TW200711779A - Soldering filler - Google Patents

Soldering filler

Info

Publication number
TW200711779A
TW200711779A TW095123144A TW95123144A TW200711779A TW 200711779 A TW200711779 A TW 200711779A TW 095123144 A TW095123144 A TW 095123144A TW 95123144 A TW95123144 A TW 95123144A TW 200711779 A TW200711779 A TW 200711779A
Authority
TW
Taiwan
Prior art keywords
soldering
soldering filler
filler
lamps
give
Prior art date
Application number
TW095123144A
Other languages
Chinese (zh)
Inventor
Klaus Stedele
Klaus-Dieter Stein
Original Assignee
Patent Treuhand Ges Fuer Elek Sche Gluehlampen M B H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patent Treuhand Ges Fuer Elek Sche Gluehlampen M B H filed Critical Patent Treuhand Ges Fuer Elek Sche Gluehlampen M B H
Publication of TW200711779A publication Critical patent/TW200711779A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J61/00—Gas-discharge or vapour-discharge lamps
    • H01J61/02—Details
    • H01J61/04—Electrodes; Screens; Shields
    • H01J61/06—Main electrodes
    • H01J61/073—Main electrodes for high-pressure discharge lamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Vessels And Coating Films For Discharge Lamps (AREA)
  • Ceramic Products (AREA)

Abstract

The invention discloses a soldering filler for producing soldered joints, in particular for soldering high-temperature components in lamps, and a method for its production. According to the invention, the soldering filler has an essentially eutectic alloy and is formed by a sintering process to give a shaped part.
TW095123144A 2005-06-28 2006-06-27 Soldering filler TW200711779A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005030112A DE102005030112A1 (en) 2005-06-28 2005-06-28 filler alloy

Publications (1)

Publication Number Publication Date
TW200711779A true TW200711779A (en) 2007-04-01

Family

ID=37188916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123144A TW200711779A (en) 2005-06-28 2006-06-27 Soldering filler

Country Status (3)

Country Link
DE (1) DE102005030112A1 (en)
TW (1) TW200711779A (en)
WO (1) WO2007000142A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1914242A1 (en) 2006-10-19 2008-04-23 Sanofi-Aventis Novel anti-CD38 antibodies for the treatment of cancer
US8285439B2 (en) 2009-04-07 2012-10-09 Ford Global Technologies, Llc System and method for performing vehicle diagnostics
US8692722B2 (en) 2011-02-01 2014-04-08 Phoenix Contact Development and Manufacturing, Inc. Wireless field device or wireless field device adapter with removable antenna module
CN114457248B (en) * 2021-12-22 2023-06-09 重庆材料研究院有限公司 Preparation method of molybdenum-ruthenium alloy wire for high-temperature brazing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5816795A (en) * 1981-07-20 1983-01-31 Toho Kinzoku Kk Brazing material
JPS6035780B2 (en) * 1981-08-19 1985-08-16 東邦金属株式会社 End hat for magnetron
JPS58100991A (en) * 1981-12-08 1983-06-15 Toho Kinzoku Kk Joining method for high melting point metal
JPS6091531A (en) * 1983-10-25 1985-05-22 Matsushita Electronics Corp Manufacture of cathode supporting structure for magnetron
JP3363816B2 (en) * 1999-01-26 2003-01-08 浜松ホトニクス株式会社 Discharge tube electrode and discharge tube using the same

Also Published As

Publication number Publication date
WO2007000142A1 (en) 2007-01-04
DE102005030112A1 (en) 2007-01-18

Similar Documents

Publication Publication Date Title
MX2007005622A (en) Lead-free solder alloy.
HK1053278A1 (en) A lead-free solder, method for preparing the same and method of soldering by using the same
TW200620615A (en) A substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same
MY143815A (en) Copper alloy having high strength and superior bending workability, and method for manufacturing copper alloy plates
AU2003284652A1 (en) Tip of soldering iron, process for producing the same, and electrical soldering iron and electrical solder sucking iron including the iron tip
TW200717570A (en) Emitter for an ion source and method of producing same
MY144999A (en) Method of preparing microfibrillar polysaccharide
ATE306354T1 (en) SOLDER FOR USE IN DIFFUSION SOLDERING PROCESSES
EP1785672A3 (en) Reduced thermal system assembly and process of making same
MY155361A (en) Method for producing a thermoelectric component and thermoelectric component
GB0308407D0 (en) Method of obtaining 68 GA
TW200706508A (en) Method for producing an electronic component passivated by lead free glass
WO2011076770A3 (en) A solder paste composition, a solder paste and a soldering flux
TW200742541A (en) Solder deposition and thermal processing of thin-die thermal interface material
TW200711779A (en) Soldering filler
IL180932A0 (en) Improvements in or relating to solders
EP1783827A4 (en) Soldering method, solder pellet for die bonding, method for manufacturing solder pellet for die bonding and electronic component
TW200625583A (en) Lead frame for power LED and method of manufacturing the same
HK1121427A1 (en) Method for producing a transparent body that incorporates an object
WO2010040645A3 (en) Circuit carrier
TW200719381A (en) Electrode system for a lamp
MX2011009279A (en) Clamp ring design.
WO2007093388A3 (en) Method for soldering components
TW200738561A (en) Amorphous caesium aluminium fluoride complex, its production and use
WO2003107041A3 (en) Microlens and method of making same