CN1314244A - 有增强的抗破裂强度的半导体衬底及其形成方法 - Google Patents
有增强的抗破裂强度的半导体衬底及其形成方法 Download PDFInfo
- Publication number
- CN1314244A CN1314244A CN00133157A CN00133157A CN1314244A CN 1314244 A CN1314244 A CN 1314244A CN 00133157 A CN00133157 A CN 00133157A CN 00133157 A CN00133157 A CN 00133157A CN 1314244 A CN1314244 A CN 1314244A
- Authority
- CN
- China
- Prior art keywords
- substrate
- semiconductor substrate
- crackle
- resistanee
- rupture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 87
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000003754 machining Methods 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims abstract description 8
- 208000037656 Respiratory Sounds Diseases 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 11
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005224 laser annealing Methods 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 40
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 239000004576 sand Substances 0.000 description 9
- 238000007639 printing Methods 0.000 description 8
- 230000035882 stress Effects 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010011376 Crepitations Diseases 0.000 description 1
- 241000736199 Paeonia Species 0.000 description 1
- 235000006484 Paeonia officinalis Nutrition 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000026683 transduction Effects 0.000 description 1
- 238000010361 transduction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/016—Method or apparatus with etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S29/00—Metal working
- Y10S29/026—Method or apparatus with machining
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/532,105 US6560871B1 (en) | 2000-03-21 | 2000-03-21 | Semiconductor substrate having increased facture strength and method of forming the same |
US09/532105 | 2000-03-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1314244A true CN1314244A (zh) | 2001-09-26 |
CN1176810C CN1176810C (zh) | 2004-11-24 |
Family
ID=24120392
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB001331574A Expired - Fee Related CN1176810C (zh) | 2000-03-21 | 2000-10-10 | 有增强的抗破裂强度的半导体衬底及其形成方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US6560871B1 (zh) |
KR (1) | KR20010089260A (zh) |
CN (1) | CN1176810C (zh) |
HK (1) | HK1040670B (zh) |
SG (1) | SG99869A1 (zh) |
TW (1) | TW536754B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100337825C (zh) * | 2002-12-10 | 2007-09-19 | 松下电器产业株式会社 | 喷墨头的制造方法及喷墨式记录装置 |
CN105121171A (zh) * | 2013-02-28 | 2015-12-02 | 惠普发展公司,有限责任合伙企业 | 模制打印棒 |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
CN110884257A (zh) * | 2018-09-07 | 2020-03-17 | 佳能株式会社 | 液体喷射头和液体喷射头的制造方法 |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
US10994541B2 (en) | 2013-02-28 | 2021-05-04 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
US11292257B2 (en) | 2013-03-20 | 2022-04-05 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7051426B2 (en) * | 2002-01-31 | 2006-05-30 | Hewlett-Packard Development Company, L.P. | Method making a cutting disk into of a substrate |
JP4135448B2 (ja) * | 2002-09-17 | 2008-08-20 | ブラザー工業株式会社 | 液滴噴射装置の製造方法 |
GB2410465A (en) * | 2004-01-29 | 2005-08-03 | Hewlett Packard Development Co | Method of making an inkjet printhead |
CA2747398C (en) | 2008-12-17 | 2023-06-20 | The Scripps Research Institute | Generation and maintenance of stem cells |
WO2013162027A1 (ja) | 2012-04-27 | 2013-10-31 | 学校法人 慶應義塾 | 神経分化促進剤 |
KR20180086281A (ko) * | 2013-02-28 | 2018-07-30 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 성형된 유체 유동 구조체 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3771219A (en) * | 1970-02-05 | 1973-11-13 | Sharp Kk | Method for manufacturing semiconductor device |
JPS5459197A (en) * | 1977-10-19 | 1979-05-12 | Matsushita Electric Ind Co Ltd | Production of element for oxygen density sensor |
