HK1041715A1 - 使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法 - Google Patents
使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法Info
- Publication number
- HK1041715A1 HK1041715A1 HK02103418.6A HK02103418A HK1041715A1 HK 1041715 A1 HK1041715 A1 HK 1041715A1 HK 02103418 A HK02103418 A HK 02103418A HK 1041715 A1 HK1041715 A1 HK 1041715A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- plating
- pulse
- combination
- electroplating method
- plating bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F31/00—Mixers with shaking, oscillating, or vibrating mechanisms
- B01F31/44—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
- B01F31/441—Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement performing a rectilinear reciprocating movement
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000155046 | 2000-05-25 | ||
JP2000243249 | 2000-08-10 | ||
JP2001129994A JP2002121699A (ja) | 2000-05-25 | 2001-04-26 | めっき浴の振動流動とパルス状めっき電流との組み合わせを用いた電気めっき方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1041715A1 true HK1041715A1 (zh) | 2002-07-19 |
Family
ID=27343513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02103418.6A HK1041715A1 (zh) | 2000-05-25 | 2002-05-06 | 使用電鍍液的振動流動與脉冲狀電鍍電流組合的電鍍方法 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20010045360A1 (ko) |
EP (1) | EP1164208A3 (ko) |
JP (1) | JP2002121699A (ko) |
KR (1) | KR100461908B1 (ko) |
CN (1) | CN1335419A (ko) |
CA (1) | CA2349156A1 (ko) |
HK (1) | HK1041715A1 (ko) |
SG (1) | SG94828A1 (ko) |
TW (1) | TW526295B (ko) |
Families Citing this family (43)
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TW554350B (en) * | 2001-07-31 | 2003-09-21 | Sekisui Chemical Co Ltd | Method for producing electroconductive particles |
JP3681670B2 (ja) * | 2001-09-25 | 2005-08-10 | シャープ株式会社 | 半導体集積回路の製造装置および製造方法 |
US6818115B2 (en) * | 2001-10-19 | 2004-11-16 | Viasystems Group, Inc. | System and method for electrolytic plating |
GB2386907B (en) * | 2002-03-27 | 2005-10-26 | Isle Coat Ltd | Process and device for forming ceramic coatings on metals and alloys, and coatings produced by this process |
EP1488024B1 (en) * | 2002-03-27 | 2017-05-03 | Keronite International Limited | Process and device for forming ceramic coatings on metals and alloys |
JP3964263B2 (ja) * | 2002-05-17 | 2007-08-22 | 株式会社デンソー | ブラインドビアホール充填方法及び貫通電極形成方法 |
US7345868B2 (en) * | 2002-10-07 | 2008-03-18 | Presidio Components, Inc. | Multilayer ceramic capacitor with terminal formed by electroless plating |
US20050061660A1 (en) * | 2002-10-18 | 2005-03-24 | Kempen Hein Van | System and method for electrolytic plating |
US6884335B2 (en) * | 2003-05-20 | 2005-04-26 | Novellus Systems, Inc. | Electroplating using DC current interruption and variable rotation rate |
US7586097B2 (en) | 2006-01-05 | 2009-09-08 | Virgin Islands Microsystems, Inc. | Switching micro-resonant structures using at least one director |
US7626179B2 (en) * | 2005-09-30 | 2009-12-01 | Virgin Island Microsystems, Inc. | Electron beam induced resonance |
