HK1012657A1 - Curable and cured organosilicon compositions - Google Patents
Curable and cured organosilicon compositionsInfo
- Publication number
- HK1012657A1 HK1012657A1 HK98113835A HK98113835A HK1012657A1 HK 1012657 A1 HK1012657 A1 HK 1012657A1 HK 98113835 A HK98113835 A HK 98113835A HK 98113835 A HK98113835 A HK 98113835A HK 1012657 A1 HK1012657 A1 HK 1012657A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- curable
- organosilicon compositions
- cured organosilicon
- cured
- compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/983,450 US5391678A (en) | 1992-12-03 | 1992-12-03 | Curable and cured organosilicon compositions |
US08/141,653 US5523374A (en) | 1992-12-03 | 1993-10-26 | Curable and cured organosilicon compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1012657A1 true HK1012657A1 (en) | 1999-08-06 |
Family
ID=26839320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98113835A HK1012657A1 (en) | 1992-12-03 | 1998-12-17 | Curable and cured organosilicon compositions |
Country Status (11)
Country | Link |
---|---|
US (1) | US5523374A (xx) |
EP (1) | EP0600512B1 (xx) |
JP (2) | JPH06263989A (xx) |
KR (2) | KR100286148B1 (xx) |
AU (1) | AU5215993A (xx) |
BR (1) | BR9304944A (xx) |
CA (1) | CA2110610A1 (xx) |
DE (1) | DE69327836T2 (xx) |
ES (1) | ES2144437T3 (xx) |
HK (1) | HK1012657A1 (xx) |
MX (1) | MX9307656A (xx) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5408026A (en) * | 1993-08-23 | 1995-04-18 | Cowan; Patrick J. | Curable and cured organosilicon compositions, and process for making same |
CA2181038A1 (en) * | 1994-11-15 | 1996-05-23 | Hiroshi Ando | Foamable resin composition, foam produced therefrom, and process for producing the foam |
ES2237832T3 (es) * | 1997-08-27 | 2005-08-01 | Huntsman Advanced Materials (Switzerland) Gmbh | Sistema de resina epoxi hidrofoba. |
WO1999024500A1 (fr) * | 1997-11-06 | 1999-05-20 | Kaneka Corporation | Composition de resine expansible et procede de production de mousse |
KR100339183B1 (ko) | 1998-07-13 | 2002-05-31 | 포만 제프리 엘 | 접착제 번짐이 감소된 다이 부착법 |
US6271299B1 (en) * | 1999-02-02 | 2001-08-07 | Dow Corning Corporation | Fire resistant sealant composition |
US6764616B1 (en) * | 1999-11-29 | 2004-07-20 | Huntsman Advanced Materials Americas Inc. | Hydrophobic epoxide resin system |
GB0112525D0 (en) * | 2001-05-23 | 2001-07-11 | Dow Corning | Polysiloxanes and gels and pastes containing them |
JP2002365346A (ja) * | 2001-06-05 | 2002-12-18 | Fujitsu Ltd | テスト刺激コンパクション装置および方法 |
US7098275B2 (en) * | 2001-06-27 | 2006-08-29 | Inglefield Charles F | Heat resistant material for molds and other articles |
US6638572B1 (en) | 2001-06-27 | 2003-10-28 | Charles F. Inglefield | Heat resistant material for molds and other articles |
EP1336642A1 (de) * | 2002-02-14 | 2003-08-20 | Abb Research Ltd. | Selbstheilende Vergussmassen für die Herstellung von elektrischen Isolierungen |
JP2006241462A (ja) * | 2002-04-04 | 2006-09-14 | Kaneka Corp | 光学材料用組成物、光学材料、その製造方法、およびそれを用いた液晶表示装置 |
JP2006183061A (ja) * | 2002-04-04 | 2006-07-13 | Kaneka Corp | 電子材料用組成物及び電子材料 |
KR100949448B1 (ko) * | 2002-05-01 | 2010-03-29 | 다우 코닝 코포레이션 | 바스 수명이 연장된 조성물 |
