-11 |
Family
ID=38894582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09108453A HK1129904A1 (en) | 2006-07-07 | 2009-09-16 | Polyimide resin |
Country Status (8)
Country | Link |
---|---|
US (1) | US8580913B2 (ko) |
EP (1) | EP2039716B1 (ko) |
JP (1) | JPWO2008004615A1 (ko) |
KR (1) | KR101413889B1 (ko) |
CN (1) | CN101454378B (ko) |
HK (1) | HK1129904A1 (ko) |
TW (1) | TWI403539B (ko) |
WO (1) | WO2008004615A1 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090305046A1 (en) * | 2006-07-20 | 2009-12-10 | Tsuyoshi Bito | Thermocurable Polyimide Resin Composition |
JP2009114415A (ja) * | 2007-11-09 | 2009-05-28 | Nitto Denko Corp | ポリイミドを含む光半導体素子封止用樹脂およびそれを用いて得られる光半導体装置 |
JP2012224755A (ja) * | 2011-04-20 | 2012-11-15 | Hitachi Chemical Dupont Microsystems Ltd | 高透明なポリイミド前駆体及びそれを用いた樹脂組成物、ポリイミド成形体とその製造方法、プラスチック基板、保護膜とそれを有する電子部品、表示装置 |
KR20150024359A (ko) * | 2012-06-04 | 2015-03-06 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 캐리어 부착 금속박 |
KR101294433B1 (ko) * | 2012-11-05 | 2013-08-08 | (주)상아프론테크 | 다층본딩시트 |
CN104163923A (zh) * | 2013-05-17 | 2014-11-26 | 联茂电子股份有限公司 | 含马来酸酐的聚酰亚胺树脂及其制造方法 |
US9771456B2 (en) | 2013-07-01 | 2017-09-26 | Iteq Corporation | Polyimide resins containing polymaleic anhydride and method for manufacturing the same |
KR101585981B1 (ko) | 2014-07-30 | 2016-01-18 | 한국신발피혁연구원 | 내열성을 가지는 금속 접착 코팅 조성물 및 이를 적용하기 위한 금속 표면처리 방법 |
KR101703804B1 (ko) * | 2014-12-30 | 2017-02-07 | 에스케이씨코오롱피아이 주식회사 | 가교형 수용성 열가소성 폴리아믹산을 이용한 열융착 다층 폴리이미드 필름, 및 이의 제조방법 |
KR101668059B1 (ko) * | 2014-12-30 | 2016-10-20 | 에스케이씨코오롱피아이 주식회사 | 가교형 수용성 열가소성 폴리아믹산 및 이의 제조방법 |
JP6750363B2 (ja) * | 2016-07-20 | 2020-09-02 | 日立化成株式会社 | 積層体、金属張積層体及びプリント配線板 |
WO2019163830A1 (ja) * | 2018-02-23 | 2019-08-29 | 三菱瓦斯化学株式会社 | ポリイミド樹脂、ポリイミドワニス及びポリイミドフィルム |
WO2021065051A1 (ja) | 2019-10-03 | 2021-04-08 | 三井化学株式会社 | ポリイミドフィルム、ポリアミド酸およびこれを含むワニス、ならびにポリイミド積層体およびその製造方法 |
CN112194791A (zh) * | 2020-06-16 | 2021-01-08 | 中国科学院长春应用化学研究所 | 一种透明聚酰亚胺薄膜及其制备方法 |
CN114181134B (zh) * | 2020-09-15 | 2024-01-05 | 航天特种材料及工艺技术研究所 | 降冰片烯封端的酰亚胺小分子化合物及其制备方法、用途 |
CN112291920B (zh) * | 2020-12-21 | 2021-03-09 | 江苏行坤锐科技有限公司 | 一种高粘附性低介电参数聚酰亚胺挠性电路板 |
JP2023019193A (ja) * | 2021-07-28 | 2023-02-09 | 株式会社ディスコ | 被加工物の加工方法 |
WO2023210038A1 (ja) * | 2022-04-25 | 2023-11-02 | 日本化薬株式会社 | ビスマレイミド化合物、それを用いた樹脂組成物、その硬化物及び半導体素子 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3639343A (en) | 1969-02-11 | 1972-02-01 | Du Pont | Polyimides and copolyimides from aromatic diamines and alicyclic dianhydrides |
JPS5591895A (en) | 1978-12-29 | 1980-07-11 | Matsushita Electric Works Ltd | Flexible circuit copper coated plate |
JP2943953B2 (ja) | 1990-11-30 | 1999-08-30 | 宇部興産株式会社 | 耐熱性接着剤 |
JP3014526B2 (ja) | 1991-02-21 | 2000-02-28 | 三井化学株式会社 | 耐熱性接着剤 |
