HK1129904A1 - Polyimide resin - Google Patents

Polyimide resin

Info

Publication number
HK1129904A1
HK1129904A1 HK09108453A HK09108453A HK1129904A1 HK 1129904 A1 HK1129904 A1 HK 1129904A1 HK 09108453 A HK09108453 A HK 09108453A HK 09108453 A HK09108453 A HK 09108453A HK 1129904 A1 HK1129904 A1 HK 1129904A1
Authority
HK
Hong Kong
Prior art keywords
polyimide resin
polyimide
resin
Prior art date
Application number
HK09108453A
Other languages
English (en)
Inventor
Tsuyoshi Bito
Shuta Kihara
Jitsuo Oishi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of HK1129904A1 publication Critical patent/HK1129904A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
HK09108453A 2006-07-07 2009-09-16 Polyimide resin HK1129904A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006187980 2006-07-07
PCT/JP2007/063447 WO2008004615A1 (en) 2006-07-07 2007-07-05 Polyimide resin

Publications (1)

Publication Number Publication Date
HK1129904A1 true HK1129904A1 (en) 2009-12-11

Family

ID=38894582

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09108453A HK1129904A1 (en) 2006-07-07 2009-09-16 Polyimide resin

Country Status (8)

Country Link
US (1) US8580913B2 (xx)
EP (1) EP2039716B1 (xx)
JP (1) JPWO2008004615A1 (xx)
KR (1) KR101413889B1 (xx)
CN (1) CN101454378B (xx)
HK (1) HK1129904A1 (xx)
TW (1) TWI403539B (xx)
WO (1) WO2008004615A1 (xx)

Families Citing this family (18)

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JP5293182B2 (ja) * 2006-07-20 2013-09-18 三菱瓦斯化学株式会社 熱硬化性ポリイミド樹脂組成物
JP2009114415A (ja) 2007-11-09 2009-05-28 Nitto Denko Corp ポリイミドを含む光半導体素子封止用樹脂およびそれを用いて得られる光半導体装置
JP2012224755A (ja) * 2011-04-20 2012-11-15 Hitachi Chemical Dupont Microsystems Ltd 高透明なポリイミド前駆体及びそれを用いた樹脂組成物、ポリイミド成形体とその製造方法、プラスチック基板、保護膜とそれを有する電子部品、表示装置
KR20170034947A (ko) * 2012-06-04 2017-03-29 제이엑스금속주식회사 캐리어 부착 금속박
KR101294433B1 (ko) * 2012-11-05 2013-08-08 (주)상아프론테크 다층본딩시트
CN104163923A (zh) * 2013-05-17 2014-11-26 联茂电子股份有限公司 含马来酸酐的聚酰亚胺树脂及其制造方法
US9771456B2 (en) 2013-07-01 2017-09-26 Iteq Corporation Polyimide resins containing polymaleic anhydride and method for manufacturing the same
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KR101668059B1 (ko) * 2014-12-30 2016-10-20 에스케이씨코오롱피아이 주식회사 가교형 수용성 열가소성 폴리아믹산 및 이의 제조방법
KR101703804B1 (ko) * 2014-12-30 2017-02-07 에스케이씨코오롱피아이 주식회사 가교형 수용성 열가소성 폴리아믹산을 이용한 열융착 다층 폴리이미드 필름, 및 이의 제조방법
JP6750363B2 (ja) * 2016-07-20 2020-09-02 日立化成株式会社 積層体、金属張積層体及びプリント配線板
KR20200124670A (ko) * 2018-02-23 2020-11-03 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 폴리이미드 수지, 폴리이미드바니시 및 폴리이미드필름
KR20220056861A (ko) 2019-10-03 2022-05-06 미쓰이 가가쿠 가부시키가이샤 폴리이미드 필름, 폴리아마이드산 및 이것을 포함하는 바니시, 및 폴리이미드 적층체 및 그 제조 방법
CN112194791A (zh) * 2020-06-16 2021-01-08 中国科学院长春应用化学研究所 一种透明聚酰亚胺薄膜及其制备方法
CN114181134B (zh) * 2020-09-15 2024-01-05 航天特种材料及工艺技术研究所 降冰片烯封端的酰亚胺小分子化合物及其制备方法、用途
CN112291920B (zh) * 2020-12-21 2021-03-09 江苏行坤锐科技有限公司 一种高粘附性低介电参数聚酰亚胺挠性电路板
JP2023019193A (ja) * 2021-07-28 2023-02-09 株式会社ディスコ 被加工物の加工方法
WO2023210038A1 (ja) * 2022-04-25 2023-11-02 日本化薬株式会社 ビスマレイミド化合物、それを用いた樹脂組成物、その硬化物及び半導体素子

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Also Published As

Publication number Publication date
EP2039716B1 (en) 2012-02-22
CN101454378A (zh) 2009-06-10
EP2039716A1 (en) 2009-03-25
KR20090036087A (ko) 2009-04-13
TWI403539B (zh) 2013-08-01
WO2008004615A1 (en) 2008-01-10
TW200808872A (en) 2008-02-16
US20090291259A1 (en) 2009-11-26
KR101413889B1 (ko) 2014-06-30
EP2039716A4 (en) 2010-07-21
CN101454378B (zh) 2011-06-01
JPWO2008004615A1 (ja) 2009-12-03
US8580913B2 (en) 2013-11-12

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20170705