JPS57210985A - Partial plating device - Google Patents

Abstract

PURPOSE: To reduce the distance from the cathode and to form a plating film with a uniform plating film thickness distribution on low voltage in the stage of electroplating only the required part of a material to be plated by mounting the anode to the inside surface of a holding frame for a mask for limiting the plating part.

CONSTITUTION: In the stage of electroplating noble metals such as gold on the specific part 1a of a material 1 to be plated, a mask 3 having a through-hole for limiting the plating part 1a of the material 1 and the material 1 are brought into tight contact with each other by a pressing plate 2. A holding frame 4 provided with the through-hole 3a corresponding to the through-hole of the mask is brought into tight contact in the through-hole of the mask 3 and an insoluble anode 8 such as platinum plate is mounted to the inside surface thereof. With the material 1 as the cathode, a plating soln. 9a is injected from a nozzle 7 to electroplate the noble metals such as gold on the corresponding part of the hole 3a of the material 1. Since the spacing between the anode 8 and the cathode 1 is small, the plating is accomplished on low voltage, and since the current distribution is uniform, the plating film having no waste owing to a difference in thickess is formed on the plating part.

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