US5252700A (en) * | 1991-04-30 | 1993-10-12 | Mitsui Toatsu Chemicals, Inc. | Heat-resistant adhesive and method of adhesion by using adhesive |
JPH07207247A (ja) * | 1994-01-18 | 1995-08-08 | Kanegafuchi Chem Ind Co Ltd | 耐熱性接着剤 |
MY131961A (en) * | 2000-03-06 | 2007-09-28 | Hitachi Chemical Co Ltd | Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof |
JP2001329246A (ja) | 2000-05-25 | 2001-11-27 | Kanegafuchi Chem Ind Co Ltd | 耐湿特性が改良された接着剤用硬化性樹脂組成物、それより得られる硬化物およびその製造方法。 |
JP2003168800A (ja) | 2001-11-30 | 2003-06-13 | Mitsubishi Gas Chem Co Inc | 薄膜トランジスタ基板 |
DE10218452A1 (de) | 2002-04-25 | 2003-11-06 | Sick Ag | Verfahren zum Betrieb eines optoelektronischen Sensors, insbesondere eines Codelesers und Codeleser |
JP2004083885A (ja) * | 2002-07-01 | 2004-03-18 | Du Pont Toray Co Ltd | ポリアミック酸混合物、ポリイミド、ポリイミドフィルムおよびその用途 |
JP2004083875A (ja) | 2002-07-01 | 2004-03-18 | Du Pont Toray Co Ltd | ポリアミック酸混合物、ポリイミドフィルムおよびその用途 |
JP4872185B2 (ja) | 2003-05-06 | 2012-02-08 | 三菱瓦斯化学株式会社 | 金属張り積層体 |
JP4872187B2 (ja) | 2003-05-09 | 2012-02-08 | 三菱瓦斯化学株式会社 | 金属張積層体 |
KR101075771B1 (ko) | 2003-05-09 | 2011-10-24 | 미츠비시 가스 가가쿠 가부시키가이샤 | 금속박 부착형 적층체 |
JP4375533B2 (ja) * | 2003-06-26 | 2009-12-02 | 三菱瓦斯化学株式会社 | 溶媒可溶性ポリイミドの製造方法 |
US7994274B2 (en) * | 2003-09-02 | 2011-08-09 | I.S.T. (Ma) Corporation | Two-stage cure polyimide oligomers |
US7129318B2 (en) * | 2003-09-02 | 2006-10-31 | I.S.T. (Ma) Corporation | RTM and RI processable polyimide resins |
CN101466774B (zh) * | 2006-07-18 | 2012-07-04 | 三菱瓦斯化学株式会社 | 聚酰亚胺树脂 |
JP5380805B2 (ja) * | 2006-08-31 | 2014-01-08 | Jnc株式会社 | インクジェット用インク |
-
2007
- 2007-07-05 CN CN200780019828XA patent/CN101454378B/zh active Active
- 2007-07-05 KR KR1020087029716A patent/KR101413889B1/ko active IP Right Grant
- 2007-07-05 JP JP2008523727A patent/JPWO2008004615A1/ja active Pending
- 2007-07-05 EP EP20070768196 patent/EP2039716B1/en not_active Ceased
- 2007-07-05 WO PCT/JP2007/063447 patent/WO2008004615A1/ja active Application Filing
- 2007-07-05 US US12/307,784 patent/US8580913B2/en not_active Expired - Fee Related
- 2007-07-06 TW TW96124575A patent/TWI403539B/zh active
-
2009
- 2009-09-16 HK HK09108453A patent/HK1129904A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20090291259A1 (en) | 2009-11-26 |
CN101454378A (zh) | 2009-06-10 |
KR101413889B1 (ko) | 2014-06-30 |
JPWO2008004615A1 (ja) | 2009-12-03 |
US8580913B2 (en) | 2013-11-12 |
CN101454378B (zh) | 2011-06-01 |
WO2008004615A1 (en) | 2008-01-10 |
EP2039716A4 (en) | 2010-07-21 |
EP2039716A1 (en) | 2009-03-25 |
KR20090036087A (ko) | 2009-04-13 |
TW200808872A (en) | 2008-02-16 |
EP2039716B1 (en) | 2012-02-22 |
TWI403539B (zh) | 2013-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20170705 |