HK1005272A1 - Head gimbal assembly and hard magnetic disk unit with the same - Google Patents

Head gimbal assembly and hard magnetic disk unit with the same

Info

Publication number
HK1005272A1
HK1005272A1 HK98103419A HK98103419A HK1005272A1 HK 1005272 A1 HK1005272 A1 HK 1005272A1 HK 98103419 A HK98103419 A HK 98103419A HK 98103419 A HK98103419 A HK 98103419A HK 1005272 A1 HK1005272 A1 HK 1005272A1
Authority
HK
Hong Kong
Prior art keywords
same
magnetic disk
hard magnetic
disk unit
gimbal assembly
Prior art date
Application number
HK98103419A
Other languages
English (en)
Inventor
Masahi Shiraishi
Noboru Yamanaka
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Publication of HK1005272A1 publication Critical patent/HK1005272A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
HK98103419A 1996-04-09 1998-04-24 Head gimbal assembly and hard magnetic disk unit with the same HK1005272A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11110296A JP3206428B2 (ja) 1996-04-09 1996-04-09 ヘッドジンバルアセンブリを具備するハードディスク装置

Publications (1)

Publication Number Publication Date
HK1005272A1 true HK1005272A1 (en) 1998-12-31

Family

ID=14552455

Family Applications (4)

Application Number Title Priority Date Filing Date
HK98102885A HK1005270A1 (en) 1996-04-09 1998-04-07 Head gimbal assembly and hard magnetic disk unit with the same
HK98103419A HK1005272A1 (en) 1996-04-09 1998-04-24 Head gimbal assembly and hard magnetic disk unit with the same
HK98110429A HK1009551A1 (en) 1996-04-09 1998-09-04 Head gimbal assembly and hard magnetic disk unit with the same
HK98110905A HK1009877A1 (en) 1996-04-09 1998-09-24 Head gimbal assembly and hard magnetic disk unit with the same

Family Applications Before (1)

Application Number Title Priority Date Filing Date
HK98102885A HK1005270A1 (en) 1996-04-09 1998-04-07 Head gimbal assembly and hard magnetic disk unit with the same

Family Applications After (2)

Application Number Title Priority Date Filing Date
HK98110429A HK1009551A1 (en) 1996-04-09 1998-09-04 Head gimbal assembly and hard magnetic disk unit with the same
HK98110905A HK1009877A1 (en) 1996-04-09 1998-09-24 Head gimbal assembly and hard magnetic disk unit with the same

Country Status (5)

