HK1058913A1 - Brazing filler metal - Google Patents

Brazing filler metal

Info

Publication number
HK1058913A1
HK1058913A1 HK04101812A HK04101812A HK1058913A1 HK 1058913 A1 HK1058913 A1 HK 1058913A1 HK 04101812 A HK04101812 A HK 04101812A HK 04101812 A HK04101812 A HK 04101812A HK 1058913 A1 HK1058913 A1 HK 1058913A1
Authority
HK
Hong Kong
Prior art keywords
filler metal
brazing filler
brazing
metal
filler
Prior art date
Application number
HK04101812A
Other languages
English (en)
Inventor
Ochida Hitoshi
Satou Junji
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Publication of HK1058913A1 publication Critical patent/HK1058913A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/14—Titanium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
HK04101812A 2001-03-23 2004-03-12 Brazing filler metal HK1058913A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001084205 2001-03-23
JP2001280882 2001-09-17
JP2001369401 2001-12-04
PCT/JP2002/002670 WO2002076669A1 (fr) 2001-03-23 2002-03-20 Metal d'apport de brasage

Publications (1)

Publication Number Publication Date
HK1058913A1 true HK1058913A1 (en) 2004-06-11

Family

ID=27346335

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04101812A HK1058913A1 (en) 2001-03-23 2004-03-12 Brazing filler metal

Country Status (6)

Country Link
US (1) US7074350B2 (xx)
EP (1) EP1323492A4 (xx)
JP (1) JP3857987B2 (xx)
CN (1) CN1272140C (xx)
HK (1) HK1058913A1 (xx)
WO (1) WO2002076669A1 (xx)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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DE602005021136D1 (de) * 2004-10-15 2010-06-17 Liquidmetal Technologies Inc Glasbildende amorphe legierungen auf au-basis
EP1650316A1 (fr) * 2004-10-20 2006-04-26 Metalor Technologies SA Alliage d'or
US7293688B2 (en) * 2005-11-14 2007-11-13 General Electric Company Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys
KR101301232B1 (ko) * 2007-03-14 2013-08-28 지멘스 악티엔게젤샤프트 납땜 합금 및 부품 수리 방법
CN100581712C (zh) * 2007-11-19 2010-01-20 贵研铂业股份有限公司 一种Au-In合金复合钎料箔带材及其应用
JP5421915B2 (ja) 2008-07-24 2014-02-19 田中貴金属工業株式会社 Ａｕ−Ｇａ−Ｉｎ系ろう材
CN101569967B (zh) * 2009-06-16 2011-05-11 贵研铂业股份有限公司 一种含有Si和Ga的铜-银合金低蒸汽压钎料及其应用
US9343651B2 (en) * 2010-06-04 2016-05-17 Industrial Technology Research Institute Organic packaging carrier
JP5645307B2 (ja) * 2010-12-09 2014-12-24 日本発條株式会社 大気接合用ろう材、接合体、および、集電材料
CN102528314B (zh) * 2010-12-31 2014-08-06 北京有色金属与稀土应用研究所 锡 - 锑 - 银 - 镍合金态箔状钎料的制备方法
WO2013047740A1 (ja) * 2011-09-30 2013-04-04 京セラ株式会社 金属とセラミックスとの接合体
CN102489896A (zh) * 2011-12-18 2012-06-13 湖南科技大学 钎焊金属基复合封装材料的中温钎料薄带及其制备、钎焊
CN104057213A (zh) * 2014-07-01 2014-09-24 张家港市佳晟机械有限公司 一种高性能金基钎料
EP3291942B1 (en) * 2015-05-05 2021-03-24 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
CN108422058B (zh) * 2018-05-04 2020-10-20 中国航发北京航空材料研究院 用于Al2O3陶瓷与金属连接的金基钎料及其焊接方法
CN112247397B (zh) * 2020-11-02 2021-07-13 合肥邦诺科技有限公司 用于钎焊氮化铝陶瓷与金属的复合钎料及其制备方法
CN115255711B (zh) * 2022-07-15 2024-04-26 郑州轻工业大学 一种Sn基多元低温软钎料及其制备方法
CN115537764B (zh) * 2022-10-14 2024-04-02 哈尔滨工业大学 金刚石与金属的连接方法、焊接接头及微波窗

Family Cites Families (34)