US7791290B2 (en) | 2005-09-30 | 2010-09-07 | Virgin Islands Microsystems, Inc. | Ultra-small resonating charged particle beam modulator |
JP2006131926A (ja) * | 2004-11-02 | 2006-05-25 | Sharp Corp | 微細孔に対するメッキ方法、及びこれを用いた金バンプ形成方法と半導体装置の製造方法、並びに半導体装置 |
JP4856896B2 (ja) * | 2005-06-02 | 2012-01-18 | 新光電気工業株式会社 | リードフレームのめっき方法およびリードフレーム |
US20070012576A1 (en) * | 2005-07-13 | 2007-01-18 | Rohm And Haas Electronic Materials Llc | Plating method |
JP4458057B2 (ja) * | 2005-07-28 | 2010-04-28 | Tdk株式会社 | めっき装置及びめっき方法 |
US7876793B2 (en) | 2006-04-26 | 2011-01-25 | Virgin Islands Microsystems, Inc. | Micro free electron laser (FEL) |
US7728702B2 (en) | 2006-05-05 | 2010-06-01 | Virgin Islands Microsystems, Inc. | Shielding of integrated circuit package with high-permeability magnetic material |
US7732786B2 (en) | 2006-05-05 | 2010-06-08 | Virgin Islands Microsystems, Inc. | Coupling energy in a plasmon wave to an electron beam |
US8188431B2 (en) | 2006-05-05 | 2012-05-29 | Jonathan Gorrell | Integration of vacuum microelectronic device with integrated circuit |
US7986113B2 (en) | 2006-05-05 | 2011-07-26 | Virgin Islands Microsystems, Inc. | Selectable frequency light emitter |
US7728397B2 (en) | 2006-05-05 | 2010-06-01 | Virgin Islands Microsystems, Inc. | Coupled nano-resonating energy emitting structures |
US7990336B2 (en) | 2007-06-19 | 2011-08-02 | Virgin Islands Microsystems, Inc. | Microwave coupled excitation of solid state resonant arrays |
CN101815812A (zh) | 2008-09-01 | 2010-08-25 | 日本科技股份有限公司 | 由氢和氧构成的液态物、由该液态物得到的由氢和氧构成的再气化气体、它们的制备方法和装置、以及由这些液态物和再气化气体构成的不产生二氧化碳的燃料 |
JP5504147B2 (ja) | 2010-12-21 | 2014-05-28 | 株式会社荏原製作所 | 電気めっき方法 |
US9666426B2 (en) * | 2011-06-24 | 2017-05-30 | Acm Research (Shanghai) Inc. | Methods and apparatus for uniformly metallization on substrates |
US20130248374A1 (en) * | 2012-03-23 | 2013-09-26 | Apple Inc. | Chemical polishing of aluminum |
JP5980735B2 (ja) * | 2012-08-07 | 2016-08-31 | 株式会社荏原製作所 | スルーホールの電気めっき方法及び電気めっき装置 |
CN102899708B (zh) * | 2012-11-05 | 2015-02-25 | 无锡宏联电镀设备有限公司 | 电镀槽用阴极移动装置 |
CN104060304A (zh) * | 2014-06-13 | 2014-09-24 | 安徽省宁国天成电工有限公司 | 一种酸性镀锡电解液 |
JP6463622B2 (ja) * | 2014-11-27 | 2019-02-06 | Ykk株式会社 | めっき装置、めっきユニット、及びめっきライン |
JP6222145B2 (ja) * | 2015-03-11 | 2017-11-01 | トヨタ自動車株式会社 | 金属皮膜の成膜装置およびその成膜方法 |
CN105908215B (zh) * | 2016-05-11 | 2017-11-07 | 吉首大学 | 超声波脉冲、正弦波齿盘双脉动式电解除杂槽 |
CN105862086B (zh) * | 2016-05-11 | 2017-09-22 | 吉首大学 | 磁盘脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽 |
CN105862085B (zh) * | 2016-05-11 | 2017-09-19 | 吉首大学 | 磁盘搅拌脉冲、正弦波齿盘、磁筒三脉动式电解除杂槽 |
CN105714331B (zh) * | 2016-05-11 | 2017-11-17 | 盐城云林环保工程有限公司 | 正弦波齿盘、磁筒双脉动式电解除杂槽 |
CA3049907C (en) | 2017-01-26 | 2023-02-28 | Curium Us Llc | Systems and methods for electroplating sources for alpha spectroscopy |
JP6329681B1 (ja) * | 2017-10-31 | 2018-05-23 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
CN107952395A (zh) * | 2017-11-27 | 2018-04-24 | 新乡市永振机械设备有限公司 | 拌和振动器 |
TWI690620B (zh) * | 2018-08-22 | 2020-04-11 | 華紹國際有限公司 | 化學鍍裝置及金屬化基板的製造方法 |
