HK1120283A1 - White prepreg, white laminated plate, and metal foil clad white laminated plate - Google Patents
White prepreg, white laminated plate, and metal foil clad white laminated plateInfo
- Publication number
- HK1120283A1 HK1120283A1 HK09100274.8A HK09100274A HK1120283A1 HK 1120283 A1 HK1120283 A1 HK 1120283A1 HK 09100274 A HK09100274 A HK 09100274A HK 1120283 A1 HK1120283 A1 HK 1120283A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- white
- laminated plate
- metal foil
- prepreg
- white laminated
- Prior art date
Links
- 239000011888 foil Substances 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/294—Coated or with bond, impregnation or core including metal or compound thereof [excluding glass, ceramic and asbestos]
- Y10T428/2956—Glass or silicic fiber or filament with metal coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005140406A JP4634856B2 (ja) | 2005-05-12 | 2005-05-12 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
PCT/JP2006/309422 WO2006121090A1 (ja) | 2005-05-12 | 2006-05-10 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1120283A1 true HK1120283A1 (en) | 2009-03-27 |
Family
ID=37396597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09100274.8A HK1120283A1 (en) | 2005-05-12 | 2009-01-09 | White prepreg, white laminated plate, and metal foil clad white laminated plate |
Country Status (11)
Country | Link |
---|---|
US (1) | US20090194320A1 (ja) |
EP (1) | EP1887031B1 (ja) |
JP (1) | JP4634856B2 (ja) |
KR (1) | KR100940232B1 (ja) |
CN (1) | CN101218285B (ja) |
CA (1) | CA2608179C (ja) |
DE (1) | DE602006011456D1 (ja) |
HK (1) | HK1120283A1 (ja) |
MY (1) | MY144427A (ja) |
TW (1) | TWI403545B (ja) |
WO (1) | WO2006121090A1 (ja) |
Families Citing this family (42)
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JP2008223167A (ja) * | 2007-03-12 | 2008-09-25 | Hideki Ueshiba | 発光標識体 |
JP5421546B2 (ja) * | 2007-07-05 | 2014-02-19 | 日立化成株式会社 | 熱硬化性光反射用樹脂組成物、並びにその樹脂組成物を用いた光半導体素子搭載用基板及び光半導体装置 |
US8042976B2 (en) * | 2007-11-30 | 2011-10-25 | Taiyo Holdings Co., Ltd. | White hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device |
US20090141505A1 (en) * | 2007-11-30 | 2009-06-04 | Taiyo Ink Mfg., Co,. Ltd. | White heat-hardening resin composition, hardened material, printed-wiring board and reflection board for light emitting device |
US8585272B2 (en) * | 2008-01-09 | 2013-11-19 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
US8637593B2 (en) | 2008-01-09 | 2014-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate |
CA2726173C (en) | 2008-05-29 | 2016-02-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal base circuit board |
JP2010100800A (ja) * | 2008-09-24 | 2010-05-06 | Hitachi Chem Co Ltd | 光学部材のプリント配線板用樹脂組成物及び銅張積層板 |
KR101372616B1 (ko) | 2008-09-30 | 2014-03-11 | 히타치가세이가부시끼가이샤 | 코트제, 이것을 사용한 광반도체 소자 탑재용 기판 및 광반도체 장치 |
JP2010114427A (ja) * | 2008-10-08 | 2010-05-20 | Sumitomo Chemical Co Ltd | チップ型ledパッケージ用基板 |
JP2010155980A (ja) * | 2008-12-02 | 2010-07-15 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物並びにプリプレグ、積層板 |
CN102300909B (zh) * | 2009-01-28 | 2014-06-18 | 日立化成工业株式会社 | 预浸料坯、带有树脂的膜、带有树脂的金属箔、覆金属箔层叠板及印制电路板 |
WO2010100812A1 (ja) * | 2009-03-02 | 2010-09-10 | 株式会社ビッズソリューション | プリント配線基板,電子機器,及びプリント配線基板の製造方法 |
TWI477555B (zh) | 2009-06-26 | 2015-03-21 | Asahi Rubber Inc | White reflective material and its manufacturing method |
KR101644047B1 (ko) | 2009-07-09 | 2016-08-01 | 삼성전자 주식회사 | 발광체-고분자 복합체용 조성물, 발광체-고분자 복합체 및 상기 발광체-고분자 복합체를 포함하는 발광 소자 |
