JPS5687659A - Electroless plating device - Google Patents
Electroless plating deviceInfo
- Publication number
- JPS5687659A JPS5687659A JP16605879A JP16605879A JPS5687659A JP S5687659 A JPS5687659 A JP S5687659A JP 16605879 A JP16605879 A JP 16605879A JP 16605879 A JP16605879 A JP 16605879A JP S5687659 A JPS5687659 A JP S5687659A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cell
- electroless plating
- soln
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To prevent plating metal from depositing and sticking on a plating cell by connecting a DC power source between the conductive material installed in the plating cell and said cell and flowing microcurrent during the operation of electroless plating in an elecroless plating cell.
CONSTITUTION: An inside plating cell 13 having multiplepores 18 made of an electrical insulating material is disposed in an electroless plating cell 12, and a conductive material 15 is disposed in the clearance 14 between both plating cells 12, 13. An electroless plating soln. is put into both plating cells 12, 13, and the object to be plated is put into the inside plating cell 13, whereby a plating layer is formed nonelectrolytically on the surface of the object to be plated. At this time, in order to prevent the plating metal from sticking on the surface of the plating cell 12, too, in the electroless plating, the negative pole and positive pole of a DC power source are connected to the conductive bar 15 in the plating soln. and the clip 17 mounted on the plating layer 12 stick on the conductive bar 13 of negative electrode and do not stick on the plating cell 12, thus there is no waste of the plating soln.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16605879A JPS5687659A (en) | 1979-12-20 | 1979-12-20 | Electroless plating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16605879A JPS5687659A (en) | 1979-12-20 | 1979-12-20 | Electroless plating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5687659A true JPS5687659A (en) | 1981-07-16 |
JPS6131187B2 JPS6131187B2 (en) | 1986-07-18 |
Family
ID=15824182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16605879A Granted JPS5687659A (en) | 1979-12-20 | 1979-12-20 | Electroless plating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5687659A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7332198B2 (en) * | 2001-11-02 | 2008-02-19 | Ebara Corporation | Plating apparatus and plating method |
-
1979
- 1979-12-20 JP JP16605879A patent/JPS5687659A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7332198B2 (en) * | 2001-11-02 | 2008-02-19 | Ebara Corporation | Plating apparatus and plating method |
Also Published As
Publication number | Publication date |
---|---|
JPS6131187B2 (en) | 1986-07-18 |
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