HK62697A - Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that process - Google Patents

Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that process

Info

Publication number
HK62697A
HK62697A HK62697A HK62697A HK62697A HK 62697 A HK62697 A HK 62697A HK 62697 A HK62697 A HK 62697A HK 62697 A HK62697 A HK 62697A HK 62697 A HK62697 A HK 62697A
Authority
HK
Hong Kong
Prior art keywords
appropriate
conducting surfaces
hydroxymethyl
treatment
sulphinic acid
Prior art date
Application number
HK62697A
Inventor
Lutz Stamp
Elisabeth Zettelmeyer-Decker
Norbert Tiemann
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK62697A publication Critical patent/HK62697A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

The invention concerns a process for metallizing non-conducting surfaces, characterized by the following steps: a) caustic cleaning, where appropriate, b) conditionning using a chelate former and/or a cationic surface-active substance, c) caustic cleaning, where appropriate, d) treatment with a pre-dip solution, where appropriate, e) treatment with a colloidal acidic solution of a precious metal which is stabilized with an organic polymer, f) where appropriate, treatment with a solution containing one or more sulphur compounds, g) galvanic metallization.
HK62697A 1992-02-28 1997-05-08 Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that process HK62697A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4206680A DE4206680C1 (en) 1992-02-28 1992-02-28 Process for the metallization of non-conductive surfaces and the use of hydroxymethanesulfinic acid in the process
PCT/DE1993/000153 WO1993017153A1 (en) 1992-02-28 1993-02-17 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process

Publications (1)

Publication Number Publication Date
HK62697A true HK62697A (en) 1997-05-16

Family

ID=6453129

Family Applications (1)

Application Number Title Priority Date Filing Date
HK62697A HK62697A (en) 1992-02-28 1997-05-08 Process for metallizing non-conducting surfaces and the use of hydroxymethyl sulphinic acid in that process

Country Status (8)

Country Link
EP (1) EP0627021B1 (en)
JP (1) JP2799076B2 (en)
KR (1) KR100213528B1 (en)
AT (1) ATE144007T1 (en)
DE (2) DE4206680C1 (en)
HK (1) HK62697A (en)
SG (1) SG46616A1 (en)
WO (1) WO1993017153A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2712086B1 (en) * 1993-11-04 1996-01-26 Lyon Ecole Centrale Method and composition for the preparation of samples for observation by electron microscopy.
DE4412463C3 (en) * 1994-04-08 2000-02-10 Atotech Deutschland Gmbh Process for the preparation of a palladium colloid solution and its use
US6325910B1 (en) 1994-04-08 2001-12-04 Atotch Deutschland Gmbh Palladium colloid solution and its utilization
DE19510855C2 (en) * 1995-03-17 1998-04-30 Atotech Deutschland Gmbh Process for the selective or partial electrolytic metallization of substrates made of non-conductive materials
DE19740431C1 (en) * 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Metallising non-conductive substrate regions especially circuit board hole walls
DE19908755A1 (en) * 1999-02-19 2000-08-24 Atotech Deutschland Gmbh Metal electrodeposition process, especially for plastic and copper surface regions of circuit boards, uses a nickel and-or cobalt reduction plating bath containing a stabilizer to prevent autocatalytic deposition
DE19918833C2 (en) * 1999-04-22 2002-10-31 Atotech Deutschland Gmbh Process for the electrolytic deposition of a metal layer on surfaces of an electrically non-conductive substrate and application of the method
KR20020007875A (en) * 2000-07-19 2002-01-29 마이클 디. 오브라이언 Leadframe for manufacturing semiconductor package
DE10037071A1 (en) 2000-07-29 2002-02-21 Omg Ag & Co Kg Precious metal nanoparticles, process for their production and use
JP4662039B2 (en) * 2005-07-08 2011-03-30 上村工業株式会社 Direct plating method
KR101329989B1 (en) 2006-11-06 2013-11-15 우에무라 고교 가부시키가이샤 Direct plating method and solution for palladium conductor layer formation
JP2009021153A (en) * 2007-07-13 2009-01-29 Mitsubishi Paper Mills Ltd Conductivity manifestation method and conductive member
US9611550B2 (en) * 2012-12-26 2017-04-04 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper plating compositions and methods
DE102013208395B3 (en) 2013-05-07 2014-08-28 Helmholtz-Zentrum Dresden - Rossendorf E.V. Component with metal-containing, self-assembled layer, process for their preparation and use
US20170051410A1 (en) * 2015-08-20 2017-02-23 Macdermid Acumen, Inc. Solutions of Organic Salts as Pretreatments for Plastic Prior to Etching

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587888B2 (en) * 1975-09-10 1983-02-12 株式会社クボタ High pressure handshake
JPS5343890A (en) * 1976-10-02 1978-04-20 Nippon Telegr & Teleph Corp <Ntt> Corrosion protective device for submarine coaxial cable, repeater frame
JPS5654386A (en) * 1979-10-11 1981-05-14 Hitachi Ltd Fuel cladding tube with composit clad
DE3323476A1 (en) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. IMPROVED METHOD FOR GALVANIC METAL DEPOSITION ON NON-METALLIC SURFACES
JPS60173191A (en) * 1984-02-14 1985-09-06 東海染工株式会社 Partial conductivity imparting method
US4652311A (en) * 1984-05-07 1987-03-24 Shipley Company Inc. Catalytic metal of reduced particle size
JPS63203773A (en) * 1987-02-19 1988-08-23 Nippon Mining Co Ltd Formation of metallic coated film on substrate
US5007990A (en) * 1987-07-10 1991-04-16 Shipley Company Inc. Electroplating process
DE3741459C1 (en) * 1987-12-08 1989-04-13 Blasberg Oberflaechentech Process for the production of plated-through printed circuit boards
US5071517A (en) * 1989-11-21 1991-12-10 Solution Technology Systems Method for directly electroplating a dielectric substrate and plated substrate so produced

Also Published As

Publication number Publication date
SG46616A1 (en) 1998-02-20
KR950700440A (en) 1995-01-16
EP0627021B1 (en) 1996-10-09
JPH08501348A (en) 1996-02-13
ATE144007T1 (en) 1996-10-15
DE59304131D1 (en) 1996-11-14
DE4206680C1 (en) 1994-01-27
KR100213528B1 (en) 1999-08-02
EP0627021A1 (en) 1994-12-07
JP2799076B2 (en) 1998-09-17
WO1993017153A1 (en) 1993-09-02

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20130216