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JP5463586B2 (ja) * | 2009-12-21 | 2014-04-09 | 利昌工業株式会社 | プリプレグ、積層板、及び金属箔張り積層板 |
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JP2012004248A (ja) * | 2010-06-15 | 2012-01-05 | Toshiba Lighting & Technology Corp | 発光モジュールおよび照明装置 |
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AU2013329252B2 (en) | 2012-10-09 | 2017-05-18 | Avery Dennison Corporation | Adhesives and related methods |
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US9944766B2 (en) * | 2014-08-27 | 2018-04-17 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminated board, and printed wiring board |
JP2015017271A (ja) * | 2014-09-29 | 2015-01-29 | 日立化成株式会社 | 熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
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JP2020025034A (ja) * | 2018-08-08 | 2020-02-13 | ローム株式会社 | Ledパッケージ、led表示装置 |
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JP2000169605A (ja) * | 1998-12-04 | 2000-06-20 | Risho Kogyo Co Ltd | 積層板用プリプレグシ―トおよびその製造法 |
JP2003105061A (ja) * | 2001-09-27 | 2003-04-09 | Sanei Kagaku Kk | 光・熱硬化性樹脂組成物、並びに穴詰プリント配線(基)板の製造方法及び穴詰プリント配線(基)板 |
JP2003152294A (ja) * | 2001-11-19 | 2003-05-23 | Risho Kogyo Co Ltd | プリント配線基板用白色積層板 |
JP4259817B2 (ja) * | 2002-06-14 | 2009-04-30 | 株式会社Adeka | エポキシ樹脂組成物 |
JP2004115746A (ja) * | 2002-09-30 | 2004-04-15 | Shin Kobe Electric Mach Co Ltd | プリプレグ、絶縁層、金属箔張り積層板ならびにプリント配線板 |
EP1477534A3 (en) * | 2003-05-16 | 2005-01-19 | Rohm And Haas Company | Multiple-part fast cure powder coatings |
JP2005082798A (ja) * | 2003-09-11 | 2005-03-31 | Noritake Co Ltd | エポキシ樹脂組成物および白色基板 |
JP2006152260A (ja) * | 2004-10-26 | 2006-06-15 | Hitachi Chem Co Ltd | 複合体、これを用いたプリプレグ、金属箔張積層板及び多層印刷配線板並びに多層印刷配線板の製造方法 |
ES2337598T3 (es) * | 2004-11-10 | 2010-04-27 | Dow Global Technologies Inc. | Resinas espoxi endurecidas con copolimeros de bloques anfifilicos y estratificados electricos fabricados a partir de ellas. |
-
2005
- 2005-05-12 JP JP2005140406A patent/JP4634856B2/ja active Active
-
2006
- 2006-04-11 TW TW095112838A patent/TWI403545B/zh not_active IP Right Cessation
- 2006-05-10 EP EP06746232A patent/EP1887031B1/en not_active Not-in-force
- 2006-05-10 CA CA2608179A patent/CA2608179C/en active Active
- 2006-05-10 MY MYPI20062142A patent/MY144427A/en unknown
- 2006-05-10 KR KR1020077028311A patent/KR100940232B1/ko active IP Right Grant
- 2006-05-10 CN CN200680024753XA patent/CN101218285B/zh not_active Expired - Fee Related
- 2006-05-10 DE DE602006011456T patent/DE602006011456D1/de active Active
- 2006-05-10 US US11/920,399 patent/US20090194320A1/en not_active Abandoned
- 2006-05-10 WO PCT/JP2006/309422 patent/WO2006121090A1/ja active Application Filing
-
2009
- 2009-01-09 HK HK09100274.8A patent/HK1120283A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1887031A4 (en) | 2009-05-13 |
US20090194320A1 (en) | 2009-08-06 |
KR100940232B1 (ko) | 2010-02-04 |
TWI403545B (zh) | 2013-08-01 |
WO2006121090A1 (ja) | 2006-11-16 |
DE602006011456D1 (de) | 2010-02-11 |
KR20080014830A (ko) | 2008-02-14 |
TW200704688A (en) | 2007-02-01 |
CN101218285B (zh) | 2011-03-30 |
CA2608179C (en) | 2010-06-29 |
JP4634856B2 (ja) | 2011-02-16 |
JP2006316173A (ja) | 2006-11-24 |
MY144427A (en) | 2011-09-15 |
CA2608179A1 (en) | 2006-11-16 |
EP1887031A1 (en) | 2008-02-13 |
EP1887031B1 (en) | 2009-12-30 |
CN101218285A (zh) | 2008-07-09 |
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PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20230514 |