HK1006580A1 - Copper etchant solution additives - Google Patents

Copper etchant solution additives Download PDF

Info

Publication number
HK1006580A1
HK1006580A1 HK98105633A HK98105633A HK1006580A1 HK 1006580 A1 HK1006580 A1 HK 1006580A1 HK 98105633 A HK98105633 A HK 98105633A HK 98105633 A HK98105633 A HK 98105633A HK 1006580 A1 HK1006580 A1 HK 1006580A1
Authority
HK
Hong Kong
Prior art keywords
thiocyanate
thiosulfate
iodide
ammonium
potassium
Prior art date
Application number
HK98105633A
Other languages
English (en)
Chinese (zh)
Other versions
HK1006580B (en
Inventor
Wayne Richardson Hugh
F Jordan Charles
Original Assignee
Phibro Tech Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phibro Tech Inc. filed Critical Phibro Tech Inc.
Publication of HK1006580B publication Critical patent/HK1006580B/xx
Publication of HK1006580A1 publication Critical patent/HK1006580A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
HK98105633A 1993-09-08 1994-09-08 Copper etchant solution additives HK1006580A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/118,429 US5431776A (en) 1993-09-08 1993-09-08 Copper etchant solution additives
US08/118429 1993-09-08
PCT/US1994/010035 WO1995007372A1 (en) 1993-09-08 1994-09-08 Copper etchant solution additives

Publications (2)

Publication Number Publication Date
HK1006580B HK1006580B (en) 1999-03-05
HK1006580A1 true HK1006580A1 (en) 1999-03-05

Family

ID=22378530

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98105633A HK1006580A1 (en) 1993-09-08 1994-09-08 Copper etchant solution additives

Country Status (18)

