HK1019011A1 - Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith - Google Patents

Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith

Info

Publication number
HK1019011A1
HK1019011A1 HK98115442A HK98115442A HK1019011A1 HK 1019011 A1 HK1019011 A1 HK 1019011A1 HK 98115442 A HK98115442 A HK 98115442A HK 98115442 A HK98115442 A HK 98115442A HK 1019011 A1 HK1019011 A1 HK 1019011A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor
epoxy resin
weight
parts
manufacture
Prior art date
Application number
HK98115442A
Other languages
English (en)
Inventor
Eiichi Asano
Takayuki Aoki
Toshio Shiobara
Peter Flury
Wolfgang Scharf
Tadashi Okada
Original Assignee
Shinetsu Chemical Co
Ciba Sc Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co, Ciba Sc Holding Ag filed Critical Shinetsu Chemical Co
Publication of HK1019011A1 publication Critical patent/HK1019011A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/304—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
HK98115442A 1995-04-10 1998-12-24 Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith HK1019011A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10905995 1995-04-10

Publications (1)

Publication Number Publication Date
HK1019011A1 true HK1019011A1 (en) 2000-01-14

Family

ID=14500565

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98115442A HK1019011A1 (en) 1995-04-10 1998-12-24 Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith

Country Status (10)

Country Link
US (1) US5739187A (de)
EP (1) EP0742261B1 (de)
KR (1) KR100243708B1 (de)
CN (1) CN1077121C (de)
AT (1) ATE195138T1 (de)
CA (1) CA2173681A1 (de)
DE (1) DE69609557T2 (de)
HK (1) HK1019011A1 (de)
SG (1) SG65576A1 (de)
TW (1) TW436509B (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6099783A (en) * 1995-06-06 2000-08-08 Board Of Trustees Operating Michigan State University Photopolymerizable compositions for encapsulating microelectronic devices
WO1997024402A1 (fr) * 1995-12-28 1997-07-10 Toray Industries, Inc. Composition de resine epoxy
JPH10330596A (ja) 1997-05-30 1998-12-15 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
US6297332B1 (en) * 1998-04-28 2001-10-02 Mitsui Chemicals, Inc. Epoxy-resin composition and use thereof
DE69922577T2 (de) * 1998-05-07 2005-12-01 Shin-Etsu Chemical Co., Ltd. Epoxydharzzusammensetzungen und damit eingekapselte Halbleiteranordnungen
US6645631B2 (en) 1999-12-13 2003-11-11 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
JP4783984B2 (ja) * 2001-02-15 2011-09-28 日立化成工業株式会社 樹脂組成物およびその用途ならびにそれらの製造方法
JP3723483B2 (ja) * 2001-10-16 2005-12-07 日本電気株式会社 電子部品装置
US20040166241A1 (en) * 2003-02-20 2004-08-26 Henkel Loctite Corporation Molding compositions containing quaternary organophosphonium salts
US6936646B2 (en) * 2003-04-30 2005-08-30 Henkel Corporation Flame-retardant molding compositions
US7456235B2 (en) * 2003-04-30 2008-11-25 Henkel Corporation Flame-retardant composition for coating powders
CN100551659C (zh) * 2004-05-20 2009-10-21 雅宝公司 制成粒状的溴化阴离子苯乙烯系聚合物及其制备和应用
US7541415B2 (en) 2004-08-31 2009-06-02 Supresta Llc Process for preparing diaryl alkylphosphonates and oligomeric/polymeric derivatives thereof
JP2007169602A (ja) * 2005-11-01 2007-07-05 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物
DE602006019896D1 (de) * 2005-11-16 2011-03-10 Basf Se Flammwidrige prepregs und laminate für leiterplatten
CN101302327B (zh) * 2007-05-10 2011-05-04 广科工业股份有限公司 无卤耐燃的环氧树脂组合物、胶片及铜箔基板
DE102007041988A1 (de) 2007-09-05 2009-03-12 Forschungszentrum Karlsruhe Gmbh Flammhemmende Additive
TWI367900B (en) * 2007-10-09 2012-07-11 Ind Tech Res Inst Encapsulant composition for a light-emitting diode
KR20090078051A (ko) * 2008-01-14 2009-07-17 도레이새한 주식회사 할로겐프리 커버레이 필름용 접착제 조성물 및 이를구비하는 커버레이 필름
EP2358805B1 (de) 2008-12-08 2016-09-21 3M Innovative Properties Company Halogenfreie flammschutzmittel für epoxidharzsysteme
US8853855B2 (en) * 2012-03-16 2014-10-07 Stats Chippac Ltd. Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof
DK3037426T3 (da) 2013-08-22 2021-07-19 Adeka Corp Phosphor-indeholdende forbindelse, og hærdbar epoxy-resin-sammensætning indeholdende samme

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056806A (en) * 1960-02-03 1962-10-02 Union Carbide Corp Epoxyalkyl acyl phosphates
GB1564708A (en) * 1976-01-16 1980-04-10 Ici Ltd Linear polyester compositions and products which contain phenol phosphates as flame retardant additives
US4199534A (en) * 1978-04-20 1980-04-22 Stauffer Chemical Company Poly (oxyorganophosphate/phosphonate) and process for preparing
US4820854A (en) * 1985-05-23 1989-04-11 Akzo America Inc. Phosphate-containing and phosphonate-containing phosphate esters
JP2622110B2 (ja) * 1986-07-07 1997-06-18 日東電工株式会社 半導体装置
ATE107676T1 (de) * 1989-03-03 1994-07-15 Siemens Ag Epoxidharz-formmassen.
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
US5072014A (en) * 1989-08-09 1991-12-10 Ciba-Geigy Corporation Cyclic phosphates and thiophosphates useful as flame retardants for halogen-free polymers
DE69222670T2 (de) * 1991-02-26 1998-03-12 Toray Industries, Inc., Tokio/Tokyo Epoxyharzzusammensetzung zur Verkapselung einer Halbleiteranordnung
JPH0598118A (ja) * 1991-10-14 1993-04-20 Asahi Chem Ind Co Ltd スチレン系難燃耐熱耐衝撃性樹脂組成物
DE69307442T2 (de) * 1992-09-21 1997-08-21 Sumitomo Bakelite Co Epoxidharzzusammensetzung auf Basis des Diglycidylethers von Biphenyldiol
DE4237132C1 (de) * 1992-11-03 1994-07-07 Siemens Ag UV-aktiviert thermisch härtendes einkomponentiges Reaktionsharzsystem
TW280824B (de) * 1993-09-09 1996-07-11 Ciba Geigy Ag

Also Published As

Publication number Publication date
DE69609557D1 (de) 2000-09-07
KR100243708B1 (ko) 2000-03-02
CN1077121C (zh) 2002-01-02
EP0742261A3 (de) 1999-01-07
DE69609557T2 (de) 2001-04-19
SG65576A1 (en) 2000-08-22
CN1138602A (zh) 1996-12-25
TW436509B (en) 2001-05-28
EP0742261B1 (de) 2000-08-02
ATE195138T1 (de) 2000-08-15
KR960037767A (ko) 1996-11-19
CA2173681A1 (en) 1996-10-11
US5739187A (en) 1998-04-14
EP0742261A2 (de) 1996-11-13

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20050308