CN100334134C (zh) | 2002-05-01 | 2007-08-29 | 陶氏康宁公司 | 有机氢硅化合物 |
CN100347223C (zh) | 2002-12-20 | 2007-11-07 | 陶氏康宁公司 | 由有机氢硅化合物得到的支化聚合物 |
AU2003293583A1 (en) * | 2002-12-20 | 2004-07-22 | Dow Corning Corporation | Branched polymers from organohydrogensilicon compounds |
MY151065A (en) * | 2003-02-25 | 2014-03-31 | Kaneka Corp | Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
WO2004083334A2 (en) | 2003-03-17 | 2004-09-30 | Dow Corning Corporation | Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength |
JP4520251B2 (ja) * | 2003-10-10 | 2010-08-04 | 信越化学工業株式会社 | 硬化性組成物 |
JP4371211B2 (ja) * | 2003-12-09 | 2009-11-25 | 信越化学工業株式会社 | 熱硬化性樹脂組成物及び光半導体封止剤 |
US7122290B2 (en) * | 2004-06-15 | 2006-10-17 | General Electric Company | Holographic storage medium |
US7135535B2 (en) * | 2004-07-29 | 2006-11-14 | National Starch And Chemical Investment Holding Corporation | Siloxane resins with oxetane functionality |
US7897296B2 (en) * | 2004-09-30 | 2011-03-01 | General Electric Company | Method for holographic storage |
US20060078802A1 (en) * | 2004-10-13 | 2006-04-13 | Chan Kwok P | Holographic storage medium |
JP4723289B2 (ja) * | 2005-06-03 | 2011-07-13 | 株式会社カネカ | SiH基含有化合物、その製造方法、並びに、SiH基含有化合物を用いた硬化性組成物、その硬化物 |
KR101351815B1 (ko) | 2005-07-28 | 2014-01-15 | 다우 코닝 코포레이션 | 향상된 박리력 프로파일을 갖는 박리 피막 조성물 |
JP5199231B2 (ja) * | 2006-03-21 | 2013-05-15 | ダウ・コーニング・コーポレイション | シリコーンポリエーテルエラストマーゲル |
WO2008115248A2 (en) | 2006-06-30 | 2008-09-25 | Materials & Electrochemical Research Corp. | A composite armor tile based on a continuously graded ceramic-metal composition and manufacture thereof |
US7910219B1 (en) | 2006-06-30 | 2011-03-22 | Materials & Electrochemical Research Corp. | Composite armor tile based on a continuously graded ceramic-metal composition and manufacture thereof |
JP2008069210A (ja) * | 2006-09-12 | 2008-03-27 | Shin Etsu Chem Co Ltd | 多環式炭化水素基含有シリコーン系硬化性組成物 |
KR101186779B1 (ko) * | 2007-04-17 | 2012-09-27 | 아사히 가세이 케미칼즈 가부시키가이샤 | 에폭시실리콘 및 그 제조 방법, 및 그것을 이용한 경화성 수지 조성물과 그 용도 |
WO2009060958A1 (ja) | 2007-11-09 | 2009-05-14 | Kaneka Corporation | 環状ポリオルガノシロキサンの製造方法、硬化剤、硬化性組成物およびその硬化物 |
WO2009075233A1 (ja) * | 2007-12-10 | 2009-06-18 | Kaneka Corporation | アルカリ現像性を有する硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ |
CN104497272B (zh) | 2008-10-02 | 2017-06-23 | 株式会社钟化 | 光固化性组合物以及固化物 |
US20150221527A1 (en) * | 2014-01-31 | 2015-08-06 | Rohm And Haas Electronic Materials Llc | Encapsulant composition |
WO2017087242A1 (en) * | 2015-11-19 | 2017-05-26 | Milliken & Company | Adduct of an amine and a cyclic siloxane compound |
KR102590498B1 (ko) * | 2016-02-19 | 2023-10-19 | 삼성디스플레이 주식회사 | 플렉서블 표시장치, 윈도우 부재의 제조방법 및 하드 코팅 조성물 |
US10385210B2 (en) * | 2017-06-20 | 2019-08-20 | Momentive Performance Materials Inc. | Curable silicone composition and applications and uses thereof |
CN112391034B (zh) * | 2019-08-13 | 2022-12-09 | 北京科化新材料科技有限公司 | 一种环氧树脂复合材料及其制备方法与应用 |
Family Cites Families (67)
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US3170962A (en) * | 1955-01-14 | 1965-02-23 | Dow Corning | Organosilicon-epoxy resin compositions |
US3055858A (en) * | 1957-05-23 | 1962-09-25 | Dow Corning | Method of preparing silicone-epoxide resins |
