HK1040670B - 有增强的抗破裂强度的半導體襯底及其形成方法 - Google Patents

有增强的抗破裂强度的半導體襯底及其形成方法

Info

Publication number
HK1040670B
HK1040670B HK02102131.4A HK02102131A HK1040670B HK 1040670 B HK1040670 B HK 1040670B HK 02102131 A HK02102131 A HK 02102131A HK 1040670 B HK1040670 B HK 1040670B
Authority
HK
Hong Kong
Prior art keywords
increased
forming
same
semiconductor substrate
facture
Prior art date
Application number
HK02102131.4A
Other languages
English (en)
Other versions
HK1040670A1 (en
Inventor
D‧O‧拉莫斯
M‧布雷斯齊爾尼
Original Assignee
惠普公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 惠普公司 filed Critical 惠普公司
Publication of HK1040670A1 publication Critical patent/HK1040670A1/xx
Publication of HK1040670B publication Critical patent/HK1040670B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/016—Method or apparatus with etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/026—Method or apparatus with machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
HK02102131.4A 2000-03-21 2002-03-20 有增强的抗破裂强度的半導體襯底及其形成方法 HK1040670B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/532,105 US6560871B1 (en) 2000-03-21 2000-03-21 Semiconductor substrate having increased facture strength and method of forming the same

Publications (2)

Publication Number Publication Date
HK1040670A1 HK1040670A1 (en) 2002-06-21
HK1040670B true HK1040670B (zh) 2005-09-16

Family

ID=24120392

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102131.4A HK1040670B (zh) 2000-03-21 2002-03-20 有增强的抗破裂强度的半導體襯底及其形成方法

Country Status (6)

Country Link
US (2) US6560871B1 (zh)
KR (1) KR20010089260A (zh)
CN (1) CN1176810C (zh)
HK (1) HK1040670B (zh)
SG (1) SG99869A1 (zh)
TW (1) TW536754B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051426B2 (en) * 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
JP4135448B2 (ja) * 2002-09-17 2008-08-20 ブラザー工業株式会社 液滴噴射装置の製造方法
CN100337825C (zh) * 2002-12-10 2007-09-19 松下电器产业株式会社 喷墨头的制造方法及喷墨式记录装置
GB2410465A (en) * 2004-01-29 2005-08-03 Hewlett Packard Development Co Method of making an inkjet printhead
EP3312269A1 (en) 2008-12-17 2018-04-25 The Scripps Research Institute Generation and maintenance of stem cells
JP6194517B2 (ja) 2012-04-27 2017-09-13 学校法人慶應義塾 神経分化促進剤
CN105121171B (zh) 2013-02-28 2017-11-03 惠普发展公司，有限责任合伙企业 模制打印棒
KR101827070B1 (ko) 2013-02-28 2018-02-07 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 유체 유동 구조체 성형
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
US10029467B2 (en) 2013-02-28 2018-07-24 Hewlett-Packard Development Company, L.P. Molded printhead
KR20180086281A (ko) 2013-02-28 2018-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 성형된 유체 유동 구조체
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
JP7297416B2 (ja) * 2018-09-07 2023-06-26 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

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US3771219A (en) * 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
JPS5459197A (en) * 1977-10-19 1979-05-12 Matsushita Electric Ind Co Ltd Production of element for oxygen density sensor
US5122841A (en) 1988-08-18 1992-06-16 Canon Kabushiki Kaisha Image forming apparatus
JPH02180021A (ja) * 1989-01-05 1990-07-12 Kawasaki Steel Corp 半導体ウエハの製造方法
JP2610703B2 (ja) * 1990-09-05 1997-05-14 住友電気工業株式会社 半導体素子の製造方法
JPH05185597A (ja) * 1991-07-25 1993-07-27 Fuji Electric Co Ltd インクジェット記録ヘッドの製造方法
JPH05152611A (ja) * 1991-11-27 1993-06-18 Rohm Co Ltd Ｌｅｄアレイプリントヘツドにおけるｌｅｄ半導体チツプの製造方法
JPH05169655A (ja) * 1991-12-26 1993-07-09 Seiko Epson Corp インクジェット記録ヘッド及びその製造方法
JPH0620516A (ja) * 1992-07-02 1994-01-28 Nippondenso Co Ltd 導体組成物，セラミック多層基板及び半導体装置
DE69324166T2 (de) * 1993-01-06 1999-09-02 Seiko Epson Corp Tintenstrahldruckkopf
US5387314A (en) 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5767878A (en) * 1994-09-30 1998-06-16 Compaq Computer Corporation Page-wide piezoelectric ink jet print engine with circumferentially poled piezoelectric material
JP3459703B2 (ja) 1995-06-20 2003-10-27 キヤノン株式会社 インクジェットヘッドの製造方法、およびインクジェットヘッド
JPH09207345A (ja) * 1996-01-31 1997-08-12 Rohm Co Ltd インクジェットプリントヘッドの振動板の製造方法
JP3803985B2 (ja) * 1997-01-24 2006-08-02 富士写真フイルム株式会社 インク噴射記録ヘッドの製造方法および記録装置
JP3123468B2 (ja) 1997-06-25 2001-01-09 日本電気株式会社 インクジェット記録ヘッド及びその製造方法
JP3697861B2 (ja) * 1997-10-23 2005-09-21 セイコーエプソン株式会社 インクジェットヘッド及びその製造方法
JP3969891B2 (ja) * 1998-04-16 2007-09-05 キヤノン株式会社 画像形成装置
JP2001129998A (ja) * 1999-11-01 2001-05-15 Casio Comput Co Ltd インクジェットプリンタヘッド及びその製造方法

Also Published As

Publication number Publication date
US20030117458A1 (en) 2003-06-26
US7055242B2 (en) 2006-06-06
KR20010089260A (ko) 2001-09-29
SG99869A1 (en) 2003-11-27
US6560871B1 (en) 2003-05-13
HK1040670A1 (en) 2002-06-21
TW536754B (en) 2003-06-11
CN1176810C (zh) 2004-11-24
CN1314244A (zh) 2001-09-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20131010