HK1120572A1 - Plating solution for electroless palladium plating - Google Patents

Plating solution for electroless palladium plating

Info

Publication number
HK1120572A1
HK1120572A1 HK08112251.1A HK08112251A HK1120572A1 HK 1120572 A1 HK1120572 A1 HK 1120572A1 HK 08112251 A HK08112251 A HK 08112251A HK 1120572 A1 HK1120572 A1 HK 1120572A1
Authority
HK
Hong Kong
Prior art keywords
plating
electroless palladium
solution
plating solution
palladium plating
Prior art date
Application number
HK08112251.1A
Other languages
English (en)
Inventor
Akihiro Aiba
Hirofumi Takahashi
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1120572A1 publication Critical patent/HK1120572A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
HK08112251.1A 2005-07-20 2008-11-07 Plating solution for electroless palladium plating HK1120572A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005209696 2005-07-20
PCT/JP2006/313565 WO2007010760A1 (ja) 2005-07-20 2006-07-07 無電解パラジウムめっき液

Publications (1)

Publication Number Publication Date
HK1120572A1 true HK1120572A1 (en) 2009-04-03

Family

ID=37668642

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08112251.1A HK1120572A1 (en) 2005-07-20 2008-11-07 Plating solution for electroless palladium plating

Country Status (7)

Country Link
US (1) US7704307B2 (zh)
JP (1) JP4596553B2 (zh)
KR (1) KR20080015936A (zh)
CN (1) CN101228293B (zh)
HK (1) HK1120572A1 (zh)
TW (1) TWI324640B (zh)
WO (1) WO2007010760A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4844716B2 (ja) * 2005-09-27 2011-12-28 上村工業株式会社 無電解パラジウムめっき浴
JP2008184679A (ja) * 2007-01-31 2008-08-14 Okuno Chem Ind Co Ltd 無電解パラジウムめっき用活性化組成物
US7981202B2 (en) * 2007-02-28 2011-07-19 Kojima Chemicals Co., Ltd. Electroless pure palladium plating solution
JP4117016B1 (ja) 2007-08-15 2008-07-09 小島化学薬品株式会社 無電解パラジウムめっき液
CN102245806A (zh) * 2008-12-05 2011-11-16 Omg美国公司 无电镀钯溶液及其使用方法
JP4511623B1 (ja) * 2009-05-08 2010-07-28 小島化学薬品株式会社 無電解パラジウムめっき液
CN101709462B (zh) * 2009-12-23 2012-01-11 长沙理工大学 一种化学镀钯液
JP2012241260A (ja) * 2011-05-23 2012-12-10 Kanto Gakuin 電解パラジウム−リン合金めっき液、めっき被膜及びめっき製品
EP2581470B1 (en) 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
KR20130055956A (ko) * 2011-11-21 2013-05-29 삼성전기주식회사 무전해 팔라듐 도금액
JP6061369B2 (ja) * 2012-01-30 2017-01-18 凸版印刷株式会社 配線基板およびその製造方法、ならびにはんだ付き配線基板の製造方法
US8936672B1 (en) 2012-06-22 2015-01-20 Accu-Labs, Inc. Polishing and electroless nickel compositions, kits, and methods
CN104218248B (zh) * 2013-05-31 2017-04-19 中国科学院大连化学物理研究所 一种双功能负极及其作为全钒液流储能电池负极的应用
US20150024123A1 (en) * 2013-07-16 2015-01-22 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing iminodiacetic acid and derivatives
CN104498918A (zh) * 2014-11-28 2015-04-08 广东致卓精密金属科技有限公司 一种用于化学镀镍钯金工艺中间层的化学镀钯液
CN104911570A (zh) * 2015-05-14 2015-09-16 上海应用技术学院 一种在铜表面进行化学镀钯的镀液及其制备方法
US9603258B2 (en) 2015-08-05 2017-03-21 Uyemura International Corporation Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom
JP7185999B2 (ja) 2017-10-06 2022-12-08 上村工業株式会社 無電解パラジウムめっき液
JP7149061B2 (ja) 2017-10-06 2022-10-06 上村工業株式会社 無電解パラジウムめっき液
CN108118182A (zh) * 2017-12-30 2018-06-05 安徽晋源铜业有限公司 一种集成电路封装用镀钯铜线的加工方法
CN111712589B (zh) * 2018-02-20 2022-10-04 上村工业株式会社 化学镀钯液和钯镀膜
JP7407644B2 (ja) * 2020-04-03 2024-01-04 上村工業株式会社 パラジウムめっき液及びめっき方法
EP3960898A1 (en) * 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate
EP4215642A1 (en) 2022-01-25 2023-07-26 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on an activated copper-coated substrate

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
US3615737A (en) * 1969-08-04 1971-10-26 Photocircuits Corp Electroless copper deposition
US4143186A (en) * 1976-09-20 1979-03-06 Amp Incorporated Process for electroless copper deposition from an acidic bath
DE3790128C2 (de) * 1986-03-04 1995-07-27 Ishihara Chemical Co Ltd Wässrige Lösung zur stromlosen Beschichtung auf Palladium-Basis
JPH0539580A (ja) * 1991-08-02 1993-02-19 Okuno Seiyaku Kogyo Kk 無電解パラジウムめつき液
JP3115095B2 (ja) * 1992-04-20 2000-12-04 ディップソール株式会社 無電解メッキ液及びそれを使用するメッキ方法
JP3035763B2 (ja) 1993-08-30 2000-04-24 小島化学薬品株式会社 無電解パラジウムめっき液
JP3412266B2 (ja) 1994-07-20 2003-06-03 日本精工株式会社 リニアガイド装置のインナーシール付ボール保持器
JP3204035B2 (ja) 1995-03-30 2001-09-04 上村工業株式会社 無電解パラジウムめっき液及びめっき方法
JP2000129454A (ja) 1998-10-21 2000-05-09 Hitachi Chem Co Ltd 無電解パラジウムめっき液
JP3437980B2 (ja) 2000-04-10 2003-08-18 有限会社関東学院大学表面工学研究所 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品
US20060251910A1 (en) * 2005-05-06 2006-11-09 Lancsek Thomas S Composite electroless plating

Also Published As

Publication number Publication date
WO2007010760A1 (ja) 2007-01-25
CN101228293B (zh) 2010-12-08
JP4596553B2 (ja) 2010-12-08
US20090081369A1 (en) 2009-03-26
JPWO2007010760A1 (ja) 2009-01-29
CN101228293A (zh) 2008-07-23
KR20080015936A (ko) 2008-02-20
TWI324640B (en) 2010-05-11
US7704307B2 (en) 2010-04-27
TW200710281A (en) 2007-03-16

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