Country Link
US (1) US5995329A (xx)
JP (1) JP3206428B2 (xx)
GB (1) GB2312082B (xx)
HK (4) HK1005270A1 (xx)
SG (1) SG48523A1 (xx)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10247310A (ja) * 1996-12-19 1998-09-14 Hutchinson Technol Inc 温湿補整用の順次配置され金属裏打ちされ懸架された絶縁体部分を備えた一体型リード懸架装置湾曲体
US6381100B1 (en) 1996-12-19 2002-04-30 Hutchinson Technology Incorporated Integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation
US6147839A (en) * 1996-12-23 2000-11-14 Hutchinson Technology, Inc. Head suspension with outriggers extending across a spring region
US6612016B1 (en) 1997-12-18 2003-09-02 Hutchinson Technology Incorporated Method of making integrated lead suspension flexure with balanced parallel leads for insulator layer hygrothermal compensation
US6181526B1 (en) * 1998-01-06 2001-01-30 Magnecomp Corp. Suspension with flexible circuit welded thereto via metal pads
US5924187A (en) 1998-01-06 1999-07-20 Hutchinson Technology Incorporated Integrated lead head suspension assembly having an etched laminated load beam and flexure with deposited conductors
JP3799168B2 (ja) * 1998-08-20 2006-07-19 株式会社日立グローバルストレージテクノロジーズ 磁気記録再生装置
US6181527B1 (en) * 1999-04-23 2001-01-30 International Business Machines Corporation Transducer suspension system including a frequency dependent shunt
US6487047B1 (en) * 1999-06-02 2002-11-26 Maxtor Corporation Trace interconnect array having increased bandwidth by selective etching of traces and dielectric substrate
JP4222690B2 (ja) * 1999-07-12 2009-02-12 ソニーケミカル＆インフォメーションデバイス株式会社 フレキシブル配線基板素片及び配線シート
US6366430B1 (en) * 1999-12-06 2002-04-02 Seagate Technology Llc Method and apparatus for improved static angle adjustment
JP4277455B2 (ja) 2001-02-27 2009-06-10 Ｔｄｋ株式会社 ヘッドジンバルアセンブリ
US6714385B1 (en) * 2001-04-16 2004-03-30 Hutchinson Technology Inc. Apparatus and method for controlling common mode impedance in disk drive head suspensions
KR100438777B1 (ko) * 2001-11-06 2004-07-05 삼성전자주식회사 공동이 형성된 가요성 인쇄회로를 구비하는 하드디스크드라이브
US6725526B2 (en) * 2002-01-14 2004-04-27 Hitachi Global Storage Technologies Netherlands B.V. Method of forming microsuspension assemblies for direct access storage devices
CN100476981C (zh) * 2003-03-17 2009-04-08 新科实业有限公司 制造硬盘驱动器悬架挠性梁的系统与方法
JP4222882B2 (ja) 2003-06-03 2009-02-12 日東電工株式会社 配線回路基板
US7660074B1 (en) 2003-09-11 2010-02-09 Hutchinson Technology Incorporated Webbed ground plane structure for integrated lead suspensions
JP2006048800A (ja) * 2004-08-03 2006-02-16 Tdk Corp 磁気ヘッドスライダ支持装置、ヘッドジンバルアセンブリ、ヘッドアームアセンブリおよび磁気ディスク装置
US8085507B2 (en) * 2005-01-13 2011-12-27 Hitachi Global Storage Technologies, Netherlands, B.V. Method and apparatus for forming an opening in a base-metal layer of an electrical lead suspension (ELS) to increase the impedance
US7433157B2 (en) * 2005-01-13 2008-10-07 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities
US7450346B2 (en) * 2005-01-18 2008-11-11 Hitachi Global Storage Technologies Netherlands B.V. Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension
US20060157441A1 (en) * 2005-01-18 2006-07-20 Arya Satya P Apparatus and method for reducing solder pad size and forming an opening in a base-metal layer of an electrical lead suspension (ELS)
US7489479B2 (en) * 2005-01-18 2009-02-10 Hitachi Global Storage Technologies Netherlands B.V. Electrical lead suspension having partitioned air slots
US20060158784A1 (en) * 2005-01-18 2006-07-20 Arya Satya P Method and apparatus for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension
JP4326484B2 (ja) 2005-02-21 2009-09-09 日本発條株式会社 ヘッドサスペンション
JP4386863B2 (ja) 2005-02-21 2009-12-16 日本発條株式会社 ヘッド・サスペンション
JP4727264B2 (ja) 2005-03-17 2011-07-20 日本発條株式会社 ヘッド・サスペンション
JP4428707B2 (ja) 2005-03-17 2010-03-10 日本発條株式会社 ヘッド・サスペンション
JP2006268965A (ja) 2005-03-24 2006-10-05 Fujitsu Ltd 広帯域伝送路装置、サスペンションアセンブリ及び記憶媒体装置
JP4367712B2 (ja) 2005-03-30 2009-11-18 日本発條株式会社 ヘッド・サスペンション
JP4346091B2 (ja) 2005-03-31 2009-10-14 日本発條株式会社 ヘッド・サスペンション
JP4437455B2 (ja) 2005-04-15 2010-03-24 日本発條株式会社 ヘッド・サスペンション
JP4382696B2 (ja) 2005-05-09 2009-12-16 日本発條株式会社 ヘッド・サスペンションの製造方法
JP4390148B2 (ja) 2005-05-09 2009-12-24 日本発條株式会社 ヘッド・サスペンションの製造方法
JP4382695B2 (ja) 2005-05-09 2009-12-16 日本発條株式会社 ヘッド・サスペンション
JP4640802B2 (ja) * 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
JP4390149B2 (ja) 2005-08-17 2009-12-24 日本発條株式会社 ヘッド・サスペンション
US7522382B1 (en) * 2005-08-22 2009-04-21 Western Digital (Fremont), Llc Head stack assembly with interleaved flexure tail bond pad rows
JP4611159B2 (ja) * 2005-09-20 2011-01-12 日東電工株式会社 配線回路基板
JP4615427B2 (ja) 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
JP4330580B2 (ja) * 2005-12-09 2009-09-16 日本発條株式会社 多層グランド層のヘッド・サスペンション及びその製造方法、多層グランド層のフレキシャ及びその製造方法
US8416532B1 (en) 2006-04-13 2013-04-09 Hutchinson Technology Incorporated Continuous stainless steel ground plane flexure for a disk drive head suspension
JP4865453B2 (ja) 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
US7710687B1 (en) 2006-09-13 2010-05-04 Hutchinson Technology Incorporated High conductivity ground planes for integrated lead suspensions
US7832082B1 (en) * 2006-10-10 2010-11-16 Hutchinson Technology Incorporated Method for manufacturing an integrated lead suspension component
US7929252B1 (en) 2006-10-10 2011-04-19 Hutchinson Technology Incorporated Multi-layer ground plane structures for integrated lead suspensions
JP2008282995A (ja) 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
US8315009B2 (en) * 2007-09-28 2012-11-20 Hitachi Global Storage Technologies, Netherlands B.V. System and method for changing resonant frequency in hard disk drive components
JP4640853B2 (ja) * 2007-11-12 2011-03-02 日東電工株式会社 配線回路基板
JP4640852B2 (ja) * 2007-11-12 2011-03-02 日東電工株式会社 配線回路基板の製造方法
US8045296B1 (en) * 2007-11-29 2011-10-25 Hutchinson Technology Incorporated Aligned coverlay and metal layer windows for integrated lead suspensions
JP5091719B2 (ja) * 2008-02-29 2012-12-05 日東電工株式会社 配線回路基板
JP5227851B2 (ja) 2009-03-06 2013-07-03 日本発條株式会社 ディスク装置用フレキシャ
JP5377177B2 (ja) 2009-09-08 2013-12-25 日本発條株式会社 ディスク装置用サスペンション
US8638527B2 (en) * 2009-10-16 2014-01-28 Hitachi Global Storage Technologies Netherlands B.V. Signaling method and apparatus for write assist of high coercivity media using integrated half coil
US8411390B2 (en) * 2009-10-16 2013-04-02 Hitachi Global Storage Technologies Netherlands B.V. Integrated half coil structure for write assist of high coercivity media
JP5453153B2 (ja) 2010-03-31 2014-03-26 日本発條株式会社 ディスク装置用フレキシャ
JP6021211B2 (ja) * 2010-04-30 2016-11-09 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
JP6125145B2 (ja) * 2011-07-04 2017-05-10 日本発條株式会社 配線回路基板
JP5349634B2 (ja) * 2012-03-16 2013-11-20 日東電工株式会社 回路付サスペンション基板
JP2015518229A (ja) 2012-03-22 2015-06-25 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ディスクドライブのヘッドサスペンションのフレクシャ用接地形体
US8531800B1 (en) * 2012-11-29 2013-09-10 HGST Netherlands B.V. Magnetic write head having dual parallel capacitors for integrated transmission line compensation
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
JP6251129B2 (ja) * 2014-06-13 2017-12-20 日東電工株式会社 回路付サスペンション基板
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
US9734852B2 (en) 2015-06-30 2017-08-15 Hutchinson Technology Incorporated Disk drive head suspension structures having improved gold-dielectric joint reliability
JP6511371B2 (ja) 2015-09-10 2019-05-15 日本発條株式会社 ディスク装置用サスペンションのフレキシャと、フレキシャの配線部の製造方法
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
US10814457B2 (en) * 2018-03-19 2020-10-27 Globalfoundries Inc. Gimbal for CMP tool conditioning disk having flexible metal diaphragm
CN110553676B (zh) * 2018-05-30 2022-02-01 南昌欧菲显示科技有限公司 传感器

