FR2384865A1 - Procede de galvanisage partiel - Google Patents
Procede de galvanisage partielInfo
- Publication number
- FR2384865A1 FR2384865A1 FR7802759A FR7802759A FR2384865A1 FR 2384865 A1 FR2384865 A1 FR 2384865A1 FR 7802759 A FR7802759 A FR 7802759A FR 7802759 A FR7802759 A FR 7802759A FR 2384865 A1 FR2384865 A1 FR 2384865A1
- Authority
- FR
- France
- Prior art keywords
- galvanized
- nozzle
- galvanizing process
- partial
- place
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Procédé de galvanisation partielle de surfaces conductrices par dépôt de metaux à partir de solutions d'électrolytes. La solution d'électrolyte, arrivant par la buse 1, est appliquée en un endroit défini sous la forme d'un jet d'adhérence ou de paroi sur la surface à galvaniser 3, et est éliminée en un endroit également défini au moyen d'un dispositif d'aspiration 2. La buse 1 sert d'anode et la pièce à galvaniser 3 de cathode. Application à l'argenture ou à la dorure des régions de contact des contacteurs à fiches.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2705158A DE2705158C2 (de) | 1977-02-04 | 1977-02-04 | Verfahren zum Teilgalvanisieren |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2384865A1 true FR2384865A1 (fr) | 1978-10-20 |
FR2384865B1 FR2384865B1 (fr) | 1982-05-28 |
Family
ID=6000604
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7802759A Granted FR2384865A1 (fr) | 1977-02-04 | 1978-02-01 | Procede de galvanisage partiel |
Country Status (7)
Country | Link |
---|---|
US (1) | US4140590A (fr) |
JP (1) | JPS585274B2 (fr) |
CH (1) | CH635871A5 (fr) |
DE (1) | DE2705158C2 (fr) |
FR (1) | FR2384865A1 (fr) |
GB (1) | GB1599832A (fr) |
NL (1) | NL7800686A (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE4262T1 (de) * | 1979-07-27 | 1983-08-15 | Amp Incorporated | Mit kontaktmetall elektroplattierter streifen elektrischer endkontakte und verfahren und vorrichtung zum elektroplattieren eines solchen streifens. |
JPS56102590A (en) * | 1979-08-09 | 1981-08-17 | Koichi Shimamura | Method and device for plating of microarea |
DE3015282C2 (de) * | 1980-04-21 | 1986-07-17 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum partiellen Galvanisieren von leitenden oder leitend gemachten Oberflächen |
US4427498A (en) * | 1982-03-25 | 1984-01-24 | Amp Incorporated | Selective plating interior surfaces of electrical terminals |
US4514264A (en) * | 1984-02-21 | 1985-04-30 | Meco Equipment Engineers B.V. | Method and device for galvanically applying a metal coating on metal objects |
JPS60257016A (ja) * | 1984-06-04 | 1985-12-18 | 日本電気株式会社 | リ−ドスイツチ接点メツキ方法 |
GB8802393D0 (en) * | 1988-02-03 | 1988-03-02 | Gen Electric Co Plc | Apparatus for selectively coating part of member |
EP0327298A3 (fr) * | 1988-02-03 | 1990-06-27 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Appareil pour revêtir sélectivement une partie d'un élément |
FR2688804A1 (fr) * | 1992-03-20 | 1993-09-24 | Souriau & Cie | Procede de depot electrolytique selectif d'un metal notamment d'un metal noble tel que l'or sur la face interne de corps creux en forme de douille notamment d'elements de contact de connecteur machine pour la mise en óoeuvre du procede, produit obtenu. |
US20070269676A1 (en) * | 2006-05-19 | 2007-11-22 | Singer Kevin M | Diffusion barrier layer and method of making the same, and wear resistant article with the diffusion barrier layer and method of making the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB834821A (en) * | 1955-06-23 | 1960-05-11 | Philco Corp | Improvements in and relating to methods and apparatus for jet electrolytic etching orplating |
US3039514A (en) * | 1959-01-16 | 1962-06-19 | Philco Corp | Fabrication of semiconductor devices |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1285875A (en) * | 1918-03-29 | 1918-11-26 | John E Woodbury | Electroplating device. |
US2958636A (en) * | 1956-09-10 | 1960-11-01 | Philco Corp | Method of the application of liquids to solids |
US3071521A (en) * | 1959-07-21 | 1963-01-01 | Burrougbs Corp | Method and apparatus for electrolytic treatment |
US3294664A (en) * | 1963-09-03 | 1966-12-27 | Hoover Co | Electrolytic appliance for treating surfaces |
US3546088A (en) * | 1967-03-14 | 1970-12-08 | Reynolds Metals Co | Anodizing apparatus |
