SG99869A1 - Semiconductor substrate having increased facture strength and method of forming the same - Google Patents

Semiconductor substrate having increased facture strength and method of forming the same

Info

Publication number
SG99869A1
SG99869A1 SG200004804A SG200004804A SG99869A1 SG 99869 A1 SG99869 A1 SG 99869A1 SG 200004804 A SG200004804 A SG 200004804A SG 200004804 A SG200004804 A SG 200004804A SG 99869 A1 SG99869 A1 SG 99869A1
Authority
SG
Singapore
Prior art keywords
increased
forming
same
semiconductor substrate
facture
Prior art date
Application number
SG200004804A
Other languages
English (en)
Inventor
O Ramos David
Bresciani Martin
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of SG99869A1 publication Critical patent/SG99869A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14145—Structure of the manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/016—Method or apparatus with etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S29/00—Metal working
    • Y10S29/026—Method or apparatus with machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
SG200004804A 2000-03-21 2000-08-23 Semiconductor substrate having increased facture strength and method of forming the same SG99869A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/532,105 US6560871B1 (en) 2000-03-21 2000-03-21 Semiconductor substrate having increased facture strength and method of forming the same

Publications (1)

Publication Number Publication Date
SG99869A1 true SG99869A1 (en) 2003-11-27

Family

ID=24120392

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200004804A SG99869A1 (en) 2000-03-21 2000-08-23 Semiconductor substrate having increased facture strength and method of forming the same

Country Status (6)

Country Link
US (2) US6560871B1 (zh)
KR (1) KR20010089260A (zh)
CN (1) CN1176810C (zh)
HK (1) HK1040670B (zh)
SG (1) SG99869A1 (zh)
TW (1) TW536754B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7051426B2 (en) * 2002-01-31 2006-05-30 Hewlett-Packard Development Company, L.P. Method making a cutting disk into of a substrate
JP4135448B2 (ja) * 2002-09-17 2008-08-20 ブラザー工業株式会社 液滴噴射装置の製造方法
KR20050084752A (ko) * 2002-12-10 2005-08-29 마쯔시다덴기산교 가부시키가이샤 잉크젯헤드의 제조방법 및 잉크젯식 기록장치
GB2410465A (en) * 2004-01-29 2005-08-03 Hewlett Packard Development Co Method of making an inkjet printhead
CA2747398C (en) 2008-12-17 2023-06-20 The Scripps Research Institute Generation and maintenance of stem cells
WO2013162027A1 (ja) 2012-04-27 2013-10-31 学校法人 慶應義塾 神経分化促進剤
US10821729B2 (en) 2013-02-28 2020-11-03 Hewlett-Packard Development Company, L.P. Transfer molded fluid flow structure
BR112015020860B1 (pt) 2013-02-28 2021-04-13 Hewlett-Packard Development Company, L.P. Estrutura e sistema de fluxo de fluido com um microdispositivo dispensador de fluido e uma moldagem monolítica
US11426900B2 (en) 2013-02-28 2022-08-30 Hewlett-Packard Development Company, L.P. Molding a fluid flow structure
PL3296113T3 (pl) * 2013-02-28 2020-02-28 Hewlett-Packard Development Company, L.P. Formowana szyna drukująca
US10029467B2 (en) 2013-02-28 2018-07-24 Hewlett-Packard Development Company, L.P. Molded printhead
CN105189122B (zh) 2013-03-20 2017-05-10 惠普发展公司，有限责任合伙企业 具有暴露的前表面和后表面的模制芯片条
JP7297416B2 (ja) * 2018-09-07 2023-06-26 キヤノン株式会社 液体吐出ヘッドおよび液体吐出ヘッドの製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180021A (ja) * 1989-01-05 1990-07-12 Kawasaki Steel Corp 半導体ウエハの製造方法
EP0749835A2 (en) * 1995-06-20 1996-12-27 Canon Kabushiki Kaisha A method for manufacturing an ink jet head, and an ink jet head
JPH09207345A (ja) * 1996-01-31 1997-08-12 Rohm Co Ltd インクジェットプリントヘッドの振動板の製造方法
JPH10202889A (ja) * 1997-01-24 1998-08-04 Hitachi Koki Co Ltd インク噴射記録ヘッドの製造方法および記録装置
EP0887187A2 (en) * 1997-06-25 1998-12-30 NEC Corporation Ink jet recording head and method of producing the same
JPH11123824A (ja) * 1997-10-23 1999-05-11 Seiko Epson Corp インクジェットヘッド及びその製造方法
JP2000003115A (ja) * 1998-04-16 2000-01-07 Canon Inc 画像形成装置
JP2001129998A (ja) * 1999-11-01 2001-05-15 Casio Comput Co Ltd インクジェットプリンタヘッド及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3771219A (en) * 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
JPS5459197A (en) * 1977-10-19 1979-05-12 Matsushita Electric Ind Co Ltd Production of element for oxygen density sensor
US5122841A (en) * 1988-08-18 1992-06-16 Canon Kabushiki Kaisha Image forming apparatus
JP2610703B2 (ja) * 1990-09-05 1997-05-14 住友電気工業株式会社 半導体素子の製造方法
JPH05185597A (ja) * 1991-07-25 1993-07-27 Fuji Electric Co Ltd インクジェット記録ヘッドの製造方法
JPH05152611A (ja) * 1991-11-27 1993-06-18 Rohm Co Ltd Ｌｅｄアレイプリントヘツドにおけるｌｅｄ半導体チツプの製造方法
JPH05169655A (ja) * 1991-12-26 1993-07-09 Seiko Epson Corp インクジェット記録ヘッド及びその製造方法
JPH0620516A (ja) * 1992-07-02 1994-01-28 Nippondenso Co Ltd 導体組成物，セラミック多層基板及び半導体装置
DE69324166T2 (de) * 1993-01-06 1999-09-02 Seiko Epson Corp. Tintenstrahldruckkopf
US5387314A (en) 1993-01-25 1995-02-07 Hewlett-Packard Company Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5767878A (en) * 1994-09-30 1998-06-16 Compaq Computer Corporation Page-wide piezoelectric ink jet print engine with circumferentially poled piezoelectric material

