HK1010280A1 - Procedure for drying substrates - Google Patents
Procedure for drying substratesInfo
- Publication number
- HK1010280A1 HK1010280A1 HK98111262A HK98111262A HK1010280A1 HK 1010280 A1 HK1010280 A1 HK 1010280A1 HK 98111262 A HK98111262 A HK 98111262A HK 98111262 A HK98111262 A HK 98111262A HK 1010280 A1 HK1010280 A1 HK 1010280A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- substrate
- bath
- liquid
- liquid bath
- procedure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
- Silicon Compounds (AREA)
- Inorganic Insulating Materials (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Detergent Compositions (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK02104685.0A HK1043661B (zh) | 1995-08-23 | 1998-10-14 | 乾燥矽之方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19531031A DE19531031C2 (de) | 1995-08-23 | 1995-08-23 | Verfahren zum Trocknen von Silizium |
PCT/EP1996/003541 WO1997008742A1 (en) | 1995-08-23 | 1996-08-09 | Procedure for drying silicon |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1010280A1 true HK1010280A1 (en) | 1999-06-17 |
Family
ID=7770207
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02104685.0A HK1043661B (zh) | 1995-08-23 | 1998-10-14 | 乾燥矽之方法 |
HK98111262A HK1010280A1 (en) | 1995-08-23 | 1998-10-14 | Procedure for drying substrates |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK02104685.0A HK1043661B (zh) | 1995-08-23 | 1998-10-14 | 乾燥矽之方法 |
Country Status (24)
Country | Link |
---|---|
EP (2) | EP1199740B1 (de) |
JP (1) | JP3857314B2 (de) |
KR (1) | KR19990037642A (de) |
CN (1) | CN1091542C (de) |
AT (2) | ATE309613T1 (de) |
AU (1) | AU697397B2 (de) |
CA (1) | CA2228168A1 (de) |
CZ (1) | CZ291335B6 (de) |
DE (3) | DE19531031C2 (de) |
DK (2) | DK0846334T3 (de) |
ES (2) | ES2186800T3 (de) |
HK (2) | HK1043661B (de) |
HU (1) | HUP9802482A3 (de) |
IL (1) | IL123042A (de) |
MX (1) | MX9801464A (de) |
NO (1) | NO980734D0 (de) |
PL (1) | PL183355B1 (de) |
PT (1) | PT846334E (de) |
RU (1) | RU2141700C1 (de) |
SI (1) | SI1199740T1 (de) |
SK (1) | SK284835B6 (de) |
TW (1) | TW427952B (de) |
UA (1) | UA51663C2 (de) |
WO (1) | WO1997008742A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19800584C2 (de) * | 1998-01-09 | 2002-06-20 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE19613620C2 (de) | 1996-04-04 | 1998-04-16 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Trocknen von Substraten |
DE19833257C1 (de) * | 1998-07-23 | 1999-09-30 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe |
DE19927457C2 (de) * | 1999-06-16 | 2002-06-13 | Wacker Siltronic Halbleitermat | Verwendung eines bekannten Verfahrens als Vorbehandlung zur Bestimmung der Diffusionslängen von Minoritätsträgern in einer Halbleiterscheibe |
DE10036691A1 (de) * | 2000-07-27 | 2002-02-14 | Wacker Siltronic Halbleitermat | Verfahren zur chemischen Behandlung von Halbleiterscheiben |
DE10064081C2 (de) * | 2000-12-21 | 2002-06-06 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe |
DE10360269A1 (de) * | 2003-12-17 | 2005-07-28 | Friedrich-Schiller-Universität Jena | Verfahren zur schnellen Mischung von kleinvolumigen Flüssigkeiten und Kit zu dessen Anwendung |
WO2006066115A2 (en) | 2004-12-17 | 2006-06-22 | The Procter & Gamble Company | Process for extracting liquid from a fabric |
KR100897581B1 (ko) | 2007-11-14 | 2009-05-14 | 주식회사 실트론 | 웨이퍼 건조 방법 |
RU2486287C2 (ru) * | 2011-04-29 | 2013-06-27 | Антон Викторович Мантузов | Способ очистки поверхности полупроводниковых пластин и регенерации травильных растворов |
CN114993028B (zh) * | 2022-06-17 | 2023-05-30 | 高景太阳能股份有限公司 | 一种硅片烘干处理方法及系统 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2722783A1 (de) * | 1977-05-20 | 1978-11-30 | Wacker Chemitronic | Verfahren zum reinigen von silicium |
US4169807A (en) * | 1978-03-20 | 1979-10-02 | Rca Corporation | Novel solvent drying agent |
DE3317286A1 (de) * | 1983-05-11 | 1984-11-22 | Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen | Verfahren zur reinigung von silicium durch saeureeinwirkung |
FR2591324B1 (fr) * | 1985-12-10 | 1989-02-17 | Recif Sa | Appareil pour le sechage unitaire des plaquettes de silicium par centrifugation |
JPS62198127A (ja) * | 1986-02-25 | 1987-09-01 | Sanyo Electric Co Ltd | 半導体ウエハの洗浄方法 |
US4722752A (en) * | 1986-06-16 | 1988-02-02 | Robert F. Orr | Apparatus and method for rinsing and drying silicon wafers |
US4902350A (en) * | 1987-09-09 | 1990-02-20 | Robert F. Orr | Method for rinsing, cleaning and drying silicon wafers |
