DE69423904T2 - ZUSÄTZE FÜR KUPFERÄTZFLüSSIGKEIT - Google Patents
ZUSÄTZE FÜR KUPFERÄTZFLüSSIGKEITInfo
- Publication number
- DE69423904T2 DE69423904T2 DE69423904T DE69423904T DE69423904T2 DE 69423904 T2 DE69423904 T2 DE 69423904T2 DE 69423904 T DE69423904 T DE 69423904T DE 69423904 T DE69423904 T DE 69423904T DE 69423904 T2 DE69423904 T2 DE 69423904T2
- Authority
- DE
- Germany
- Prior art keywords
- additives
- copper liquid
- copper
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/118,429 US5431776A (en) | 1993-09-08 | 1993-09-08 | Copper etchant solution additives |
PCT/US1994/010035 WO1995007372A1 (en) | 1993-09-08 | 1994-09-08 | Copper etchant solution additives |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69423904D1 DE69423904D1 (de) | 2000-05-11 |
DE69423904T2 true DE69423904T2 (de) | 2000-12-07 |
Family
ID=22378530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69423904T Expired - Fee Related DE69423904T2 (de) | 1993-09-08 | 1994-09-08 | ZUSÄTZE FÜR KUPFERÄTZFLüSSIGKEIT |
Country Status (18)
Country | Link |
---|---|
US (1) | US5431776A (de) |
EP (1) | EP0722512B1 (de) |
JP (1) | JPH09502483A (de) |
KR (1) | KR100330634B1 (de) |
CN (1) | CN1057800C (de) |
AU (1) | AU676772B2 (de) |
BR (1) | BR9407432A (de) |
CA (1) | CA2168013C (de) |
DE (1) | DE69423904T2 (de) |
DK (1) | DK0722512T3 (de) |
ES (1) | ES2146662T3 (de) |
GB (1) | GB2295585B (de) |
HK (1) | HK1006580A1 (de) |
IL (1) | IL110885A0 (de) |
MY (1) | MY111132A (de) |
SG (1) | SG50682A1 (de) |
TW (1) | TW412601B (de) |
WO (1) | WO1995007372A1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5431776A (en) * | 1993-09-08 | 1995-07-11 | Phibro-Tech, Inc. | Copper etchant solution additives |
KR100396695B1 (ko) * | 2000-11-01 | 2003-09-02 | 엘지.필립스 엘시디 주식회사 | 에천트 및 이를 이용한 전자기기용 기판의 제조방법 |
US6646147B2 (en) * | 2002-02-14 | 2003-11-11 | Phibrotech, Inc. | Process for the dissolution of copper metal |
US6921523B2 (en) * | 2003-10-14 | 2005-07-26 | Tessenderlo Kerley, Inc. | Magnesium thiosulfate solution and process for preparing same |
US7329365B2 (en) * | 2004-08-25 | 2008-02-12 | Samsung Electronics Co., Ltd. | Etchant composition for indium oxide layer and etching method using the same |
US7686963B2 (en) * | 2004-11-16 | 2010-03-30 | Tessenderlo Kerley, Inc. | Magnesium thiosulfate as ozone quencher and scrubber |
CN100443636C (zh) * | 2006-08-18 | 2008-12-17 | 丁四宜 | 氯化铵蚀刻液的充氧装置 |
TWI334320B (en) * | 2007-07-16 | 2010-12-01 | Nanya Technology Corp | Fabricating method of gold finger of circuit board |
TW200936005A (en) * | 2008-02-05 | 2009-08-16 | Subtron Technology Co Ltd | Inkjet printing process for circuit board |
US11225722B2 (en) | 2016-08-09 | 2022-01-18 | Tao Ye | Alkaline cupric chloride etchant for printed circuit board |
CN108650801B (zh) * | 2018-04-02 | 2020-07-10 | 皆利士多层线路版(中山)有限公司 | 厚铜线路板的沉金方法 |
CN111376129B (zh) * | 2018-12-27 | 2021-07-20 | 杭州朱炳仁文化艺术有限公司 | 多重蚀刻仿铸铜工艺 |
CN109811343B (zh) * | 2019-03-19 | 2020-11-17 | 惠州市瑞翔丰科技有限公司 | 不含氨氮的环保蚀刻液及蚀刻方法 |
CN109778194A (zh) * | 2019-03-22 | 2019-05-21 | 深圳市祺鑫天正环保科技有限公司 | 碱性蚀刻再生液的添加剂和碱性蚀刻再生液 |
CN110093639A (zh) * | 2019-04-22 | 2019-08-06 | 深圳市泓达环境科技有限公司 | 一种护锡添加剂及蚀刻液 |
CN113106455B (zh) * | 2021-05-08 | 2022-07-15 | 九江德福科技股份有限公司 | 一种用于铜箔微观分析的蚀刻液及其配制方法与蚀刻方法 |
CN114045494B (zh) * | 2021-10-25 | 2023-02-03 | 深圳前海榕达创途化工科技股份有限公司 | 一种用于pcb板的低酸度蚀刻生产方法以及双液型酸性蚀刻液体系 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE789944A (fr) * | 1971-10-12 | 1973-02-01 | Shipley Co | Regeneration d'une solution usagee d'attaque du cuivre |
FR2157766A1 (en) * | 1971-10-26 | 1973-06-08 | Pmd Chemicals Ltd | Copper-etching ammoniacal solns - contg additives increasing solubility of copper ions |
DE2216269A1 (de) * | 1972-04-05 | 1973-10-18 | Hoellmueller Maschbau H | Verfahren zum aetzen von kupfer und kupferlegierungen |
US4311511A (en) * | 1976-07-07 | 1982-01-19 | Gernot Graefe | Method for producing high-grade fertilizer |
