GB834821A - Improvements in and relating to methods and apparatus for jet electrolytic etching orplating - Google Patents

Improvements in and relating to methods and apparatus for jet electrolytic etching orplating

Info

Publication number
GB834821A
GB834821A GB18921/56A GB1892156A GB834821A GB 834821 A GB834821 A GB 834821A GB 18921/56 A GB18921/56 A GB 18921/56A GB 1892156 A GB1892156 A GB 1892156A GB 834821 A GB834821 A GB 834821A
Authority
GB
United Kingdom
Prior art keywords
workpiece
electrolyte
jets
jet
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB18921/56A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxar Space LLC
Original Assignee
Philco Ford Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philco Ford Corp filed Critical Philco Ford Corp
Publication of GB834821A publication Critical patent/GB834821A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/61—Electrolytic etching
    • H10P50/613—Electrolytic etching of Group IV materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/12—Etching of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
GB18921/56A 1955-06-23 1956-06-19 Improvements in and relating to methods and apparatus for jet electrolytic etching orplating Expired GB834821A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51745355A 1955-06-23 1955-06-23
US55969556A 1956-01-17 1956-01-17
US637972A US2937124A (en) 1955-06-23 1957-02-04 Method of fabricating semiconductive devices and the like

Publications (1)

Publication Number Publication Date
GB834821A true GB834821A (en) 1960-05-11

Family

ID=27414665

Family Applications (1)

Application Number Title Priority Date Filing Date
GB18921/56A Expired GB834821A (en) 1955-06-23 1956-06-19 Improvements in and relating to methods and apparatus for jet electrolytic etching orplating

Country Status (6)

Country Link
US (1) US2937124A (enExample)
BE (1) BE564480A (enExample)
DE (1) DE1072045B (enExample)
FR (1) FR1153749A (enExample)
GB (1) GB834821A (enExample)
NL (2) NL208297A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2384865A1 (fr) * 1977-02-04 1978-10-20 Schering Ag Procede de galvanisage partiel
US4289947A (en) * 1978-03-02 1981-09-15 Inoue-Japax Research Incorporated Fluid jetting system for electrical machining
RU2640213C1 (ru) * 2016-12-30 2017-12-27 Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) Способ струйного электролитно-плазменного полирования металлических изделий сложного профиля и устройство для его реализации

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1165583A (fr) 1956-12-03 1958-10-27 Procédé et appareillage pour le traitement chimique ou électrolytique des surfaces
DE1225017B (de) 1957-06-05 1966-09-15 Westinghouse Electric Corp Vorrichtung zur Behandlung der Oberflaeche von Halbleiteranordnungen mit pn-UEbergang
NL239732A (enExample) 1958-06-18
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
US3058895A (en) * 1958-11-10 1962-10-16 Anocut Eng Co Electrolytic shaping
US3039514A (en) * 1959-01-16 1962-06-19 Philco Corp Fabrication of semiconductor devices
GB919158A (en) * 1959-02-26 1963-02-20 Mullard Ltd Improvements in methods of etching bodies
NL125378C (enExample) * 1959-11-27
US3172831A (en) * 1960-06-15 1965-03-09 Anocut Eng Co Grinding machine
US3384567A (en) * 1965-10-22 1968-05-21 Gen Electric Electrolyte guide member
US3409534A (en) * 1965-12-29 1968-11-05 Gen Electric Electrolytic material removal apparatus
US3630795A (en) * 1969-07-25 1971-12-28 North American Rockwell Process and system for etching metal films using galvanic action
US3793170A (en) * 1971-06-09 1974-02-19 Trw Inc Electrochemical machining method and apparatus
GB1445296A (en) * 1973-04-21 1976-08-11 Inoue Japax Res Electrical discharge machining
GB1464404A (en) * 1974-11-06 1977-02-16 Rolls Royce Electrical leakage control in electrochemical machine tools electrolyte drains systems
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
JPS56102590A (en) * 1979-08-09 1981-08-17 Koichi Shimamura Method and device for plating of microarea
US4344809A (en) * 1980-09-29 1982-08-17 Wensink Ben L Jet etch apparatus for decapsulation of molded devices
US4359360A (en) * 1981-12-10 1982-11-16 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for selectively jet etching a plastic encapsulating an article
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
DE102005011298A1 (de) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zum Ätzen von Substraten
WO2013181629A1 (en) * 2012-06-01 2013-12-05 California Institute Of Technology Scanning drop sensor

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1114592A (en) * 1914-02-26 1914-10-20 Clinton C De Witt Hydropneumatic window-cleaning apparatus.
US1654727A (en) * 1925-07-13 1928-01-03 Green Edward William Apparatus for removing normally viscous liquid from surfaces
US1814866A (en) * 1926-09-30 1931-07-14 American Laundry Machinery Co Carpet cleaning machine
DE565765C (de) * 1929-07-24 1932-12-08 Vladimir Gusseff Verfahren und Vorrichtung zur elektrolytischen Bearbeitung von Metallen
US1982345A (en) * 1930-06-13 1934-11-27 James B Kirby Window washer
US2523018A (en) * 1946-12-12 1950-09-19 Paper Patents Co Method of cylinder etching and machine therefor
US2568803A (en) * 1949-06-09 1951-09-25 Guenst William Etching machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2384865A1 (fr) * 1977-02-04 1978-10-20 Schering Ag Procede de galvanisage partiel
US4289947A (en) * 1978-03-02 1981-09-15 Inoue-Japax Research Incorporated Fluid jetting system for electrical machining
RU2640213C1 (ru) * 2016-12-30 2017-12-27 Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) Способ струйного электролитно-плазменного полирования металлических изделий сложного профиля и устройство для его реализации

Also Published As

Publication number Publication date
NL104994C (enExample)
BE564480A (enExample)
DE1072045B (de) 1959-12-24
NL208297A (enExample)
FR1153749A (fr) 1958-03-20
US2937124A (en) 1960-05-17

Similar Documents

Publication Publication Date Title
GB834821A (en) Improvements in and relating to methods and apparatus for jet electrolytic etching orplating
CA2264908C (en) Method for anisotropic etching of structures in conducting materials
US2767137A (en) Method for electrolytic etching
US2799637A (en) Method for electrolytic etching
US2958636A (en) Method of the application of liquids to solids
GB838400A (en) Improvements in or relating to electrolytic surface treatment
JPS5694630A (en) Etching method using ion-beam
GB1096411A (en) Improvements in or relating to the production of cutting edges
US2843809A (en) Transistors
JPS5534418A (en) Method of selectively etching semiconductor
JPS56140659A (en) Manufacture of semiconductor device
JPS57100719A (en) Manufacture of semiconductor device
JPS5792829A (en) Forming method for electrode
JPS5793545A (en) Manufacture of semiconductor device
JPH0586654B2 (enExample)
JPS5772350A (en) Fabrication of semiconductor device
JPS628516B2 (enExample)
JPS5667933A (en) Scribe method of semiconductor wafer
JPH0288792A (ja) ウェハのメッキ装置
JPS54124843A (en) Processing of ferrite
JPS55158263A (en) Removing method of copper oxide film
JPS5797628A (en) Manufacture of mos integrated circuit
JPS5779165A (en) Ultrasonic hot dipping device
JPS56164572A (en) Beveling process of semiconductor element
JPH03116726A (ja) 半導体装置の製造方法