US2946701A (en) * | 1957-11-12 | 1960-07-26 | Dow Corning | Method of treating glass with epoxysilanes and their epoxy-amine adducts, and the articles made thereby |
US2970150A (en) * | 1957-12-17 | 1961-01-31 | Union Carbide Corp | Processes for the reaction of silanic hydrogen-bonded siloxanes with unsaturated organic compounds with a platinum catalyst |
US2997458A (en) * | 1958-10-03 | 1961-08-22 | Westinghouse Electric Corp | Epoxy-substituted organosilicone compounds |
US3131161A (en) * | 1960-02-25 | 1964-04-28 | Wacker Chemie Gmbh | Silicone rubber containing an epoxide compound |
BE613364A (xx) * | 1961-02-02 | |||
US3220972A (en) * | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
US3197432A (en) * | 1962-07-02 | 1965-07-27 | Gen Electric | Transparent resinous organopolysiloxanes |
US3197433A (en) * | 1962-07-02 | 1965-07-27 | Gen Electric | Optically clear organopolysiloxane resins |
US3296153A (en) * | 1963-03-22 | 1967-01-03 | North American Aviation Inc | Insulation material prepared from a halogenated epoxy, siloxane and a polyamine-amide curing agent |
DE1520015C3 (de) * | 1964-11-25 | 1973-11-22 | Th. Goldschmidt Ag, 4300 Essen | Verfahren zur Herstellung von mit Organopolysiloxanen modifizierten Epoxidharzen |
US3438936A (en) * | 1967-10-06 | 1969-04-15 | Gen Electric | Modified cyclotetrasiloxane polymers |
US3516964A (en) * | 1968-03-26 | 1970-06-23 | Nasa | Synthesis of siloxane-containing epoxy polymers |
US3577263A (en) * | 1968-11-18 | 1971-05-04 | Ford Motor Co | Epoxy resin-siloxane coated article |
US4083856A (en) * | 1969-08-18 | 1978-04-11 | Union Carbide Corporation | Addition of unsaturated epoxy monomer to Si-H with chloroplatinic acid and HCl-acceptor |
FR2115607A5 (xx) * | 1970-11-26 | 1972-07-07 | Silicones Ste Indle | |
AU4608972A (en) * | 1971-09-16 | 1974-03-07 | Ciba-Geigy Ag | New polyepoxide-polysiloxane compounds processes for their manufacture and their use |
US4046930A (en) * | 1974-11-06 | 1977-09-06 | Union Carbide Corporation | Treatment of paper and textile fabrics with emulsified epoxy-silicones |
US3971747A (en) * | 1975-04-11 | 1976-07-27 | Dow Corning Corporation | Curable compositions |
JPS5346349A (en) * | 1976-10-08 | 1978-04-25 | Shin Etsu Chem Co Ltd | Silicone resin composition |
AU525461B2 (en) * | 1978-10-23 | 1982-11-04 | Ameron, Inc. | Polymer network comprising epoxy polymer and polysiloxane |
JPS5952892B2 (ja) * | 1979-02-15 | 1984-12-21 | 信越化学工業株式会社 | 硬化性組成物 |
US4279717A (en) * | 1979-08-03 | 1981-07-21 | General Electric Company | Ultraviolet curable epoxy silicone coating compositions |
US4421904A (en) * | 1979-08-03 | 1983-12-20 | General Electric Company | Ultraviolet curable silicone coating compositions |
US4293678A (en) * | 1979-11-26 | 1981-10-06 | Union Carbide Corporation | Radiation-curable acrylated epoxy silicone compositions |
US4370358A (en) * | 1980-09-22 | 1983-01-25 | General Electric Company | Ultraviolet curable silicone adhesives |
US4576999A (en) * | 1982-05-06 | 1986-03-18 | General Electric Company | Ultraviolet radiation-curable silicone release compositions with epoxy and/or acrylic functionality |