CN109023494A (zh) * | 2018-10-12 | 2018-12-18 | 扬州市金杨电镀设备有限公司 | 振动式卧式滚镀装置 |
CN110359069B (zh) * | 2019-07-16 | 2021-01-29 | 吉林大学 | 一种液相多金属混合增材制造装置及方法 |
CN118103553A (zh) * | 2022-12-16 | 2024-05-28 | 株式会社荏原制作所 | 镀覆装置及镀覆方法 |
Family Cites Families (15)
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US4316786A (en) * | 1980-09-19 | 1982-02-23 | The United States Of America As Represented By The United States Department Of Energy | Apparatus for electroplating particles of small dimension |
GB2118973A (en) * | 1982-04-27 | 1983-11-09 | Corrintec Uk Ltd | Electrical connector and manufacture thereof |
JPS62235714A (ja) * | 1986-04-07 | 1987-10-15 | Hitachi Ltd | 磁性合金薄膜の形成方法及びその装置 |
JPS63312996A (ja) * | 1987-06-15 | 1988-12-21 | Seiko Instr & Electronics Ltd | アモルファス合金の電着方法 |
US4720330A (en) * | 1987-07-06 | 1988-01-19 | The Dow Chemical Company | Device and method for electroplating a workpiece having axial symmetry |
JPH0230790A (ja) * | 1988-07-15 | 1990-02-01 | Seiko Instr Inc | 合金電着方法 |
JP2992177B2 (ja) * | 1993-05-17 | 1999-12-20 | 日本テクノ株式会社 | クロムのバレルめっき装置 |
DE4322378A1 (de) * | 1993-07-06 | 1995-01-12 | Hans Henig | Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage |
US5684683A (en) * | 1996-02-09 | 1997-11-04 | Wisconsin Alumni Research Foundation | DC-to-DC power conversion with high current output |
US6261435B1 (en) * | 1997-10-21 | 2001-07-17 | Nihon Techno Kabushiki Kaisha | Plating method |
US6126808A (en) * | 1998-03-23 | 2000-10-03 | Pioneer Metal Finishing | Method and apparatus for anodizing objects |
JP3340669B2 (ja) * | 1998-03-24 | 2002-11-05 | 株式会社ジャパンエナジー | 銅めっき方法及び銅めっき液 |
EP0991795B1 (en) * | 1998-04-21 | 2006-02-22 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
EP1125007B1 (en) * | 1998-10-05 | 2010-08-11 | Semitool, Inc. | Submicron metallization using electrochemical deposition |
JP3641372B2 (ja) * | 1998-10-21 | 2005-04-20 | 株式会社荏原製作所 | 電解めっき方法及び電解めっき装置 |
-
2001
- 2001-04-26 JP JP2001129994A patent/JP2002121699A/ja active Pending
- 2001-05-23 TW TW090112350A patent/TW526295B/zh not_active IP Right Cessation
- 2001-05-23 US US09/864,650 patent/US20010045360A1/en not_active Abandoned
- 2001-05-24 CA CA002349156A patent/CA2349156A1/en not_active Abandoned
- 2001-05-25 KR KR10-2001-0030237A patent/KR100461908B1/ko not_active IP Right Cessation
- 2001-05-25 SG SG200103168A patent/SG94828A1/en unknown
- 2001-05-25 EP EP01112689A patent/EP1164208A3/en not_active Withdrawn
- 2001-05-25 CN CN01118269A patent/CN1335419A/zh active Pending
-
2002
- 2002-05-06 HK HK02103418.6A patent/HK1041715A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR100461908B1 (ko) | 2004-12-14 |
CN1335419A (zh) | 2002-02-13 |
US20010045360A1 (en) | 2001-11-29 |
SG94828A1 (en) | 2003-03-18 |
EP1164208A3 (en) | 2003-10-08 |
KR20010107788A (ko) | 2001-12-07 |
CA2349156A1 (en) | 2001-11-25 |
EP1164208A2 (en) | 2001-12-19 |
TW526295B (en) | 2003-04-01 |
JP2002121699A (ja) | 2002-04-26 |
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