US4311551A (en) * | 1979-04-12 | 1982-01-19 | Philip A. Hunt Chemical Corp. | Composition and method for etching copper substrates |
US4319955A (en) * | 1980-11-05 | 1982-03-16 | Philip A. Hunt Chemical Corp. | Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut |
DE3429902A1 (de) * | 1984-08-14 | 1986-02-27 | Hans Höllmüller Maschinenbau GmbH & Co, 7033 Herrenberg | Verfahren zum aetzen von kupferfilmen auf leiterplatten unter elektrolytischer rueckgewinnung von kupfer aus der aetzloesung |
US4784551A (en) * | 1985-05-24 | 1988-11-15 | Huck Manufacturing Company | Fastening system and method for flush and protruding head blind fasteners with common pin and particularly such fasteners constructed of exotic material |
US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
US4892776A (en) * | 1987-09-02 | 1990-01-09 | Ohmega Electronics, Inc. | Circuit board material and electroplating bath for the production thereof |
US4784785A (en) * | 1987-12-29 | 1988-11-15 | Macdermid, Incorporated | Copper etchant compositions |
US5243320A (en) * | 1988-02-26 | 1993-09-07 | Gould Inc. | Resistive metal layers and method for making same |
RU1807089C (ru) * | 1990-07-23 | 1993-04-07 | Харьковский государственный университет им.А.М.Горького | Раствор дл химического травлени меди |
US5043244A (en) * | 1990-09-10 | 1991-08-27 | E. I. Du Pont De Nemours And Company | Process for defined etching of substrates |
US5085730A (en) * | 1990-11-16 | 1992-02-04 | Macdermid, Incorporated | Process for regenerating ammoniacal chloride etchants |
US5248398A (en) * | 1990-11-16 | 1993-09-28 | Macdermid, Incorporated | Process for direct electrolytic regeneration of chloride-based ammoniacal copper etchant bath |
US5431776A (en) * | 1993-09-08 | 1995-07-11 | Phibro-Tech, Inc. | Copper etchant solution additives |
-
1993
- 1993-09-08 US US08/118,429 patent/US5431776A/en not_active Expired - Lifetime
-
1994
- 1994-09-05 MY MYPI94002316A patent/MY111132A/en unknown
- 1994-09-08 EP EP94927357A patent/EP0722512B1/de not_active Expired - Lifetime
- 1994-09-08 DK DK94927357T patent/DK0722512T3/da active
- 1994-09-08 JP JP7508767A patent/JPH09502483A/ja not_active Ceased
- 1994-09-08 GB GB9602280A patent/GB2295585B/en not_active Expired - Fee Related
- 1994-09-08 KR KR1019960701176A patent/KR100330634B1/ko not_active IP Right Cessation
- 1994-09-08 SG SG1996008558A patent/SG50682A1/en unknown
- 1994-09-08 DE DE69423904T patent/DE69423904T2/de not_active Expired - Fee Related
- 1994-09-08 BR BR9407432A patent/BR9407432A/pt not_active IP Right Cessation
- 1994-09-08 ES ES94927357T patent/ES2146662T3/es not_active Expired - Lifetime
- 1994-09-08 CN CN94193307A patent/CN1057800C/zh not_active Expired - Fee Related
- 1994-09-08 AU AU76830/94A patent/AU676772B2/en not_active Ceased
- 1994-09-08 WO PCT/US1994/010035 patent/WO1995007372A1/en active IP Right Grant
- 1994-09-08 IL IL11088594A patent/IL110885A0/xx unknown
- 1994-09-08 CA CA002168013A patent/CA2168013C/en not_active Expired - Fee Related
- 1994-09-21 TW TW083108662A patent/TW412601B/zh active
-
1998
- 1998-06-18 HK HK98105633A patent/HK1006580A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DK0722512T3 (da) | 2000-08-21 |
CA2168013C (en) | 2003-12-02 |
WO1995007372A1 (en) | 1995-03-16 |
HK1006580A1 (en) | 1999-03-05 |
EP0722512A1 (de) | 1996-07-24 |
KR960705078A (ko) | 1996-10-09 |
ES2146662T3 (es) | 2000-08-16 |
AU676772B2 (en) | 1997-03-20 |
EP0722512A4 (de) | 1996-07-31 |
SG50682A1 (en) | 1998-07-20 |
JPH09502483A (ja) | 1997-03-11 |
US5431776A (en) | 1995-07-11 |
CN1130408A (zh) | 1996-09-04 |
DE69423904D1 (de) | 2000-05-11 |
CA2168013A1 (en) | 1995-03-16 |
AU7683094A (en) | 1995-03-27 |
KR100330634B1 (ko) | 2002-10-18 |
MY111132A (en) | 1999-08-30 |
TW412601B (en) | 2000-11-21 |
EP0722512B1 (de) | 2000-04-05 |
IL110885A0 (en) | 1994-11-28 |
BR9407432A (pt) | 1996-04-09 |
GB2295585B (en) | 1996-08-14 |
CN1057800C (zh) | 2000-10-25 |
GB2295585A (en) | 1996-06-05 |
GB9602280D0 (en) | 1996-04-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |