HK1053278A1 - A lead-free solder, method for preparing the same and method of soldering by using the same - Google Patents

A lead-free solder, method for preparing the same and method of soldering by using the same

Info

Publication number
HK1053278A1
HK1053278A1 HK03105645A HK03105645A HK1053278A1 HK 1053278 A1 HK1053278 A1 HK 1053278A1 HK 03105645 A HK03105645 A HK 03105645A HK 03105645 A HK03105645 A HK 03105645A HK 1053278 A1 HK1053278 A1 HK 1053278A1
Authority
HK
Hong Kong
Prior art keywords
same
lead
solder
soldering
free solder
Prior art date
Application number
HK03105645A
Other languages
English (en)
Inventor
Kai Hwa Chew
Wei Chih Pan
Original Assignee
Quantum Chem Tech Singapore
Singapore Asahi Chemical & Solder Ind Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chem Tech Singapore, Singapore Asahi Chemical & Solder Ind Pte Ltd filed Critical Quantum Chem Tech Singapore
Publication of HK1053278A1 publication Critical patent/HK1053278A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Glass Compositions (AREA)
  • Thermally Insulated Containers For Foods (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
HK03105645A 2001-07-09 2003-08-06 A lead-free solder, method for preparing the same and method of soldering by using the same HK1053278A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200104071-6A SG139507A1 (en) 2001-07-09 2001-07-09 Improvements in or relating to solders

Publications (1)

Publication Number Publication Date
HK1053278A1 true HK1053278A1 (en) 2003-10-17

Family

ID=20430801

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03105645A HK1053278A1 (en) 2001-07-09 2003-08-06 A lead-free solder, method for preparing the same and method of soldering by using the same

Country Status (23)

Country Link
US (1) US6843862B2 (de)
EP (1) EP1404483B1 (de)
JP (1) JP3795797B2 (de)
CN (1) CN1235717C (de)
AT (1) ATE278502T1 (de)
AU (1) AU2002226534B2 (de)
BR (1) BR0210970A (de)
CZ (1) CZ303793B6 (de)
DE (1) DE60201542T2 (de)
DK (1) DK1404483T3 (de)
ES (1) ES2230477T3 (de)
HK (1) HK1053278A1 (de)
HU (1) HU229014B1 (de)
MX (1) MXPA04000229A (de)
MY (1) MY123567A (de)
NO (1) NO337878B1 (de)
NZ (1) NZ530220A (de)
PL (1) PL201507B1 (de)
PT (1) PT1404483E (de)
RU (1) RU2268126C2 (de)
SG (1) SG139507A1 (de)
TW (1) TW592869B (de)
WO (1) WO2003006200A1 (de)