US4640967A (en) * | 1982-05-06 | 1987-02-03 | General Electric Company | Ultraviolet radiation-curable silicone release compositions with epoxy and/or acrylic functionality |
US4547431A (en) * | 1983-06-20 | 1985-10-15 | General Electric Company | Ultraviolet radiation-curable silicone controlled release compositions |
CA1256821A (en) * | 1984-11-30 | 1989-07-04 | Richard P. Eckberg | Optical fibres with coating of diorganopolysiloxane and catalytic photoinitiator |
JPS61159427A (ja) * | 1984-12-29 | 1986-07-19 | Toshiba Silicone Co Ltd | 表面処理用ポリオルガノシロキサン組成物 |
US4673718A (en) * | 1986-01-06 | 1987-06-16 | E. I. Du Pont De Nemours And Company | Polysiloxane graft copolymers, flexible coating compositions comprising same and branched polysiloxane macromers for preparing same |
US4754014A (en) * | 1986-01-06 | 1988-06-28 | E. I. Du Pont De Nemours And Company | Polysiloxane graft copolymers, flexible coating compositions comprising same and branched polysiloxane macromers for preparing same |
US5124423A (en) * | 1986-08-27 | 1992-06-23 | Hercules Incorporated | Process for preparing organosilicon polymers |
US4902731A (en) * | 1986-08-27 | 1990-02-20 | Hercules Incorporated | Organosilicon prepolymers |
US4900779A (en) * | 1986-08-27 | 1990-02-13 | Hercules Incorporated | Organosilicon polymers |
US5124375A (en) * | 1986-08-27 | 1992-06-23 | Hercules Incorporated | Process for preparing organosilicon prepolymers and polymers |
US4804768A (en) * | 1986-09-30 | 1989-02-14 | Union Carbide Corporation | Process for producing epoxyorganoalkoxysilanes |
DE3738634C2 (de) * | 1986-11-13 | 1996-11-14 | Sunstar Engineering Inc | Epoxyharzmasse mit darin dispergierten Siliconharzteilchen |
US4877820A (en) * | 1987-03-20 | 1989-10-31 | Hercules Incorporated | Cross-linked organosiloxane polymers |
JPH0788394B2 (ja) * | 1987-04-22 | 1995-09-27 | 東燃株式会社 | エポキシ基含有シラン化合物の製造方法 |
US4847154A (en) * | 1987-05-29 | 1989-07-11 | Basf Corporation | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers |
US5013809A (en) * | 1987-07-30 | 1991-05-07 | Hercules Incorporated | Organosilicon compositions |
GB2208650B (en) * | 1987-08-15 | 1991-09-04 | Dow Corning Sa | Curable organopolysiloxane compositions |
JPH01113455A (ja) * | 1987-10-27 | 1989-05-02 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂組成物 |
US4954580A (en) * | 1987-12-01 | 1990-09-04 | Ciba-Geigy Corporation | Epoxysiloxanes |
US4977198A (en) * | 1988-03-21 | 1990-12-11 | General Electric Company | UV curable epoxy functional silicones |
JPH02274719A (ja) * | 1989-04-17 | 1990-11-08 | Sumitomo Bakelite Co Ltd | 樹脂組成物 |
US5010118A (en) * | 1989-06-22 | 1991-04-23 | General Electric Company | UV curable non-toxic epoxysilicone release coating compositions |
US5037861A (en) * | 1989-08-09 | 1991-08-06 | General Electric Company | Novel highly reactive silicon-containing epoxides |
US5128431A (en) * | 1989-09-01 | 1992-07-07 | General Electric Company | Platinum catalyzed heterocyclic compound compositions |
US5077134A (en) * | 1989-10-10 | 1991-12-31 | Hercules Incorporated | Organosilicon compositions |
US5068303A (en) * | 1989-10-16 | 1991-11-26 | Hercules Incorporated | Organosilicon materials |
