JPS6428385A - Silver removing solution - Google Patents

Silver removing solution

Info

Publication number
JPS6428385A
JPS6428385A JP18374487A JP18374487A JPS6428385A JP S6428385 A JPS6428385 A JP S6428385A JP 18374487 A JP18374487 A JP 18374487A JP 18374487 A JP18374487 A JP 18374487A JP S6428385 A JPS6428385 A JP S6428385A
Authority
JP
Japan
Prior art keywords
compd
silver
soln
hydrogen peroxide
ammonium salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18374487A
Other languages
Japanese (ja)
Other versions
JP2553574B2 (en
Inventor
Tomio Kudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NE Chemcat Corp
Original Assignee
Nippon Engelhard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Engelhard Ltd filed Critical Nippon Engelhard Ltd
Priority to JP18374487A priority Critical patent/JP2553574B2/en
Publication of JPS6428385A publication Critical patent/JPS6428385A/en
Application granted granted Critical
Publication of JP2553574B2 publication Critical patent/JP2553574B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To enable the dissolution of a large amt. of silver by using a soln. contg. prescribed amts. of a prescribed chlorinated org. compd., an ammonium salt or a compd. having an amino group and/or an imino group and hydrogen peroxide. CONSTITUTION:This silver removing soln. contains 0.01-50g/l chlorinated org. compd., 0.01-70g/l ammonium salt and/or compd. having an amino group and/or an imino group and 1-250g/l hydrogen peroxide. The chlorinated org. compd. produces free chlorine ions in the soln., prevents the damage of a metal substrate, removes dissolved silver ions as silver chloride from a system and prevents deposition by substitution.
JP18374487A 1987-07-24 1987-07-24 Silver stripper Expired - Lifetime JP2553574B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18374487A JP2553574B2 (en) 1987-07-24 1987-07-24 Silver stripper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18374487A JP2553574B2 (en) 1987-07-24 1987-07-24 Silver stripper

Publications (2)

Publication Number Publication Date
JPS6428385A true JPS6428385A (en) 1989-01-30
JP2553574B2 JP2553574B2 (en) 1996-11-13

Family

ID=16141218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18374487A Expired - Lifetime JP2553574B2 (en) 1987-07-24 1987-07-24 Silver stripper

Country Status (1)

Country Link
JP (1) JP2553574B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004002946A (en) * 2001-07-23 2004-01-08 Sony Corp Etching method and etching liquid
JP2004172427A (en) * 2002-11-21 2004-06-17 Sony Corp Etchant and etching method
JP2004204266A (en) * 2002-12-24 2004-07-22 Tosoh Corp Composition for dissolving tantalum, and dissolving method using the same
JP2008534789A (en) * 2005-04-06 2008-08-28 インクテック シーオー リミテッド Etching composition
JP2010261098A (en) * 2009-05-07 2010-11-18 Gyoseiin Genshino Iinkai Kakuno Kenkyusho New metal nitrogen oxide process
JP2012193427A (en) * 2011-03-17 2012-10-11 Murata Mfg Co Ltd Method for manufacturing electronic component
WO2020080178A1 (en) * 2018-10-17 2020-04-23 株式会社Adeka Etching liquid composition and etching method
WO2021117478A1 (en) * 2019-12-12 2021-06-17 株式会社Adeka Etching liquid composition and etching method
CN113881944A (en) * 2020-07-01 2022-01-04 上海和辉光电股份有限公司 Method for removing magnesium-silver alloy on surface of metal mask plate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4478383B2 (en) * 2002-11-26 2010-06-09 関東化学株式会社 Etching solution composition for metal thin film mainly composed of silver

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004002946A (en) * 2001-07-23 2004-01-08 Sony Corp Etching method and etching liquid
JP2004172427A (en) * 2002-11-21 2004-06-17 Sony Corp Etchant and etching method
JP2004204266A (en) * 2002-12-24 2004-07-22 Tosoh Corp Composition for dissolving tantalum, and dissolving method using the same
JP2008534789A (en) * 2005-04-06 2008-08-28 インクテック シーオー リミテッド Etching composition
JP4756069B2 (en) * 2005-04-06 2011-08-24 インクテック シーオー リミテッド Etching composition
JP2010261098A (en) * 2009-05-07 2010-11-18 Gyoseiin Genshino Iinkai Kakuno Kenkyusho New metal nitrogen oxide process
JP2012193427A (en) * 2011-03-17 2012-10-11 Murata Mfg Co Ltd Method for manufacturing electronic component
WO2020080178A1 (en) * 2018-10-17 2020-04-23 株式会社Adeka Etching liquid composition and etching method
CN112867812A (en) * 2018-10-17 2021-05-28 株式会社Adeka Etching liquid composition and etching method
JP7377212B2 (en) * 2018-10-17 2023-11-09 株式会社Adeka Etching solution composition and etching method
WO2021117478A1 (en) * 2019-12-12 2021-06-17 株式会社Adeka Etching liquid composition and etching method
CN113881944A (en) * 2020-07-01 2022-01-04 上海和辉光电股份有限公司 Method for removing magnesium-silver alloy on surface of metal mask plate

Also Published As

Publication number Publication date
JP2553574B2 (en) 1996-11-13

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