HK1050867A1 - Method and apparatus for laser drilling. - Google Patents

Method and apparatus for laser drilling.

Info

Publication number
HK1050867A1
HK1050867A1 HK03103091A HK03103091A HK1050867A1 HK 1050867 A1 HK1050867 A1 HK 1050867A1 HK 03103091 A HK03103091 A HK 03103091A HK 03103091 A HK03103091 A HK 03103091A HK 1050867 A1 HK1050867 A1 HK 1050867A1
Authority
HK
Hong Kong
Prior art keywords
laser drilling
drilling
laser
Prior art date
Application number
HK03103091A
Other languages
English (en)
Inventor
Shiro Hamada
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of HK1050867A1 publication Critical patent/HK1050867A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
HK03103091A 1999-10-07 2003-04-30 Method and apparatus for laser drilling. HK1050867A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28630499A JP2001105164A (ja) 1999-10-07 1999-10-07 レーザ穴あけ加工方法及び加工装置
PCT/JP2000/006878 WO2001024964A1 (fr) 1999-10-07 2000-10-03 Procede et appareil pour perçage au laser

Publications (1)

Publication Number Publication Date
HK1050867A1 true HK1050867A1 (en) 2003-07-11

Family

ID=17702657

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03103091A HK1050867A1 (en) 1999-10-07 2003-04-30 Method and apparatus for laser drilling.

Country Status (8)

Country Link
US (1) US6720524B1 (ja)
EP (1) EP1231013A4 (ja)
JP (1) JP2001105164A (ja)
KR (1) KR100477147B1 (ja)
CN (1) CN1170653C (ja)
HK (1) HK1050867A1 (ja)
TW (1) TW460352B (ja)
WO (1) WO2001024964A1 (ja)

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KR100488165B1 (ko) * 2002-01-29 2005-05-06 (주)삼성종합호스 분수 호스 천공 장치
KR20030075729A (ko) * 2002-03-20 2003-09-26 (주)삼성종합호스 비닐 천공호스, 그리고 상기 비닐 천공호스를 제조하기위한 제조장치 및 제조방법
KR20030075731A (ko) * 2002-03-20 2003-09-26 (주)삼성종합호스 Ｐｅ 편직 천공호스, 그리고 상기 ｐｅ 편직 천공호스를제조하기 위한 제조장치
DE10225387B4 (de) * 2002-06-07 2007-09-20 Mlt Micro Laser Technology Gmbh Vorrichtung zur Substratbehandlung mittels Laserstrahlung
KR100570979B1 (ko) * 2004-10-26 2006-04-13 삼성에스디아이 주식회사 이미지 방향 조절기를 구비한 광학계 및 상기 광학계를구비한 레이저 조사장치
US10488606B2 (en) * 2005-09-19 2019-11-26 Topcon Medical Laser Systems, Inc. Optical switch and method for treatment of tissue
JP4667329B2 (ja) * 2006-08-30 2011-04-13 三菱電機株式会社 レーザ加工装置
KR20080028559A (ko) * 2006-09-27 2008-04-01 주식회사 이오테크닉스 폴리곤 미러를 이용한 대상물 다중 가공 방법
JP4961517B2 (ja) * 2007-02-20 2012-06-27 国立大学法人福井大学 ステント及びそれを用いた管状器官の治療具
US8294062B2 (en) * 2007-08-20 2012-10-23 Universal Laser Systems, Inc. Laser beam positioning systems for material processing and methods for using such systems
JP2009106979A (ja) * 2007-10-30 2009-05-21 Sumitomo Heavy Ind Ltd レーザ加工装置、及び、レーザ加工方法
CN101856772A (zh) * 2010-05-27 2010-10-13 张立国 一种光束旋转振镜扫描聚焦加工系统
GB2490143B (en) * 2011-04-20 2013-03-13 Rolls Royce Plc Method of manufacturing a component
WO2012172960A1 (ja) * 2011-06-15 2012-12-20 旭硝子株式会社 ガラス板の切断方法
CN103748693A (zh) * 2011-08-24 2014-04-23 应用材料公司 用于硅太阳能电池制造的高速激光扫描系统
KR20140133741A (ko) * 2013-05-10 2014-11-20 삼성디스플레이 주식회사 레이저 열전사용 마스크 및 이를 포함하는 레이저 조사 장치
CN103639594B (zh) * 2013-12-19 2015-10-28 苏州德龙激光股份有限公司 激光钻孔方法
WO2015126438A1 (en) * 2014-02-20 2015-08-27 Applied Materials, Inc. Laser ablation platform for solar cells
EP2940740A1 (en) * 2014-05-02 2015-11-04 Applied Materials, Inc. Edge scan and alignment
PL3165615T3 (pl) * 2014-07-03 2023-05-08 Nippon Steel Corporation Zastosowanie urządzenia dla procesów obróbki laserowej dla rafinacji domen magnetycznych blachy cienkiej ze stali elektromagnetycznej o ziarnach zorientowanych
EP3047932B1 (en) * 2015-01-21 2018-12-26 Agie Charmilles New Technologies SA Method of laser ablation for engraving of a surface with patch optimization, with corresponding software and machine tool
DE102017218130A1 (de) * 2017-10-11 2019-04-11 Robert Bosch Gmbh Verfahren zur Herstellung eines Stromableiters, Elektrode und Batteriezelle
US11237386B2 (en) * 2020-03-11 2022-02-01 Rohr, Inc. Substrate perforation system and method using polygon mirror(s)
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Also Published As

Publication number Publication date
CN1170653C (zh) 2004-10-13
US6720524B1 (en) 2004-04-13
WO2001024964A1 (fr) 2001-04-12
CN1378493A (zh) 2002-11-06
KR100477147B1 (ko) 2005-03-17
EP1231013A1 (en) 2002-08-14
JP2001105164A (ja) 2001-04-17
KR20020033205A (ko) 2002-05-04
EP1231013A4 (en) 2007-05-09
TW460352B (en) 2001-10-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131003