HK1028921A1 - Bonding system and method - Google Patents
Bonding system and methodInfo
- Publication number
- HK1028921A1 HK1028921A1 HK00108279A HK00108279A HK1028921A1 HK 1028921 A1 HK1028921 A1 HK 1028921A1 HK 00108279 A HK00108279 A HK 00108279A HK 00108279 A HK00108279 A HK 00108279A HK 1028921 A1 HK1028921 A1 HK 1028921A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- adhesive
- section
- substrate discs
- bonding system
- bonding
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/521—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7841—Holding or clamping means for handling purposes
- B29C65/7847—Holding or clamping means for handling purposes using vacuum to hold at least one of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/45—Joining of substantially the whole surface of the articles
- B29C66/452—Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/001—Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
- B29L2017/003—Records or discs
- B29L2017/005—CD''s, DVD''s
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2429/00—Carriers for sound or information
- B32B2429/02—Records or discs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2340899 | 1999-02-01 | ||
JP23419799A JP3362016B2 (ja) | 1999-08-20 | 1999-08-20 | 光ディスク貼り合わせ装置及び方法 |
JP23950899A JP3469138B2 (ja) | 1999-08-26 | 1999-08-26 | 光ディスクの貼り合わせ方法及び装置 |
JP24955599A JP3432184B2 (ja) | 1999-09-03 | 1999-09-03 | 光ディスク貼り合わせ方法及び装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1028921A1 true HK1028921A1 (en) | 2001-03-09 |
Family
ID=27457957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00108279A HK1028921A1 (en) | 1999-02-01 | 2000-12-21 | Bonding system and method |
Country Status (6)
Country | Link |
---|---|
US (2) | US6494987B1 (de) |
EP (1) | EP1026214B1 (de) |
CN (1) | CN1308944C (de) |
DE (1) | DE60016291T2 (de) |
HK (1) | HK1028921A1 (de) |
TW (1) | TW459225B (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001134992A (ja) * | 1999-11-02 | 2001-05-18 | Sony Corp | 光学記録ディスクの製造方法及び製造装置 |
JP3516632B2 (ja) | 2000-04-27 | 2004-04-05 | オリジン電気株式会社 | 光ディスク基板の貼り合わせ方法及び装置 |
US20080283192A1 (en) * | 2000-04-27 | 2008-11-20 | Shinichi Shinohara | Method and apparatus for bonding optical disc substrates together, and method for supplying liquid material |
JP3678349B2 (ja) * | 2001-02-26 | 2005-08-03 | オリジン電気株式会社 | 板状物の貼り合わせ装置および板状物の貼り合わせ方法 |
JP2004115545A (ja) * | 2002-09-20 | 2004-04-15 | Ricoh Co Ltd | 位置制御型接着接合方法及びその装置 |
JP2005208219A (ja) * | 2004-01-21 | 2005-08-04 | Nitto Denko Corp | 光記録素子の製造方法 |
US7314536B2 (en) * | 2004-10-14 | 2008-01-01 | Sony Corporation | Disc pairing in optical disc replication |
US7591920B1 (en) * | 2005-06-28 | 2009-09-22 | Dongguan Anwell Digital Machinery Co., Ltd. | Techniques for bonding substrates using dynamic alternating electric field |
US7479202B1 (en) * | 2005-06-28 | 2009-01-20 | Anwell Precision Technology (Hk) Limited | Bubble-free techniques for bonding substrates |
TWI299488B (en) * | 2005-09-28 | 2008-08-01 | Daxon Technology Inc | Carrier device and ultra violet curing process using the same |
DE102006000687B4 (de) * | 2006-01-03 | 2010-09-09 | Thallner, Erich, Dipl.-Ing. | Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers |
EP1860167A1 (de) * | 2006-05-24 | 2007-11-28 | Sika Technology AG | Klebverbundkörper mit erhöhter Haftung |
US8137501B2 (en) * | 2007-02-08 | 2012-03-20 | Lam Research Corporation | Bevel clean device |
JP5513136B2 (ja) * | 2007-03-19 | 2014-06-04 | ブイアイエイ オプトロニクス ゲゼルシャフト ミット ベシュレンクテル ハフツング | エンハンスメント積層表示装置システムを生成する方法 |
WO2008130621A1 (en) * | 2007-04-20 | 2008-10-30 | White Electronic Designs Corp. | Bezelless display system |
TW200912720A (en) * | 2007-04-24 | 2009-03-16 | White Electronics Designs Corp | Interactive display system |
US8728602B2 (en) | 2008-04-28 | 2014-05-20 | The Charles Stark Draper Laboratory, Inc. | Multi-component adhesive system |
US20110151202A1 (en) * | 2009-12-18 | 2011-06-23 | Feinstein Casey J | Controllable Placement of Liquid Adhesive on Substrate |
