HK1060085A1 - Laser drilling method - Google Patents

Laser drilling method

Info

Publication number
HK1060085A1
HK1060085A1 HK04102957A HK04102957A HK1060085A1 HK 1060085 A1 HK1060085 A1 HK 1060085A1 HK 04102957 A HK04102957 A HK 04102957A HK 04102957 A HK04102957 A HK 04102957A HK 1060085 A1 HK1060085 A1 HK 1060085A1
Authority
HK
Hong Kong
Prior art keywords
laser drilling
drilling method
laser
drilling
Prior art date
Application number
HK04102957A
Inventor
Takashi Kuwabara
Original Assignee
Sumitomo Heavy Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries filed Critical Sumitomo Heavy Industries
Publication of HK1060085A1 publication Critical patent/HK1060085A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
HK04102957A 2000-05-23 2004-04-27 Laser drilling method HK1060085A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2000/003285 WO2001089756A1 (en) 2000-05-23 2000-05-23 Laser drilling method

Publications (1)

Publication Number Publication Date
HK1060085A1 true HK1060085A1 (en) 2004-07-30

Family

ID=11736057

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04102957A HK1060085A1 (en) 2000-05-23 2004-04-27 Laser drilling method

Country Status (6)

Country Link
EP (1) EP1306160A4 (en)
KR (1) KR100504234B1 (en)
CN (1) CN1277648C (en)
HK (1) HK1060085A1 (en)
NO (1) NO20025633L (en)
WO (1) WO2001089756A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100455228B1 (en) * 2001-06-23 2004-11-09 주식회사 엘지생활건강 Semi-transparent patches for teeth whitening
JP4784930B2 (en) * 2003-09-11 2011-10-05 株式会社ニコン Polymer crystal processing method, polymer crystal processing apparatus, and polymer crystal observation apparatus
JP2006123004A (en) * 2004-09-29 2006-05-18 Mitsubishi Materials Corp Laser processing method and laser processing apparatus
US7602822B2 (en) 2004-09-28 2009-10-13 Hitachi Via Mechanics, Ltd Fiber laser based production of laser drilled microvias for multi-layer drilling, dicing, trimming of milling applications
CN102218606A (en) * 2011-05-18 2011-10-19 苏州德龙激光有限公司 Ultraviolet laser drilling device
WO2019146021A1 (en) * 2018-01-24 2019-08-01 ギガフォトン株式会社 Laser processing method and laser processing system
CN111918482A (en) * 2020-06-05 2020-11-10 江西一诺新材料有限公司 Manufacturing method of FPC (flexible printed circuit) micropores

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4915981A (en) * 1988-08-12 1990-04-10 Rogers Corporation Method of laser drilling fluoropolymer materials
JP2773710B2 (en) * 1995-10-09 1998-07-09 日立エーアイシー株式会社 Manufacturing method of multilayer printed wiring board
JPH1196548A (en) * 1997-09-25 1999-04-09 Showa Denko Kk Production of magnetic recording medium
GB9812725D0 (en) * 1998-06-13 1998-08-12 Exitech Ltd The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages

Also Published As

Publication number Publication date
NO20025633D0 (en) 2002-11-22
KR100504234B1 (en) 2005-07-27
CN1277648C (en) 2006-10-04
KR20020097279A (en) 2002-12-31
NO20025633L (en) 2002-11-22
EP1306160A4 (en) 2006-12-27
EP1306160A1 (en) 2003-05-02
CN1452534A (en) 2003-10-29
WO2001089756A1 (en) 2001-11-29

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150523