US5008360A (en) * | 1989-10-16 | 1991-04-16 | Hercules Incorporated | Organosilicon materials |
US4987158A (en) * | 1990-03-23 | 1991-01-22 | General Electric Company | UV-curable pre-crosslinked epoxy functional silicones |
US5057358A (en) * | 1990-03-23 | 1991-10-15 | General Electric Company | Uv-curable epoxy silicones |
US4990546A (en) * | 1990-03-23 | 1991-02-05 | General Electric Company | UV-curable silphenylene-containing epoxy functional silicones |
US5025048A (en) * | 1990-04-12 | 1991-06-18 | Hercules Incorporated | Organosilicon composition comprising stabilizer |
US5086124A (en) * | 1990-07-05 | 1992-02-04 | General Electric Company | High heat distortion temperature epoxy siloxane/organic epoxy compositions |
JP2522721B2 (ja) * | 1990-08-01 | 1996-08-07 | 信越化学工業株式会社 | オルガノポリシロキサン組成物及びそのゲル硬化物 |
US5118735A (en) * | 1990-10-05 | 1992-06-02 | Hercules Incorporated | Organosilicon composition comprising stabilizers |
US5242979A (en) * | 1990-10-05 | 1993-09-07 | Hercules Incorporated | Organosilicon compositions containing hydrocarbon elastomers |
US5340644A (en) * | 1990-10-05 | 1994-08-23 | Hercules Incorporated | Organosilicon compositions |
US5147945A (en) * | 1990-12-31 | 1992-09-15 | Hercules Incorporated | Organosilicon polymers and prepolymers comprising a coupling monomer |
US5171817A (en) * | 1991-04-15 | 1992-12-15 | Hercules Incorporated | Organosilicon compositions containing siloxane elastomers |
US5196498A (en) * | 1991-09-24 | 1993-03-23 | Hercules Incorporated | Organosilicon polymers |
-
1993
- 1993-10-26 US US08/141,653 patent/US5523374A/en not_active Expired - Lifetime
- 1993-12-03 ES ES93119546T patent/ES2144437T3/es not_active Expired - Lifetime
- 1993-12-03 CA CA002110610A patent/CA2110610A1/en not_active Abandoned
- 1993-12-03 EP EP93119546A patent/EP0600512B1/en not_active Expired - Lifetime
- 1993-12-03 AU AU52159/93A patent/AU5215993A/en not_active Abandoned
- 1993-12-03 DE DE69327836T patent/DE69327836T2/de not_active Expired - Fee Related
- 1993-12-03 MX MX9307656A patent/MX9307656A/es unknown
- 1993-12-03 BR BR9304944A patent/BR9304944A/pt not_active Application Discontinuation
- 1993-12-03 KR KR1019930026446A patent/KR100286148B1/ko not_active IP Right Cessation
- 1993-12-03 JP JP5342689A patent/JPH06263989A/ja active Pending
-
1998
- 1998-12-17 HK HK98113835A patent/HK1012657A1/xx not_active IP Right Cessation
-
2000
- 2000-04-28 KR KR1020000022707A patent/KR100287636B1/ko not_active IP Right Cessation
-
2006
- 2006-03-15 JP JP2006071105A patent/JP2006152316A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ES2144437T3 (es) | 2000-06-16 |
JPH06263989A (ja) | 1994-09-20 |
AU5215993A (en) | 1994-06-16 |
KR940014677A (ko) | 1994-07-19 |
EP0600512B1 (en) | 2000-02-09 |
KR100287636B1 (ko) | 2001-04-16 |
EP0600512A3 (en) | 1995-09-20 |
DE69327836T2 (de) | 2000-05-25 |
KR100286148B1 (ko) | 2001-05-02 |
MX9307656A (es) | 1994-08-31 |
BR9304944A (pt) | 1994-06-07 |
US5523374A (en) | 1996-06-04 |
DE69327836D1 (de) | 2000-03-16 |
JP2006152316A (ja) | 2006-06-15 |
CA2110610A1 (en) | 1994-06-04 |
EP0600512A2 (en) | 1994-06-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20081203 |