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02180021A (ja) * 1989-01-05 1990-07-12 Kawasaki Steel Corp 半導体ウエハの製造方法
EP0749835A2 (en) * 1995-06-20 1996-12-27 Canon Kabushiki Kaisha A method for manufacturing an ink jet head, and an ink jet head
JPH09207345A (ja) * 1996-01-31 1997-08-12 Rohm Co Ltd インクジェットプリントヘッドの振動板の製造方法
JPH10202889A (ja) * 1997-01-24 1998-08-04 Hitachi Koki Co Ltd インク噴射記録ヘッドの製造方法および記録装置
EP0887187A2 (en) * 1997-06-25 1998-12-30 NEC Corporation Ink jet recording head and method of producing the same
JPH11123824A (ja) * 1997-10-23 1999-05-11 Seiko Epson Corp インクジェットヘッド及びその製造方法
JP2000003115A (ja) * 1998-04-16 2000-01-07 Canon Inc 画像形成装置
JP2001129998A (ja) * 1999-11-01 2001-05-15 Casio Comput Co Ltd インクジェットプリンタヘッド及びその製造方法

Also Published As

Publication number Publication date
US6560871B1 (en) 2003-05-13
US20030117458A1 (en) 2003-06-26
KR20010089260A (ko) 2001-09-29
US7055242B2 (en) 2006-06-06
HK1040670A1 (en) 2002-06-21
CN1176810C (zh) 2004-11-24
CN1314244A (zh) 2001-09-26
TW536754B (en) 2003-06-11
HK1040670B (zh) 2005-09-16

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