JPS5687659A - Electroless plating device - Google Patents

Electroless plating device

Info

Publication number
JPS5687659A
JPS5687659A JP16605879A JP16605879A JPS5687659A JP S5687659 A JPS5687659 A JP S5687659A JP 16605879 A JP16605879 A JP 16605879A JP 16605879 A JP16605879 A JP 16605879A JP S5687659 A JPS5687659 A JP S5687659A
Authority
JP
Japan
Prior art keywords
plating
cell
electroless plating
soln
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16605879A
Other languages
Japanese (ja)
Other versions
JPS6131187B2 (en
Inventor
Soichi Hinohara
Tokunaga Momose
Kunimi Nishimura
Norito Nakamaki
Kazue Komatsu
Hiroshi Hirano
Kenji Aoyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP16605879A priority Critical patent/JPS5687659A/en
Publication of JPS5687659A publication Critical patent/JPS5687659A/en
Publication of JPS6131187B2 publication Critical patent/JPS6131187B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE: To prevent plating metal from depositing and sticking on a plating cell by connecting a DC power source between the conductive material installed in the plating cell and said cell and flowing microcurrent during the operation of electroless plating in an elecroless plating cell.
CONSTITUTION: An inside plating cell 13 having multiplepores 18 made of an electrical insulating material is disposed in an electroless plating cell 12, and a conductive material 15 is disposed in the clearance 14 between both plating cells 12, 13. An electroless plating soln. is put into both plating cells 12, 13, and the object to be plated is put into the inside plating cell 13, whereby a plating layer is formed nonelectrolytically on the surface of the object to be plated. At this time, in order to prevent the plating metal from sticking on the surface of the plating cell 12, too, in the electroless plating, the negative pole and positive pole of a DC power source are connected to the conductive bar 15 in the plating soln. and the clip 17 mounted on the plating layer 12 stick on the conductive bar 13 of negative electrode and do not stick on the plating cell 12, thus there is no waste of the plating soln.
COPYRIGHT: (C)1981,JPO&Japio
JP16605879A 1979-12-20 1979-12-20 Electroless plating device Granted JPS5687659A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16605879A JPS5687659A (en) 1979-12-20 1979-12-20 Electroless plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16605879A JPS5687659A (en) 1979-12-20 1979-12-20 Electroless plating device

Publications (2)

Publication Number Publication Date
JPS5687659A true JPS5687659A (en) 1981-07-16
JPS6131187B2 JPS6131187B2 (en) 1986-07-18

Family

ID=15824182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16605879A Granted JPS5687659A (en) 1979-12-20 1979-12-20 Electroless plating device

Country Status (1)

Country Link
JP (1) JPS5687659A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7332198B2 (en) * 2001-11-02 2008-02-19 Ebara Corporation Plating apparatus and plating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7332198B2 (en) * 2001-11-02 2008-02-19 Ebara Corporation Plating apparatus and plating method

Also Published As

Publication number Publication date
JPS6131187B2 (en) 1986-07-18

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