Country Link
US (1) US5431776A (enExample)
EP (1) EP0722512B1 (enExample)
JP (1) JPH09502483A (enExample)
KR (1) KR100330634B1 (enExample)
CN (1) CN1057800C (enExample)
AU (1) AU676772B2 (enExample)
BR (1) BR9407432A (enExample)
CA (1) CA2168013C (enExample)
DE (1) DE69423904T2 (enExample)
DK (1) DK0722512T3 (enExample)
ES (1) ES2146662T3 (enExample)
GB (1) GB2295585B (enExample)
HK (1) HK1006580A1 (enExample)
IL (1) IL110885A0 (enExample)
MY (1) MY111132A (enExample)
SG (1) SG50682A1 (enExample)
TW (1) TW412601B (enExample)
WO (1) WO1995007372A1 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431776A (en) * 1993-09-08 1995-07-11 Phibro-Tech, Inc. Copper etchant solution additives
KR100396695B1 (ko) * 2000-11-01 2003-09-02 엘지.필립스 엘시디 주식회사 에천트 및 이를 이용한 전자기기용 기판의 제조방법
US6646147B2 (en) * 2002-02-14 2003-11-11 Phibrotech, Inc. Process for the dissolution of copper metal
US6921523B2 (en) * 2003-10-14 2005-07-26 Tessenderlo Kerley, Inc. Magnesium thiosulfate solution and process for preparing same
KR101337263B1 (ko) * 2004-08-25 2013-12-05 동우 화인켐 주식회사 인듐 산화막의 식각액 조성물 및 이를 이용한 식각 방법
US7686963B2 (en) * 2004-11-16 2010-03-30 Tessenderlo Kerley, Inc. Magnesium thiosulfate as ozone quencher and scrubber
CN100443636C (zh) * 2006-08-18 2008-12-17 丁四宜 氯化铵蚀刻液的充氧装置
TWI334320B (en) 2007-07-16 2010-12-01 Nanya Technology Corp Fabricating method of gold finger of circuit board
TW200936005A (en) * 2008-02-05 2009-08-16 Subtron Technology Co Ltd Inkjet printing process for circuit board
US11225722B2 (en) 2016-08-09 2022-01-18 Tao Ye Alkaline cupric chloride etchant for printed circuit board
CN108650801B (zh) * 2018-04-02 2020-07-10 皆利士多层线路版(中山)有限公司 厚铜线路板的沉金方法
CN111376129B (zh) * 2018-12-27 2021-07-20 杭州朱炳仁文化艺术有限公司 多重蚀刻仿铸铜工艺
CN109811343B (zh) * 2019-03-19 2020-11-17 惠州市瑞翔丰科技有限公司 不含氨氮的环保蚀刻液及蚀刻方法
CN109778194A (zh) * 2019-03-22 2019-05-21 深圳市祺鑫天正环保科技有限公司 碱性蚀刻再生液的添加剂和碱性蚀刻再生液
CN110093639A (zh) * 2019-04-22 2019-08-06 深圳市泓达环境科技有限公司 一种护锡添加剂及蚀刻液
KR20210062347A (ko) * 2019-11-21 2021-05-31 오씨아이 주식회사 실리콘 질화막 식각 용액 및 이를 사용한 반도체 소자의 제조 방법
WO2022005783A1 (en) 2020-07-02 2022-01-06 Fujifilm Electronic Materials U.S.A., Inc. Dielectric film-forming composition
CN113106455B (zh) * 2021-05-08 2022-07-15 九江德福科技股份有限公司 一种用于铜箔微观分析的蚀刻液及其配制方法与蚀刻方法
CN114045494B (zh) * 2021-10-25 2023-02-03 深圳前海榕达创途化工科技股份有限公司 一种用于pcb板的低酸度蚀刻生产方法以及双液型酸性蚀刻液体系
CN115928182B (zh) * 2023-01-04 2025-07-11 山东省路桥集团有限公司 碳钢镀铜焊丝缺陷镀层用退镀液、制备方法及电化学退镀方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE789944A (fr) * 1971-10-12 1973-02-01 Shipley Co Regeneration d'une solution usagee d'attaque du cuivre
FR2157766A1 (en) * 1971-10-26 1973-06-08 Pmd Chemicals Ltd Copper-etching ammoniacal solns - contg additives increasing solubility of copper ions
DE2216269A1 (de) * 1972-04-05 1973-10-18 Hoellmueller Maschbau H Verfahren zum aetzen von kupfer und kupferlegierungen
US4311511A (en) * 1976-07-07 1982-01-19 Gernot Graefe Method for producing high-grade fertilizer
US4311551A (en) * 1979-04-12 1982-01-19 Philip A. Hunt Chemical Corp. Composition and method for etching copper substrates
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
DE3429902A1 (de) * 1984-08-14 1986-02-27 Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg Verfahren zum aetzen von kupferfilmen auf leiterplatten unter elektrolytischer rueckgewinnung von kupfer aus der aetzloesung
US4784551A (en) * 1985-05-24 1988-11-15 Huck Manufacturing Company Fastening system and method for flush and protruding head blind fasteners with common pin and particularly such fasteners constructed of exotic material
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
US4892776A (en) * 1987-09-02 1990-01-09 Ohmega Electronics, Inc. Circuit board material and electroplating bath for the production thereof
US4784785A (en) * 1987-12-29 1988-11-15 Macdermid, Incorporated Copper etchant compositions
US5243320A (en) * 1988-02-26 1993-09-07 Gould Inc. Resistive metal layers and method for making same
RU1807089C (ru) * 1990-07-23 1993-04-07 Харьковский государственный университет им.А.М.Горького Раствор дл химического травлени меди
US5043244A (en) * 1990-09-10 1991-08-27 E. I. Du Pont De Nemours And Company Process for defined etching of substrates
US5248398A (en) * 1990-11-16 1993-09-28 Macdermid, Incorporated Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath
US5085730A (en) * 1990-11-16 1992-02-04 Macdermid, Incorporated Process for regenerating ammoniacal chloride etchants
US5431776A (en) * 1993-09-08 1995-07-11 Phibro-Tech, Inc. Copper etchant solution additives

Also Published As

Publication number Publication date
AU676772B2 (en) 1997-03-20
CN1057800C (zh) 2000-10-25
CA2168013A1 (en) 1995-03-16
DK0722512T3 (da) 2000-08-21
GB2295585A (en) 1996-06-05
IL110885A0 (en) 1994-11-28
EP0722512B1 (en) 2000-04-05
DE69423904D1 (de) 2000-05-11
TW412601B (en) 2000-11-21
EP0722512A1 (en) 1996-07-24
GB9602280D0 (en) 1996-04-03
JPH09502483A (ja) 1997-03-11
GB2295585B (en) 1996-08-14
MY111132A (en) 1999-08-30
AU7683094A (en) 1995-03-27
EP0722512A4 (enExample) 1996-07-31
DE69423904T2 (de) 2000-12-07
CN1130408A (zh) 1996-09-04
KR960705078A (ko) 1996-10-09
BR9407432A (pt) 1996-04-09
ES2146662T3 (es) 2000-08-16
US5431776A (en) 1995-07-11
CA2168013C (en) 2003-12-02
SG50682A1 (en) 1998-07-20
KR100330634B1 (ko) 2002-10-18
WO1995007372A1 (en) 1995-03-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)