GB9812725D0 - The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages - Google Patents

The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages

Info

Publication number
GB9812725D0
GB9812725D0 GBGB9812725.1A GB9812725A GB9812725D0 GB 9812725 D0 GB9812725 D0 GB 9812725D0 GB 9812725 A GB9812725 A GB 9812725A GB 9812725 D0 GB9812725 D0 GB 9812725D0
Authority
GB
United Kingdom
Prior art keywords
machines
printed circuit
circuit boards
improving performance
laser drill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB9812725.1A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Exitech Ltd
Original Assignee
Exitech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exitech Ltd filed Critical Exitech Ltd
Priority to GBGB9812725.1A priority Critical patent/GB9812725D0/en
Publication of GB9812725D0 publication Critical patent/GB9812725D0/en
Priority to JP2000554501A priority patent/JP2002518181A/en
Priority to EP99957032A priority patent/EP1105248A1/en
Priority to PCT/GB1999/001875 priority patent/WO1999065639A1/en
Priority to GB9913617A priority patent/GB2338201A/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Laser Beam Printer (AREA)
GBGB9812725.1A 1998-06-13 1998-06-13 The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages Ceased GB9812725D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GBGB9812725.1A GB9812725D0 (en) 1998-06-13 1998-06-13 The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages
JP2000554501A JP2002518181A (en) 1998-06-13 1999-06-14 Laser drilling on materials
EP99957032A EP1105248A1 (en) 1998-06-13 1999-06-14 Laser drilling of holes in materials
PCT/GB1999/001875 WO1999065639A1 (en) 1998-06-13 1999-06-14 Laser drilling of holes in materials
GB9913617A GB2338201A (en) 1998-06-13 1999-06-14 Laser drilling of holes in materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9812725.1A GB9812725D0 (en) 1998-06-13 1998-06-13 The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages

Publications (1)

Publication Number Publication Date
GB9812725D0 true GB9812725D0 (en) 1998-08-12

Family

ID=10833672

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB9812725.1A Ceased GB9812725D0 (en) 1998-06-13 1998-06-13 The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages

Country Status (4)

Country Link
EP (1) EP1105248A1 (en)
JP (1) JP2002518181A (en)
GB (1) GB9812725D0 (en)
WO (1) WO1999065639A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001089756A1 (en) * 2000-05-23 2001-11-29 Sumitomo Heavy Industries, Ltd. Laser drilling method
GB2457720A (en) 2008-02-23 2009-08-26 Philip Thomas Rumsby Method for laser processing on the opposite sides of thin transparent substrates
DE102014010175A1 (en) * 2014-07-09 2016-01-14 Hydac Filtertechnik Gmbh filter element

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894115A (en) * 1989-02-14 1990-01-16 General Electric Company Laser beam scanning method for forming via holes in polymer materials
DE4000561A1 (en) * 1990-01-10 1991-07-11 Laser Lab Goettingen Ev Energy ray ablation esp. of plastics e.g. PMMA - using dopant forming gas on absorption of one photon to increase efficiency and give clean hole
DE69210858T2 (en) * 1991-02-21 1996-11-28 Hewlett Packard Co Photo-removal method of at least one stepped opening which penetrates a polymeric material and a nozzle plate which has a stepped opening
DE69720049T2 (en) * 1996-08-27 2003-09-25 British Polythene Ltd Process for perforating a polymeric film and polymeric film

Also Published As

Publication number Publication date
WO1999065639A1 (en) 1999-12-23
EP1105248A1 (en) 2001-06-13
JP2002518181A (en) 2002-06-25

Similar Documents

Publication Publication Date Title
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
GB9918909D0 (en) Printed circuit board and method of producing the same
SG73469A1 (en) Solder resist composition and printed circuit boards
AU6483199A (en) Electronic circuit board
SG82007A1 (en) Compositions for use in the fabrication of circuit components and printed wire boards
EP1229769A4 (en) Carrier-foiled copper foil circuit, printed circuit board manufacturing method using the circuit, and printed circuit board
IL149126A0 (en) Polyolefin composites for printed circuit board and antenna base material
AU2002210947A1 (en) Circuit board unit and electronic equipment
GB2361695B (en) Electroconductive composition and printed circuit board using the same
GB0001573D0 (en) Printed circuit board with fuse
AU3688300A (en) A method of producing printed circuit boards and a heat sink arrangement produced in accordance with the method
SG91842A1 (en) Printed circuit board with shielded circuitry
GB9812725D0 (en) The use of material dopants for improving performance of machines to laser drill microvia holes in printed circuit boards and other electrical packages
AU5234099A (en) Composition and method for manufacturing integral resistors in printed circuit boards
GB2361714B (en) Copper foil for printed circuit boards and its surface treatment method
GB2337862B (en) Printed circuit board
IL122930A (en) Printing and printed circuit board members and methods for producing same
GB0010730D0 (en) Printed circuit boards
EP1042092A4 (en) Component of printed circuit boards
KR980006046U (en) Printed Circuit Board Cutting Equipment
TW431601U (en) Machine structure improvement for testing strength of soldering point in printed circuit board
AU3926200A (en) Method for making segmented through holes in printed circuit boards
TW464157U (en) Material retrieving machine structure of dual-face printed circuit board
TW398722U (en) Printed circuit board preparatory pressing machine
TW365186U (en) Improvement in an electronic circuit supporting board

Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)