US5122841A (en) * | 1988-08-18 | 1992-06-16 | Canon Kabushiki Kaisha | Image forming apparatus |
JPH02180021A (ja) * | 1989-01-05 | 1990-07-12 | Kawasaki Steel Corp | 半導体ウエハの製造方法 |
JP2610703B2 (ja) * | 1990-09-05 | 1997-05-14 | 住友電気工業株式会社 | 半導体素子の製造方法 |
JPH05185597A (ja) * | 1991-07-25 | 1993-07-27 | Fuji Electric Co Ltd | インクジェット記録ヘッドの製造方法 |
JPH05152611A (ja) * | 1991-11-27 | 1993-06-18 | Rohm Co Ltd | Ledアレイプリントヘツドにおけるled半導体チツプの製造方法 |
JPH05169655A (ja) * | 1991-12-26 | 1993-07-09 | Seiko Epson Corp | インクジェット記録ヘッド及びその製造方法 |
JPH0620516A (ja) * | 1992-07-02 | 1994-01-28 | Nippondenso Co Ltd | 導体組成物,セラミック多層基板及び半導体装置 |
DE69324166T2 (de) * | 1993-01-06 | 1999-09-02 | Seiko Epson Corp | Tintenstrahldruckkopf |
US5387314A (en) | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5767878A (en) * | 1994-09-30 | 1998-06-16 | Compaq Computer Corporation | Page-wide piezoelectric ink jet print engine with circumferentially poled piezoelectric material |
JP3459703B2 (ja) | 1995-06-20 | 2003-10-27 | キヤノン株式会社 | インクジェットヘッドの製造方法、およびインクジェットヘッド |
JPH09207345A (ja) * | 1996-01-31 | 1997-08-12 | Rohm Co Ltd | インクジェットプリントヘッドの振動板の製造方法 |
JP3803985B2 (ja) * | 1997-01-24 | 2006-08-02 | 富士写真フイルム株式会社 | インク噴射記録ヘッドの製造方法および記録装置 |
JP3123468B2 (ja) | 1997-06-25 | 2001-01-09 | 日本電気株式会社 | インクジェット記録ヘッド及びその製造方法 |
JP3697861B2 (ja) * | 1997-10-23 | 2005-09-21 | セイコーエプソン株式会社 | インクジェットヘッド及びその製造方法 |
JP3969891B2 (ja) * | 1998-04-16 | 2007-09-05 | キヤノン株式会社 | 画像形成装置 |
JP2001129998A (ja) * | 1999-11-01 | 2001-05-15 | Casio Comput Co Ltd | インクジェットプリンタヘッド及びその製造方法 |
-
2000
- 2000-03-21 US US09/532,105 patent/US6560871B1/en not_active Expired - Lifetime
- 2000-08-23 SG SG200004804A patent/SG99869A1/en unknown
- 2000-09-19 TW TW089119248A patent/TW536754B/zh not_active IP Right Cessation
- 2000-10-10 CN CNB001331574A patent/CN1176810C/zh not_active Expired - Fee Related
-
2001
- 2001-03-16 KR KR1020010013764A patent/KR20010089260A/ko active Search and Examination
-
2002
- 2002-03-20 HK HK02102131.4A patent/HK1040670B/zh not_active IP Right Cessation
-
2003
- 2003-02-03 US US10/357,824 patent/US7055242B2/en not_active Expired - Lifetime
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100337825C (zh) * | 2002-12-10 | 2007-09-19 | 松下电器产业株式会社 | 喷墨头的制造方法及喷墨式记录装置 |
US10994539B2 (en) | 2013-02-28 | 2021-05-04 | Hewlett-Packard Development Company, L.P. | Fluid flow structure forming method |
US11130339B2 (en) | 2013-02-28 | 2021-09-28 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure |
US9902162B2 (en) | 2013-02-28 | 2018-02-27 | Hewlett-Packard Development Company, L.P. | Molded print bar |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US11541659B2 (en) | 2013-02-28 | 2023-01-03 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
TWI609796B (zh) * | 2013-02-28 | 2018-01-01 | 惠普發展公司有限責任合夥企業 | 模製列印頭 |
US10994541B2 (en) | 2013-02-28 | 2021-05-04 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
US10836169B2 (en) | 2013-02-28 | 2020-11-17 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
CN105121171A (zh) * | 2013-02-28 | 2015-12-02 | 惠普发展公司,有限责任合伙企业 | 模制打印棒 |
US11292257B2 (en) | 2013-03-20 | 2022-04-05 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
CN110884257B (zh) * | 2018-09-07 | 2022-01-11 | 佳能株式会社 | 液体喷射头和液体喷射头的制造方法 |
US11110706B2 (en) | 2018-09-07 | 2021-09-07 | Canon Kabushiki Kaisha | Liquid ejecting head and method of manufacturing liquid ejecting head |
CN110884257A (zh) * | 2018-09-07 | 2020-03-17 | 佳能株式会社 | 液体喷射头和液体喷射头的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
SG99869A1 (en) | 2003-11-27 |
US7055242B2 (en) | 2006-06-06 |
HK1040670A1 (en) | 2002-06-21 |
CN1176810C (zh) | 2004-11-24 |
US6560871B1 (en) | 2003-05-13 |
KR20010089260A (ko) | 2001-09-29 |
HK1040670B (zh) | 2005-09-16 |
US20030117458A1 (en) | 2003-06-26 |
TW536754B (en) | 2003-06-11 |
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