NL8900480A (nl) * | 1989-02-27 | 1990-09-17 | Philips Nv | Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof. |
JPH0366126A (ja) * | 1989-08-04 | 1991-03-20 | Sharp Corp | 絶縁膜の製造方法及びその製造装置 |
JPH0466175A (ja) * | 1990-07-03 | 1992-03-02 | Seiko Epson Corp | 水切り乾燥方法 |
JPH04346431A (ja) * | 1991-05-24 | 1992-12-02 | Mitsubishi Electric Corp | 半導体シリコンウェハの洗浄装置 |
KR100354953B1 (ko) * | 1993-09-22 | 2002-12-11 | 레가시 시스템즈, 인코포레이티드 | 반도체웨이퍼건조방법및장치 |
-
1995
- 1995-08-23 DE DE19531031A patent/DE19531031C2/de not_active Expired - Fee Related
-
1996
- 1996-08-09 ES ES96929234T patent/ES2186800T3/es not_active Expired - Lifetime
- 1996-08-09 CN CN96196222A patent/CN1091542C/zh not_active Expired - Fee Related
- 1996-08-09 CZ CZ1998517A patent/CZ291335B6/cs not_active IP Right Cessation
- 1996-08-09 AU AU68720/96A patent/AU697397B2/en not_active Ceased
- 1996-08-09 DE DE69635427T patent/DE69635427T2/de not_active Expired - Lifetime
- 1996-08-09 DE DE69624830T patent/DE69624830T2/de not_active Expired - Lifetime
- 1996-08-09 ES ES01130669T patent/ES2250292T3/es not_active Expired - Lifetime
- 1996-08-09 JP JP50977197A patent/JP3857314B2/ja not_active Expired - Fee Related
- 1996-08-09 SK SK212-98A patent/SK284835B6/sk unknown
- 1996-08-09 AT AT01130669T patent/ATE309613T1/de active
- 1996-08-09 DK DK96929234T patent/DK0846334T3/da active
- 1996-08-09 RU RU98104458A patent/RU2141700C1/ru not_active IP Right Cessation
- 1996-08-09 AT AT96929234T patent/ATE227885T1/de active
- 1996-08-09 DK DK01130669T patent/DK1199740T3/da active
- 1996-08-09 EP EP01130669A patent/EP1199740B1/de not_active Expired - Lifetime
- 1996-08-09 EP EP96929234A patent/EP0846334B1/de not_active Expired - Lifetime
- 1996-08-09 KR KR1019980701119A patent/KR19990037642A/ko active Search and Examination
- 1996-08-09 SI SI9630728T patent/SI1199740T1/sl unknown
- 1996-08-09 IL IL12304296A patent/IL123042A/en not_active IP Right Cessation
- 1996-08-09 PL PL96325121A patent/PL183355B1/pl not_active IP Right Cessation
- 1996-08-09 WO PCT/EP1996/003541 patent/WO1997008742A1/en active IP Right Grant
- 1996-08-09 CA CA002228168A patent/CA2228168A1/en not_active Abandoned
- 1996-08-09 HU HU9802482A patent/HUP9802482A3/hu unknown
- 1996-08-09 PT PT96929234T patent/PT846334E/pt unknown
- 1996-08-20 TW TW085110167A patent/TW427952B/zh not_active IP Right Cessation
- 1996-09-08 UA UA98020935A patent/UA51663C2/uk unknown
-
1998
- 1998-02-20 NO NO980734A patent/NO980734D0/no unknown
- 1998-02-23 MX MX9801464A patent/MX9801464A/es not_active IP Right Cessation
- 1998-10-14 HK HK02104685.0A patent/HK1043661B/zh not_active IP Right Cessation
- 1998-10-14 HK HK98111262A patent/HK1010280A1/xx not_active IP Right Cessation
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1010280A1 (en) | Procedure for drying substrates | |
AU7619191A (en) | Dry eye treatment process and solution | |
EP0252451A3 (de) | Integriertes Hybrid-Schaltungssubstrat, Verfahren zum Herstellen eines Schaltungsmusters und Apparat zum Herstellen desselben | |
EP0887845A3 (de) | Verfahren zur Entfernung von einem Oxyd-Film und Einrichtung dafür | |
ZA917619B (en) | Process ofr refining glyceride oil. | |
ES8700574A1 (es) | Un procedimiento para separar dos liquidos | |
JPS5434751A (en) | Washing method for silicon wafer | |
WO2002056988A3 (en) | Method and apparatus for production of droplets | |
ATE217120T1 (de) | Dram-bitleitungskontakt und verfahren zur herstellung eines solchen kontaktes | |
CA2184311A1 (en) | Method for Removing Sulfolane Present in Hydrocarbon | |
CA2160039A1 (en) | Method for separating sulfone from a hydrocarbon stream having a small concentration of sulfone | |
JPS5572040A (en) | Method for pattern formation | |
TW290730B (en) | Column for module component | |
JPS6442822A (en) | Processing of semiconductor substrate | |
JPS5347179A (en) | Method of coating lamp bubls with liquid | |
JPS5581773A (en) | Evaporating treatment apparatus | |
JPS6394627A (ja) | 半導体の製造装置 | |
JPS5522325A (en) | Waste liquid treatment using active sludge | |
JPS541284A (en) | Method of separating gas | |
AU2165797A (en) | Process for removing unconventional transmissible agents from a protein solution | |
JPS6446931A (en) | Etching of silicon trench | |
JPS57211235A (en) | Manufacture of semiconductor device | |
JPS54158166A (en) | Vapor growth method for compound semiconductor crystal | |
GB2190368B (en) | Method of removing film from dendritic web silicon | |
JPS52107163A (en) | Treating method for waste water containing optical bleaching agent |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20070809 |