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US20040187976A1 (en) * 2003-03-31 2004-09-30 Fay Hua Phase change lead-free super plastic solders
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
EP1679149B1 (de) * 2003-10-07 2012-05-02 Senju Metal Industry Co., Ltd. Bleifreie lotkugel
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20080126535A1 (en) * 2006-11-28 2008-05-29 Yinjun Zhu User plane location services over session initiation protocol (SIP)
EP1560272B1 (de) * 2004-01-29 2016-04-27 Panasonic Intellectual Property Management Co., Ltd. Solarzellenmodul
US8961709B1 (en) 2004-03-09 2015-02-24 Senju Metal Industry Co., Ltd. Solder paste
US7223695B2 (en) * 2004-09-30 2007-05-29 Intel Corporation Methods to deposit metal alloy barrier layers
US6985105B1 (en) * 2004-10-15 2006-01-10 Telecommunication Systems, Inc. Culled satellite ephemeris information based on limiting a span of an inverted cone for locating satellite in-range determinations
GB2406101C (en) * 2004-10-27 2007-09-11 Quantum Chem Tech Singapore Improvements in ro relating to solders
US20060120911A1 (en) * 2004-12-08 2006-06-08 Manoj Gupta Method of forming composite solder by cold compaction and composite solder
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070037004A1 (en) * 2005-08-12 2007-02-15 Antaya Technologies Corporation Multilayer solder article
US20070231594A1 (en) * 2005-08-12 2007-10-04 John Pereira Multilayer solder article
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
US7825780B2 (en) * 2005-10-05 2010-11-02 Telecommunication Systems, Inc. Cellular augmented vehicle alarm notification together with location services for position of an alarming vehicle
US7907551B2 (en) * 2005-10-06 2011-03-15 Telecommunication Systems, Inc. Voice over internet protocol (VoIP) location based 911 conferencing
US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
US8150363B2 (en) 2006-02-16 2012-04-03 Telecommunication Systems, Inc. Enhanced E911 network access for call centers
US8059789B2 (en) 2006-02-24 2011-11-15 Telecommunication Systems, Inc. Automatic location identification (ALI) emergency services pseudo key (ESPK)
US8208605B2 (en) * 2006-05-04 2012-06-26 Telecommunication Systems, Inc. Extended efficient usage of emergency services keys
WO2008039469A2 (en) * 2006-09-26 2008-04-03 Telecommunication Systems, Inc. Location object proxy
WO2008057477A2 (en) * 2006-11-03 2008-05-15 Telecommunication Systems, Inc. Roaming gateway enabling location based services (lbs) roaming for user plane in cdma networks without requiring use of a mobile positioning center (mpc)
US20080157910A1 (en) * 2006-12-29 2008-07-03 Park Chang-Min Amorphous soft magnetic layer for on-die inductively coupled wires
US20080167018A1 (en) * 2007-01-10 2008-07-10 Arlene Havlark Wireless telecommunications location based services scheme selection
US8888932B2 (en) 2007-07-18 2014-11-18 Senju Metal Industry Co., Ltd. Indium-containing lead-free solder for vehicle-mounted electronic circuits
GB2455486A (en) * 2008-03-05 2009-06-17 Quantum Chem Tech Singapore A sputtered film, solder spheres and solder paste formed from an Sn-Ag-Cu-In alloy
CN101474728B (zh) * 2009-01-07 2011-06-01 高新锡业（惠州）有限公司 无铅软钎焊料
US9841282B2 (en) 2009-07-27 2017-12-12 Visa U.S.A. Inc. Successive offer communications with an offer recipient
CN109702372A (zh) * 2019-03-06 2019-05-03 上海莜玮汽车零部件有限公司 无铅焊料合金及其应用
CN113798725B (zh) * 2021-10-13 2022-10-04 浙江强力控股有限公司 选择性波峰焊用免焊剂无铅焊料及其制备方法

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Also Published As

Publication number Publication date
AU2002226534B2 (en) 2006-11-09
ATE278502T1 (de) 2004-10-15
NZ530220A (en) 2005-05-27
PT1404483E (pt) 2005-01-31
SG139507A1 (en) 2008-02-29
DE60201542D1 (de) 2004-11-11
TW592869B (en) 2004-06-21
JP3795797B2 (ja) 2006-07-12
CZ2004209A3 (cs) 2004-09-15
MY123567A (en) 2006-05-31
JP2003039193A (ja) 2003-02-12
DE60201542T2 (de) 2005-02-03
NO20040106L (no) 2004-03-09
DK1404483T3 (da) 2004-11-22
EP1404483A1 (de) 2004-04-07
MXPA04000229A (es) 2005-03-07
HUP0401432A2 (en) 2004-11-29
ES2230477T3 (es) 2005-05-01
EP1404483B1 (de) 2004-10-06
RU2004103629A (ru) 2005-06-10
US6843862B2 (en) 2005-01-18
CN1396039A (zh) 2003-02-12
HU229014B1 (en) 2013-07-29
BR0210970A (pt) 2004-06-08
US20030007886A1 (en) 2003-01-09
CZ303793B6 (cs) 2013-05-09
CN1235717C (zh) 2006-01-11
PL364627A1 (en) 2004-12-13
RU2268126C2 (ru) 2006-01-20
WO2003006200A1 (en) 2003-01-23
PL201507B1 (pl) 2009-04-30
NO337878B1 (no) 2016-07-04

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Legal Events

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PE Patent expired

Effective date: 20210904