JPS5687691A - Method and apparatus for plating printed wiring board - Google Patents
Method and apparatus for plating printed wiring boardInfo
- Publication number
- JPS5687691A JPS5687691A JP16377979A JP16377979A JPS5687691A JP S5687691 A JPS5687691 A JP S5687691A JP 16377979 A JP16377979 A JP 16377979A JP 16377979 A JP16377979 A JP 16377979A JP S5687691 A JPS5687691 A JP S5687691A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- substrate
- anode
- electrodes
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To make it possible to plate a substrate for titled board uniformly at high denseness, by arranging an anode plate having arc-shaped projecting part facing to a cathode made of an insulating plate having electroconductive through hole wall, and by plating the one side of the insulating plate alternately by applying pulse current across the electrodes.
CONSTITUTION: An anode plate 300 having arc-shaped projecting central part is arranged facing to the one side of a cathode plate made of insulating plate 100 which is to be used e.g. as a substrate for a printed wiring board and which has electroconductive through hole wall, then pulse current is applied across both electrodes by connecting an electric power source 400 to the electrodes. At first, electroplating is performed with the anode 300 arranged on the right side of the substrate 100, then with the anode 300 arranged on the left side of the substrate 100, said alternative arrangement being repeated 1W60 times, hereby plating is iniformalized by controlling the increase in denseness at the circumferential end of the substrate 100. Installation of a shield board 200 having large aperture ratio at the central part between the cathode plate 100 and the anode plate 300 exhibits the same effect as the anode 300 having curved structure. This method is particularly effective against the substrate having a large hole diameter: plate thickness ratio.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16377979A JPS5687691A (en) | 1979-12-17 | 1979-12-17 | Method and apparatus for plating printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16377979A JPS5687691A (en) | 1979-12-17 | 1979-12-17 | Method and apparatus for plating printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5687691A true JPS5687691A (en) | 1981-07-16 |
Family
ID=15780549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16377979A Pending JPS5687691A (en) | 1979-12-17 | 1979-12-17 | Method and apparatus for plating printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5687691A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4482445A (en) * | 1982-02-22 | 1984-11-13 | The Boeing Company | Methods and apparatus for electrochemically deburring perforate metallic clad dielectric laminates |
| JPH04123261U (en) * | 1991-04-23 | 1992-11-06 | 株式会社アスカエンジニアリング | anode basket |
| JP2016089186A (en) * | 2014-10-30 | 2016-05-23 | 京セラサーキットソリューションズ株式会社 | Electrolytic plating apparatus |
-
1979
- 1979-12-17 JP JP16377979A patent/JPS5687691A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4482445A (en) * | 1982-02-22 | 1984-11-13 | The Boeing Company | Methods and apparatus for electrochemically deburring perforate metallic clad dielectric laminates |
| JPH04123261U (en) * | 1991-04-23 | 1992-11-06 | 株式会社アスカエンジニアリング | anode basket |
| JP2016089186A (en) * | 2014-10-30 | 2016-05-23 | 京セラサーキットソリューションズ株式会社 | Electrolytic plating apparatus |
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