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JPH0734547Y2 (ja) * 1989-12-07 1995-08-02 アルプス電気株式会社 磁気ヘッドの支持機構
US5781379A (en) * 1994-03-15 1998-07-14 International Business Machines Corporation Single beam flexure for a head gimbal assembly
JP3173714B2 (ja) * 1994-12-08 2001-06-04 インターナショナル・ビジネス・マシーンズ・コーポレ−ション サスペンション・システム
US5608591A (en) * 1995-06-09 1997-03-04 International Business Machines Corporation Integrated head-electronics interconnection suspension for a data recording disk drive
US5805382A (en) * 1996-06-21 1998-09-08 International Business Machines Corporation Integrated conductor magnetic recording head and suspension having cross-over integrated circuits for noise reduction
US5796552A (en) * 1996-10-03 1998-08-18 Quantum Corporation Suspension with biaxially shielded conductor trace array

Also Published As

Publication number Publication date
JPH09282624A (ja) 1997-10-31
HK1005270A1 (en) 1998-12-31
JP3206428B2 (ja) 2001-09-10
HK1009877A1 (en) 1999-06-11
HK1009551A1 (en) 1999-06-04
SG48523A1 (en) 1998-04-17
GB9706772D0 (en) 1997-05-21
GB2312082A (en) 1997-10-15
US5995329A (en) 1999-11-30
GB2312082B (en) 1998-09-23

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080403