CN101709462B - 一种化学镀钯液 - Google Patents
一种化学镀钯液 Download PDFInfo
- Publication number
- CN101709462B CN101709462B CN2009103121327A CN200910312132A CN101709462B CN 101709462 B CN101709462 B CN 101709462B CN 2009103121327 A CN2009103121327 A CN 2009103121327A CN 200910312132 A CN200910312132 A CN 200910312132A CN 101709462 B CN101709462 B CN 101709462B
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- Prior art keywords
- palladium
- plating solution
- chemical
- complexing agent
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 182
- 238000007747 plating Methods 0.000 title claims abstract description 109
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 96
- 239000000126 substance Substances 0.000 title claims abstract description 47
- 239000008139 complexing agent Substances 0.000 claims abstract description 30
- 150000002940 palladium Chemical class 0.000 claims abstract description 26
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 19
- -1 diamine compounds Chemical class 0.000 claims abstract description 19
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 9
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 28
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 26
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 15
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 claims description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 229960004418 trolamine Drugs 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 8
- 230000002829 reductive effect Effects 0.000 claims description 8
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 7
- 239000003153 chemical reaction reagent Substances 0.000 claims description 7
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical group FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 6
- 150000003863 ammonium salts Chemical class 0.000 claims description 6
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 6
- 239000006174 pH buffer Substances 0.000 claims description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 3
- LXAHHHIGZXPRKQ-UHFFFAOYSA-N 5-fluoro-2-methylpyridine Chemical compound CC1=CC=C(F)C=N1 LXAHHHIGZXPRKQ-UHFFFAOYSA-N 0.000 claims description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 3
- KGWDUNBJIMUFAP-KVVVOXFISA-N Ethanolamine Oleate Chemical compound NCCO.CCCCCCCC\C=C/CCCCCCCC(O)=O KGWDUNBJIMUFAP-KVVVOXFISA-N 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- BAIBRYAATTUQMG-UHFFFAOYSA-N azane;propanoic acid Chemical compound [NH4+].CCC(O)=O.CCC([O-])=O BAIBRYAATTUQMG-UHFFFAOYSA-N 0.000 claims description 3
- 150000001622 bismuth compounds Chemical class 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 235000019253 formic acid Nutrition 0.000 claims description 3
- 235000013905 glycine and its sodium salt Nutrition 0.000 claims description 3
- 235000011167 hydrochloric acid Nutrition 0.000 claims description 3
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 claims description 3
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 235000011007 phosphoric acid Nutrition 0.000 claims description 3
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims description 3
- NCPXQVVMIXIKTN-UHFFFAOYSA-N trisodium;phosphite Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])[O-] NCPXQVVMIXIKTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 32
- 229910052759 nickel Inorganic materials 0.000 abstract description 16
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 3
- 239000011574 phosphorus Substances 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 239000003381 stabilizer Substances 0.000 abstract 1
- 239000006210 lotion Substances 0.000 description 22
- 239000000758 substrate Substances 0.000 description 18
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 10
- 101150003085 Pdcl gene Proteins 0.000 description 9
- 238000001816 cooling Methods 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000004062 sedimentation Methods 0.000 description 7
- 238000000576 coating method Methods 0.000 description 6
- PPNKDDZCLDMRHS-UHFFFAOYSA-N dinitrooxybismuthanyl nitrate Chemical compound [Bi+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PPNKDDZCLDMRHS-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000003628 erosive effect Effects 0.000 description 4
- 238000006722 reduction reaction Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000536 complexating effect Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009776 industrial production Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- YMAWOPBAYDPSLA-UHFFFAOYSA-N glycylglycine Chemical compound [NH3+]CC(=O)NCC([O-])=O YMAWOPBAYDPSLA-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- 108010008488 Glycylglycine Proteins 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-N Nitrous acid Chemical compound ON=O IOVCWXUNBOPUCH-UHFFFAOYSA-N 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000010668 complexation reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000003963 dichloro group Chemical group Cl* 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229940043257 glycylglycine Drugs 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000008363 phosphate buffer Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- PODWXQQNRWNDGD-UHFFFAOYSA-L sodium thiosulfate pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[O-]S([S-])(=O)=O PODWXQQNRWNDGD-UHFFFAOYSA-L 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
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CN2009103121327A CN101709462B (zh) | 2009-12-23 | 2009-12-23 | 一种化学镀钯液 |
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CN2009103121327A CN101709462B (zh) | 2009-12-23 | 2009-12-23 | 一种化学镀钯液 |
Publications (2)
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CN101709462A CN101709462A (zh) | 2010-05-19 |
CN101709462B true CN101709462B (zh) | 2012-01-11 |
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CN2009103121327A Expired - Fee Related CN101709462B (zh) | 2009-12-23 | 2009-12-23 | 一种化学镀钯液 |
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Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101990363A (zh) * | 2010-08-06 | 2011-03-23 | 雷玉菡 | 一种电子线路板的镀金方法 |
CN102154635A (zh) * | 2011-02-24 | 2011-08-17 | 南京工业大学 | 一种多孔不锈钢负载型钯或钯合金膜的制备工艺 |
US8568824B2 (en) * | 2011-06-06 | 2013-10-29 | Xerox Corporation | Palladium precursor composition |
CN103290399B (zh) * | 2013-06-19 | 2015-09-30 | 广东东硕科技有限公司 | 一种使用复合稳定剂的化学镀钯液 |
CN103556140A (zh) * | 2013-11-13 | 2014-02-05 | 北京达博有色金属焊料有限责任公司 | 一种用于化学法制备镀钯铜键合丝的镀钯液 |
CN103726037B (zh) * | 2013-12-29 | 2017-02-08 | 长沙理工大学 | 一种化学浸钯液 |
CN104674201A (zh) * | 2015-02-11 | 2015-06-03 | 江苏澳光电子有限公司 | 一种用于金属表面镀覆金属钯镀层的化学镀钯液 |
CN105018908A (zh) * | 2015-03-23 | 2015-11-04 | 深圳市贝加电子材料有限公司 | 用于线路板表面处理的化学镀钌溶液和线路板表面处理方法 |
CN106540282B (zh) * | 2015-09-16 | 2019-09-24 | 天津赛德生物制药有限公司 | 一种钯-103密封籽源源芯的制备方法 |
CN106191825B (zh) * | 2016-07-04 | 2018-08-21 | 长沙理工大学 | 一种基于so42-体系的置换-还原化学镀钯液 |
CN109137488A (zh) * | 2017-06-27 | 2019-01-04 | 刘志红 | 一种钴-铁-磷非晶合金/聚合物复合纤维及生产方法 |
CN108118182A (zh) * | 2017-12-30 | 2018-06-05 | 安徽晋源铜业有限公司 | 一种集成电路封装用镀钯铜线的加工方法 |
CN110062523A (zh) * | 2019-04-04 | 2019-07-26 | 广州兴森快捷电路科技有限公司 | 金手指及其制作方法、电路板及其制作方法 |
CN110468394B (zh) * | 2019-08-02 | 2021-09-28 | 珠海联鼎化工设备有限公司 | 一种化学镀镍钯金的银基线路板及其制备方法 |
JP7407644B2 (ja) * | 2020-04-03 | 2024-01-04 | 上村工業株式会社 | パラジウムめっき液及びめっき方法 |
CN111621773B (zh) * | 2020-05-27 | 2022-08-16 | 广东东硕科技有限公司 | 二硫代氨基甲酸类化合物在化学镀钯中的应用以及化学镀钯组合物 |
CN111947697A (zh) * | 2020-08-24 | 2020-11-17 | 重庆理工大学 | 一种新的光纤布拉格光栅氢气传感器及制作方法 |
CN112301334B (zh) * | 2020-10-30 | 2021-09-10 | 吉安宏达秋科技有限公司 | 一种化学镀钯液及其应用、化学镀钯的方法 |
CN113005439B (zh) * | 2021-02-24 | 2021-11-16 | 深圳市创智成功科技有限公司 | 一种电子封装载板的化学镀钯工艺 |
CN113046733B (zh) * | 2021-03-04 | 2022-04-05 | 深圳市创智成功科技有限公司 | 一种用于pcb电路板化学镍金的钯活化方法 |
CN117384221B (zh) * | 2023-10-12 | 2024-05-07 | 贵研化学材料(云南)有限公司 | 一种草酸合酰胺钯化合物、其制备方法及应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101228293A (zh) * | 2005-07-20 | 2008-07-23 | 日矿金属株式会社 | 化学镀钯液 |
CN101440486A (zh) * | 2007-08-15 | 2009-05-27 | 小岛化学药品株式会社 | 非电解钯镀液 |
-
2009
- 2009-12-23 CN CN2009103121327A patent/CN101709462B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101228293A (zh) * | 2005-07-20 | 2008-07-23 | 日矿金属株式会社 | 化学镀钯液 |
CN101440486A (zh) * | 2007-08-15 | 2009-05-27 | 小岛化学药品株式会社 | 非电解钯镀液 |
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