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Publication number Priority date Publication date Assignee Title
GB1469856A (en) 1974-05-28 1977-04-06 Johnson Matthey Co Ltd Solder alloy
DE2638836C3 (de) 1976-08-28 1979-08-16 W.C. Heraeus Gmbh, 6450 Hanau Dentallot-Legierung auf Silber-Basis
JPS5471748A (en) * 1977-11-21 1979-06-08 Seiko Epson Corp Brazing filler metal
JPS5722896A (en) * 1980-07-11 1982-02-05 Mitsubishi Metal Corp Hard au alloy brazing material containing less au and having low melting point
JPS5759039A (en) 1980-09-25 1982-04-09 Toyota Motor Corp Working condition display process in internal combustion engine
JPS58151992A (ja) 1982-03-05 1983-09-09 Citizen Watch Co Ltd 金ロウ材
JPS6059146A (ja) 1983-09-08 1985-04-05 前田　専一 装飾糸
JPS6110235A (ja) 1984-06-26 1986-01-17 Showa Denko Kk 半導体への電極形成方法
JPS6216751A (ja) 1985-07-15 1987-01-24 旭メデイカル株式会社 超音波診断装置用探触子
JPS62212095A (ja) 1986-03-13 1987-09-18 Tanaka Kikinzoku Kogyo Kk ろう材
JPH08953B2 (ja) 1986-03-14 1996-01-10 日産自動車株式会社 アルミダイカスト製シリンダブロツクの製造方法
JPH0729214B2 (ja) * 1986-12-26 1995-04-05 三菱マテリアル株式会社 硬質金合金ろう材
JPH029558A (ja) 1986-12-29 1990-01-12 Bandou Kiko Kk ガラス板の数値制御面取り機械
JP2549387B2 (ja) 1987-08-29 1996-10-30 株式会社 徳力本店 金ろう合金
JPS6466097A (en) 1987-09-08 1989-03-13 Seiko Instr & Electronics Brazing filler metal
US4810313A (en) * 1988-03-14 1989-03-07 Virginia McReynolds Gold solder fluxing composition and method of preparing the same
JP2609130B2 (ja) 1988-04-25 1997-05-14 日東電工株式会社 半導体ウエハの保護部材
IT1231010B (it) 1989-07-26 1991-11-08 Sviluppo Settori Impiego Srl Procedimento per la preparazione di elementi strutturali termoisolanti e prodotti cosi' ottenuti.
JP2731434B2 (ja) 1989-10-20 1998-03-25 田中貴金属工業株式会社 エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品
US5240172A (en) 1989-10-27 1993-08-31 Degussa Aktiengesellschaft Solder alloy for dental and jewelry parts
JPH04238691A (ja) * 1990-12-29 1992-08-26 Tokuriki Honten Co Ltd ろう材
JPH04238692A (ja) 1990-12-29 1992-08-26 Tokuriki Honten Co Ltd ろう材
DE4111821C1 (xx) * 1991-04-11 1991-11-28 Vdm Nickel-Technologie Ag, 5980 Werdohl, De
JP3150744B2 (ja) 1991-12-27 2001-03-26 株式会社徳力本店 宝飾用白色Ａｕろう合金
GB9314292D0 (en) * 1993-07-10 1993-08-25 Johnson Matthey Plc Gold alloy
JPH0729214A (ja) 1993-07-13 1995-01-31 Nippon Columbia Co Ltd 記録スポット径の評価用ディスク
JP2780611B2 (ja) 1993-09-06 1998-07-30 三菱マテリアル株式会社 少量成分の合金化で硬質化した金装飾品材
JP3221179B2 (ja) 1993-09-06 2001-10-22 三菱マテリアル株式会社 硬さ安定性のすぐれた金装飾品用高硬度伸線加工ワイヤー材
JPH07238333A (ja) 1994-02-28 1995-09-12 Pilot Corp:The 金合金及び金合金焼結体
JPH0849027A (ja) 1994-08-08 1996-02-20 Nihonbashi Tokuriki:Kk 接着用貴金属合金
JPH0852589A (ja) 1994-08-11 1996-02-27 Tanaka Kikinzoku Kogyo Kk 低融点ろう材及びその製造方法
JPH08108267A (ja) 1994-10-07 1996-04-30 Vacuum Metallurgical Co Ltd 部品の接合方法及びその接合装置
JP3625963B2 (ja) 1996-09-24 2005-03-02 日本フイルコン株式会社 ステンレス成形体溶接用ろう材及びこのろう材を使用して溶接した製紙用ステンレス金網
JP2001237279A (ja) 2000-02-23 2001-08-31 Hitachi Ltd 半導体装置及びそれを用いた電子装置

Also Published As

Publication number Publication date
CN1272140C (zh) 2006-08-30
EP1323492A1 (en) 2003-07-02
EP1323492A4 (en) 2004-10-06
JP3857987B2 (ja) 2006-12-13
WO2002076669A8 (fr) 2004-02-05
US20040089850A1 (en) 2004-05-13
WO2002076669A1 (fr) 2002-10-03
CN1457281A (zh) 2003-11-19
US7074350B2 (en) 2006-07-11
JPWO2002076669A1 (ja) 2004-07-15

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Legal Events

Date Code Title Description
CHRG Changes in the register

Free format text: CORRECTION OF THE NAME OF THE INVENTOR FROM HITOSHI OCHIDA TO HITOSHI UCHIDA

PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150320