US8608896B2 (en) | 2011-09-13 | 2013-12-17 | Apple Inc. | Liquid adhesive lamination for precision adhesive control |
JP5393869B1 (ja) * | 2012-12-07 | 2014-01-22 | オリジン電気株式会社 | 接合部材製造方法 |
FR3014967B1 (fr) * | 2013-12-13 | 2016-07-29 | Airbus Operations Sas | Dispositif de fixation d'un objet par injection de liquide |
JP6404606B2 (ja) * | 2014-06-16 | 2018-10-10 | 平田機工株式会社 | 塗布方法、塗布装置、製造方法及び製造装置 |
DE102015100635A1 (de) * | 2015-01-16 | 2016-07-21 | Preh Gmbh | Anordnung zum vollflächigen Verkleben von im Wesentlichen kongruenten Klebeflächen eines ersten und zweiten Fügepartners |
CN108695447B (zh) * | 2017-04-11 | 2020-06-19 | Tcl科技集团股份有限公司 | 一种平板显示器的封装装置及方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4205210A (en) * | 1974-12-20 | 1980-05-27 | Usm Corporation | High frequency cavity press |
US4172916A (en) * | 1978-09-15 | 1979-10-30 | Watson Benjamin H | Method of fabricating sandwich panels |
JPS61235133A (ja) * | 1985-04-11 | 1986-10-20 | Ricoh Co Ltd | 情報記録担体の製造方法 |
US4643532A (en) * | 1985-06-24 | 1987-02-17 | At&T Bell Laboratories | Field-assisted bonding method and articles produced thereby |
US4900387A (en) * | 1988-02-24 | 1990-02-13 | The Boeing Company | Method of bonding via electrorheological adhesives |
FR2637837B1 (fr) * | 1988-10-18 | 1990-12-14 | Kodak Pathe | Procede de soudage par haute frequence de feuilles thermosoudables dont au moins une est en polycarbonate |
JPH04170731A (ja) * | 1990-11-01 | 1992-06-18 | Matsushita Electric Ind Co Ltd | 帯電防止型光ディスク基板 |
JPH04195942A (ja) * | 1990-11-28 | 1992-07-15 | Matsushita Electric Ind Co Ltd | 光ディスクの製造方法 |
JPH05277737A (ja) * | 1992-03-31 | 1993-10-26 | Nippon Steel Corp | 自動溶接方法 |
AU6715294A (en) * | 1993-04-28 | 1994-11-21 | Oana M. Leonte | Bonding method and system using electric current |
JPH0733485A (ja) * | 1993-07-19 | 1995-02-03 | Canon Inc | 固相接着方法 |
JPH07228847A (ja) * | 1994-02-15 | 1995-08-29 | Ricoh Co Ltd | 接着剤及び接着方法 |
CA2152009C (en) * | 1994-10-12 | 1998-05-05 | Gordon Granville Shofner | Dielectric-heated, continuous layup laminated veneer lumber press |
JPH0969242A (ja) * | 1995-08-30 | 1997-03-11 | Toshiba Corp | 光ディスク原盤記録方法及びその装置並びに光ディスク |
JP3354761B2 (ja) | 1995-08-30 | 2002-12-09 | オリジン電気株式会社 | ディスク用被膜形成装置 |
TW314621B (de) * | 1995-12-20 | 1997-09-01 | Toshiba Co Ltd | |
US5938891A (en) | 1996-02-27 | 1999-08-17 | Origin Electric Company, Limited | Disk bonding system |
JPH09293282A (ja) * | 1996-04-26 | 1997-11-11 | Origin Electric Co Ltd | ディスク貼り合わせ方法及び装置 |
JP3515877B2 (ja) * | 1997-05-09 | 2004-04-05 | 株式会社リコー | 貼り合わせ型光ディスク及びその製造方法 |
JP4029473B2 (ja) * | 1997-12-15 | 2008-01-09 | セイコーエプソン株式会社 | 固体接合方法およびその装置、導体接合方法、パッケージ方法 |
JP3725344B2 (ja) | 1998-05-11 | 2005-12-07 | オリジン電気株式会社 | 光ディスクの貼り合わせ方法および装置 |
DE19850832C5 (de) * | 1998-11-04 | 2005-10-06 | Singulus Technologies Ag | Verfahren zum Verbinden von Substrathälften optischer Datenträger |
JP3516632B2 (ja) * | 2000-04-27 | 2004-04-05 | オリジン電気株式会社 | 光ディスク基板の貼り合わせ方法及び装置 |
-
2000
- 2000-01-18 TW TW089100755A patent/TW459225B/zh not_active IP Right Cessation
- 2000-01-20 EP EP00101076A patent/EP1026214B1/de not_active Expired - Lifetime
- 2000-01-20 DE DE60016291T patent/DE60016291T2/de not_active Expired - Lifetime
- 2000-02-01 CN CNB001018302A patent/CN1308944C/zh not_active Expired - Fee Related
- 2000-02-01 US US09/495,472 patent/US6494987B1/en not_active Expired - Fee Related
- 2000-12-21 HK HK00108279A patent/HK1028921A1/xx not_active IP Right Cessation
-
2002
- 2002-05-21 US US10/150,922 patent/US6800168B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1264115A (zh) | 2000-08-23 |
CN1308944C (zh) | 2007-04-04 |
US6800168B2 (en) | 2004-10-05 |
DE60016291D1 (de) | 2005-01-05 |
DE60016291T2 (de) | 2005-05-04 |
EP1026214B1 (de) | 2004-12-01 |
TW459225B (en) | 2001-10-11 |
EP1026214A3 (de) | 2003-02-26 |
US20020134515A1 (en) | 2002-09-26 |
US6494987B1 (en) | 2002-12-17 |
EP1026214A2 (de) | 2000-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150201 |