DE1807481C3 (de) | 1968-11-07 | 1975-10-09 | Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen | Verfahren zum partiellen Galvanisieren |
CA940083A (en) | 1969-02-27 | 1974-01-15 | Usui Kokusai Sangyo Kabushiki Kaisha | Method of and apparatus for continuously electroplating one side of a steel strip |
DE2230891A1 (de) | 1972-06-23 | 1974-01-17 | Siemens Ag | Verfahren zum partiellen galvanischen beschichten von drahtstiften sowie vorrichtung zur ausuebung des verfahrens |
DE2253196A1 (de) | 1972-10-30 | 1974-05-09 | Licentia Gmbh | Verfahren zum partiellen galvanisieren eines nicht- oder halbleitenden stoffes |
US3835017A (en) | 1972-12-22 | 1974-09-10 | Buckbee Mears Co | Reusable shields for selective electrodeposition |
DE2263642A1 (de) | 1972-12-27 | 1974-07-04 | Telefonbau & Normalzeit Gmbh | Verfahren zum elektrolytischen abscheiden von edelmetallen |
DE2324834C2 (de) | 1973-05-17 | 1978-09-07 | Dr. Eugen Duerrwaechter Doduco, 7530 Pforzheim | Vorrichtung zum kontinuierlichen selektiven Bandgalvanisieren |
-
1977
- 1977-02-04 DE DE2705158A patent/DE2705158C2/de not_active Expired
- 1977-12-20 CH CH1568577A patent/CH635871A5/de not_active IP Right Cessation
-
1978
- 1978-01-19 NL NL7800686A patent/NL7800686A/xx not_active Application Discontinuation
- 1978-02-01 FR FR7802759A patent/FR2384865A1/fr active Granted
- 1978-02-03 JP JP53011368A patent/JPS585274B2/ja not_active Expired
- 1978-02-06 GB GB4661/78A patent/GB1599832A/en not_active Expired
- 1978-02-06 US US05/875,293 patent/US4140590A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB834821A (en) * | 1955-06-23 | 1960-05-11 | Philco Corp | Improvements in and relating to methods and apparatus for jet electrolytic etching orplating |
US3039514A (en) * | 1959-01-16 | 1962-06-19 | Philco Corp | Fabrication of semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
FR2384865B1 (fr) | 1982-05-28 |
DE2705158C2 (de) | 1986-02-27 |
CH635871A5 (de) | 1983-04-29 |
JPS5397936A (en) | 1978-08-26 |
US4140590A (en) | 1979-02-20 |
JPS585274B2 (ja) | 1983-01-29 |
DE2705158A1 (de) | 1978-08-17 |
GB1599832A (en) | 1981-10-07 |
NL7800686A (nl) | 1978-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2416743A1 (fr) | Procede d'obtention d'un revetement de gel d'une matiere refractaire sur un substrat, et substrat obtenu | |
FR2384865A1 (fr) | Procede de galvanisage partiel | |
SE360779B (fr) | ||
HK1000650A1 (en) | Process for plating a face of an aluminium or aluminium alloy workpiece | |
EP1160846A3 (fr) | Méthode d'application d'une polarisation électrique pour améliorer le dépôt d'un métal | |
ES2057445T3 (es) | Proceso y aparato para cobreado en electrodos. | |
FR2407990A1 (fr) | Procede de revetement d'aluminium et d'alliages d'aluminium. | |
Popov et al. | Electrodeposition of zinc on copper from alkaline zincate solutions | |
ES8205268A1 (es) | Procedimiento para la precipitacion sin corriente de una ca-pa metalica | |
CN1046198A (zh) | 无氰连续镀铜生产技术 | |
JP2576142B2 (ja) | スプレー式エッチング方法 | |
JPS56158891A (en) | Electrolytic treatment of strip metallic plate | |
JPS627280B2 (fr) | ||
JPS55110781A (en) | Surface treated steel plate with good spot weldability | |
JPS57115864A (en) | Compound semiconductor device | |
BE1002787A7 (fr) | Dispositif de fabrication, par electrodeposition, d'une feuille metallique perforee de faible epaisseur, ainsi que procedes de realisation et d'utilisation d'un tel dispositif. | |
FR2799475B1 (fr) | Procede de metallisation d'un substrat isolant par voie electrochimique | |
Bozhkov et al. | Electrolytic Deposition of Nickel From a Watts Electrolyte. II. Comparative Investigations of Nickel Deposition on Platinum, Gold and Glassy Carbon Substrates | |
JPS57210985A (en) | Partial plating device | |
JPS56160078A (en) | Forming method of electrode of solar battery | |
ES8206670A1 (es) | Un metodo mejorado para el electrodeposito de un recubri- miento de nickel sustancialmente negro sobre un sustrato | |
Tomaszewski et al. | New Alkaline Copper Process: a Novel Alternative to Cyanide Copper | |
Petrov | Physicochemical aspects of corrosion cracking | |
JPS5638461A (en) | Gas spray nozzle for wiper in molten metal plating equipment | |
JPS57128923A (en) | Coating equipment of wafer fixing adhesive |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |